Abstract: Cooling provided by a thermal management system may be controlled actively to reduce or prevent entering a dry out state. The systems and methods described herein include monitoring temperature metrics and identifying or predicting the onset of a dry out state, and temperature modulation mechanism may be controlled to cause an increase in the temperature of the heat pipe or vapor chamber. By controlling a temperature modulation mechanism to increase the operating temperature, the viscosity of the liquid in the thermal management approach is decreased, which improves its capillary flow and return rate back to the evaporator. By leveraging this temperature-dependent behavior, this thermal control approach may restore cooling capacity by managing the thermal management approach temperature due to a dry out state, and reduce or minimize the computing device performance degradation associated with a dry out state.