Patents by Inventor Jose A. Osuna
Jose A. Osuna has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240130986Abstract: The present invention relates a method for the use of a product with propyl propane thiosulfonate (PTSO), whose purpose is the treatment and/or prophylaxis of malignant neoplasms such as solid cancers and myeloproliferative syndromes in humans. In a preferred embodiment, the method includes the selection of the PTSO compound which general formula is R-SOa-S-R, where “R” represents the n-propyl group (—CH2—CH2—CH3) and “a” is 2.Type: ApplicationFiled: April 27, 2021Publication date: April 25, 2024Applicant: DMC RESEARCH CENTER, SLInventors: Alberto BAÑOS ARJONA, Enrique GUILLAMÓN AYALA, Nuria MUT SALUD, José Manuel GARRIDO JIMÉNEZ, Antonio OSUNA CARRILLO DE ALBORNOZ, Fernando RODRÍGUEZ SERRANO, Francisco MAROTO CABA
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Patent number: 10189872Abstract: Provided are crystalline forms of nicotinamide riboside, including a Form II of nicotinamide riboside chloride: nicotinamide riboside chloride. Also disclosed are pharmaceutical compositions comprising the crystalline Form II of nicotinamide riboside chloride, and methods of producing such pharmaceutical compositions. In other aspects, the present disclosure pertains to methods comprising administering to a subject the crystalline Form II of nicotinamide riboside chloride. The present disclosure also provides methods of preparing the crystalline Form II of nicotinamide riboside chloride. Also provided are a crystalline Form II of nicotinamide riboside chloride that is prepared according to any of the disclosed methods for preparing the crystalline Form II.Type: GrantFiled: March 3, 2016Date of Patent: January 29, 2019Assignee: W. R. Grace & Co.-ConnInventors: Erik C. Carlson, Jose Osuna
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Publication number: 20180030079Abstract: Provided are crystalline forms of nicotinamide riboside, including a Form II of nicotinamide riboside chloride: nicotinamide riboside chloride. Also disclosed are pharmaceutical compositions comprising the crystalline Form II of nicotinamide riboside chloride, and methods of producing such pharmaceutical compositions. In other aspects, the present disclosure pertains to methods comprising administering to a subject the crystalline Form II of nicotinamide riboside chloride. The present disclosure also provides methods of preparing the crystalline Form II of nicotinamide riboside chloride. Also provided are a crystalline Form II of nicotinamide riboside chloride that is prepared according to any of the disclosed methods for preparing the crystalline Form II.Type: ApplicationFiled: March 3, 2016Publication date: February 1, 2018Applicant: W. R. Grace & Co.-Conn.Inventors: Erik C. Carlson, Jose Osuna
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Patent number: 7645899Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.Type: GrantFiled: September 5, 2006Date of Patent: January 12, 2010Assignee: Henkel CorporationInventors: Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna, Jr.
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Patent number: 7309724Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.Type: GrantFiled: June 10, 2004Date of Patent: December 18, 2007Assignee: Henkel CorporationInventors: Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna, Jr.
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Patent number: 7102015Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.Type: GrantFiled: June 18, 2004Date of Patent: September 5, 2006Assignee: Henkel CorporationInventors: Stephen M Dershem, Dennis B Patterson, Jose A. Osuna, Jr.
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Patent number: 6916856Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.Type: GrantFiled: July 3, 2002Date of Patent: July 12, 2005Assignee: Henkel CorporationInventors: Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna, Jr.
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Publication number: 20050136620Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.Type: ApplicationFiled: June 18, 2004Publication date: June 23, 2005Inventors: Stephen Dershem, Dennis Patterson, Jose Osuna
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Publication number: 20050137277Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.Type: ApplicationFiled: June 10, 2004Publication date: June 23, 2005Inventors: Stephen Dershem, Dennis Patterson, Jose Osuna
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Patent number: 6852814Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applictions, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.Type: GrantFiled: February 25, 2002Date of Patent: February 8, 2005Assignee: Henkel CorporationInventors: Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna, Jr.
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Patent number: 6825245Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.Type: GrantFiled: August 1, 2002Date of Patent: November 30, 2004Assignee: Henkel CorporationInventors: Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna, Jr.
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Patent number: 6790597Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.Type: GrantFiled: August 1, 2002Date of Patent: September 14, 2004Assignee: Henkel CorporationInventors: Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna, Jr.
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Publication number: 20030109666Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applictions, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.Type: ApplicationFiled: August 1, 2002Publication date: June 12, 2003Applicant: Loctite CorporationInventors: Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna
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Publication number: 20030087999Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applictions, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.Type: ApplicationFiled: August 1, 2002Publication date: May 8, 2003Applicant: Loctite CorporationInventors: Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna
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Publication number: 20030060531Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applictions, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.Type: ApplicationFiled: July 3, 2002Publication date: March 27, 2003Inventors: Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna
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Publication number: 20030055121Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applictions, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.Type: ApplicationFiled: July 3, 2002Publication date: March 20, 2003Inventors: Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna
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Publication number: 20020193541Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applictions, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.Type: ApplicationFiled: February 25, 2002Publication date: December 19, 2002Applicant: LoctiteInventors: Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna
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Patent number: 6211320Abstract: In accordance with the present invention, there are provided low viscosity acrylate monomers, and compositions based on same having low moisture resistance (and, hence are much less prone to give rise to “popcorning”), excellent handling properties (i.e., generally existing as a fluid material which does not require the addition of solvent to facilitate the use thereof), and excellent performance properties (e.g., good dielectric properties).Type: GrantFiled: July 28, 1999Date of Patent: April 3, 2001Assignee: Dexter CorporationInventors: Stephen M. Dershem, Jose A. Osuna
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Patent number: 6121358Abstract: In accordance with the present invention, there are provided compositions based on defined hydrophobic vinyl monomers have excellent moisture resistance (and, hence are much less prone to give rise to "popcorning"), excellent handling properties (i.e., generally existing as a fluid material which does not require the addition of solvent to facilitate the use thereof), and excellent performance properties (e.g., good dielectric properties).Type: GrantFiled: September 22, 1997Date of Patent: September 19, 2000Assignee: The Dexter CorporationInventors: Stephen M. Dershem, Jose A. Osuna, Jr.
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Patent number: 6034195Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.Type: GrantFiled: June 2, 1995Date of Patent: March 7, 2000Assignee: Dexter CorporationInventors: Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna, Jr.