Patents by Inventor Jose A. Osuna, Jr.
Jose A. Osuna, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7645899Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.Type: GrantFiled: September 5, 2006Date of Patent: January 12, 2010Assignee: Henkel CorporationInventors: Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna, Jr.
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Patent number: 7309724Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.Type: GrantFiled: June 10, 2004Date of Patent: December 18, 2007Assignee: Henkel CorporationInventors: Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna, Jr.
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Patent number: 7102015Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.Type: GrantFiled: June 18, 2004Date of Patent: September 5, 2006Assignee: Henkel CorporationInventors: Stephen M Dershem, Dennis B Patterson, Jose A. Osuna, Jr.
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Patent number: 6916856Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.Type: GrantFiled: July 3, 2002Date of Patent: July 12, 2005Assignee: Henkel CorporationInventors: Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna, Jr.
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Patent number: 6852814Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applictions, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.Type: GrantFiled: February 25, 2002Date of Patent: February 8, 2005Assignee: Henkel CorporationInventors: Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna, Jr.
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Patent number: 6825245Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.Type: GrantFiled: August 1, 2002Date of Patent: November 30, 2004Assignee: Henkel CorporationInventors: Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna, Jr.
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Patent number: 6790597Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.Type: GrantFiled: August 1, 2002Date of Patent: September 14, 2004Assignee: Henkel CorporationInventors: Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna, Jr.
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Patent number: 6121358Abstract: In accordance with the present invention, there are provided compositions based on defined hydrophobic vinyl monomers have excellent moisture resistance (and, hence are much less prone to give rise to "popcorning"), excellent handling properties (i.e., generally existing as a fluid material which does not require the addition of solvent to facilitate the use thereof), and excellent performance properties (e.g., good dielectric properties).Type: GrantFiled: September 22, 1997Date of Patent: September 19, 2000Assignee: The Dexter CorporationInventors: Stephen M. Dershem, Jose A. Osuna, Jr.
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Patent number: 6034195Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.Type: GrantFiled: June 2, 1995Date of Patent: March 7, 2000Assignee: Dexter CorporationInventors: Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna, Jr.
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Patent number: 6034194Abstract: In accordance with the present invention, there are provided novel adhesive compositions which do not require solvent to provide a system having suitable viscosity for convenient handling and cure rapidly. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and good adhesion to both the substrate and the device attached thereto.Type: GrantFiled: September 2, 1994Date of Patent: March 7, 2000Assignee: Quantum Materials/Dexter CorporationInventors: Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna, Jr.
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Patent number: 5714086Abstract: In accordance with the present invention, there are provided novel propargyl ether-based compositions that are very effective when used in underfill applications. Aromatic propargyl ether compounds are believed to represent the most robust resin chemistry currently available to meet the many performance requirements associated with underfill applications. Propargyl ether resins are hydrophobic, hydrolytically stable, low toxicity monomers that can be cured to high T.sub.g, thermally stable thermosets. Liquid propargyl ether monomers have been found and/or described in the literature which can be used alone or in combination to yield diluent free underfill compositions. Alternatively, mixtures of two or more propargyl ether monomers (wherein one or more of these monomers may be solids at room temperature) can be used to create diluent-free, room temperature stable, eutectic or peritectic liquid resin compositions.Type: GrantFiled: August 9, 1996Date of Patent: February 3, 1998Assignee: Quantum Materials, Inc.Inventors: Jose A. Osuna, Jr., Stephen M. Dershem
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Patent number: 5232962Abstract: An adhesive bonding composition with bond line limiting spacer system includes an adhesive paste composition having a hardenable adhesive component, and a plurality of spacer elements distributed in the adhesive paste composition. The spacer elements are sized to provide a self-limiting bond line thickness between the surfaces to be bonded, the bond line thickness being maintained at a selected lower limit by the spacer elements.Type: GrantFiled: October 9, 1991Date of Patent: August 3, 1993Assignee: Quantum Materials, Inc.Inventors: Stephen M. Dershem, Jose A. Osuna, Jr.