Abstract: A photo-imaged stress management layer for a semiconductor device is described. The stress management layer is located on an outer surface of a semiconductor device and may be patterned to address certain stress compensation requirements of the semiconductor device. The stress management layer may be manufactured onto the semiconductor device using a photolithographic procedure that allows both simple and complex patterns to be realized.

Abstract: Reducing effects of thermal expansion in electronic components. An electronic device can include a support, such as a leadframe. An electronic component can be supported by the support. A first flexible layer can cover the electronic component. A second more rigid layer can cover the first layer. The first layer can be made from a material that is more flexible than the second layer thereby creating a mechanical buffer layer between the second layer and the electronic component such that the electronic component is protected from thermal expansion of the second portion caused by changes in temperature. The electronic component can be a laser. The first and second materials can be selected to disperse an optical emission from the optical transmitter.

Abstract: A photo-imaged stress management layer for a semiconductor device is described. The stress management layer is located on an outer surface of a semiconductor device and may be patterned to address certain stress compensation requirements of the semiconductor device. The stress management layer may be manufactured onto the semiconductor device using a photolithographic procedure that allows both simple and complex patterns to be realized.

Abstract: An electrostatic discharge (ESD) protected semiconductor device. The semiconductor device is formed as a monolithic structure. The monolithic structure includes a vertical cavity surface emitting laser (VCSEL) and a protection diode. The protection diode cathode is electrically coupled to the VCSEL anode and the protection diode anode is electrically coupled to the VCSEL cathode so as to provide ESD protection to the VCSEL.

Abstract: Reflective optical sensors. A reflective optical sensor for sensing the presence of an object can include a reflective sensor package having a first cavity and a second cavity. The first and second cavities can be located side-by-side in the sensor package. a vertical cavity surface emitting laser (VCSEL) can be located within the first cavity for producing an optical emission. An optical receiver can be located within the second cavity and configured to receive at least a portion of the produced optical emission that is reflected from the object such that when the reflected emission is above a threshold strength the object is determined to be present. The optical receiver can be a shunt phototransistor and can include reverse bias protection.

Abstract: Transceivers, networks, and methods for providing data communication to electrical devices in a vehicle, and a vehicle comprising the transceiver and network. A transceiver of the network can include a receive optical subassembly including an opto-electronic transducer configured to receive a first incoming optical signal from an optical fiber having a silica based core. Signal extraction circuitry is configured to extract data intended for an electrical device from of the incoming optical signal and provide the extracted data to the electrical device, and a transmit optical subassembly comprising a laser, such as a VCSEL, configured to transmit an outgoing optical signal to a second optical fiber having a silica based core.

Abstract: Optical fiber interfaces, apparatuses including the optical fiber interfaces, and methods for manufacturing the optical fiber interfaces. Optical fiber interfaces comprise a cup piece and a base piece. The cup piece includes an open first end for receiving an optical fiber end, and a second end includes an aligning protrusion. The base piece includes a top surface with an aligning cavity and an active optical device coupled to the base piece. The cup piece may be attached to the base piece. The base piece may be part of an outer housing portion of a transceiver or other optical component. The base piece may include a molded-in optical fiber interface and the cup piece may include a clearance cavity. A method for making the optical fiber includes locating the center of the active optical device and manufacturing the aligning cavity into the top surface of the base piece.