Patents by Inventor Jose B. San Andres

Jose B. San Andres has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for delivering power to high performance electronic assemblies
    Patent number: 6618268
    Abstract: A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circuit board second conductive surface is described. The apparatus comprises a first conductive member, including a first end having a first conductive member surface electrically coupleable to the first circuit board first conductive surface and a second end distal from the first end having a first conductive member second surface electrically coupleable to the second circuit board first surface.
    Type: Grant
    Filed: March 8, 2001
    Date of Patent: September 9, 2003
    Assignee: Incep Technologies, Inc.
    Inventors: Joseph T. Dibene, II, David H. Hartke, Edward J. Derian, Carl E. Hoge, James M. Broder, Jose B. San Andres, Joseph S. Riel
  • High performance thermal/mechanical interface for fixed-gap references for high heat flux and power semiconductor applications
    Publication number: 20020015288
    Abstract: ? A thermal mechanical interface usable between a heatsink and a heat dissipating device is disclosed. In one embodiment, the thermal mechanical interface comprises a thermally conductive mechanically resilient member having a corrugated cross section and a first thermal conductance, disposed between the heat sink and the heat dissipating device and a thermal interface material having a second thermal conductance, disposed within the corrugated cross section.
    Type: Application
    Filed: July 20, 2001
    Publication date: February 7, 2002
    Inventors: Joseph T. Dibene, David H. Hartke, Wendell C. Johnson, Farhad Raiszadeh, Edward J. Derian, Jose B. San Andres
  • Method and apparatus for delivering power to high performance electronic assemblies
    Publication number: 20010036066
    Abstract: A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circuit board second conductive surface is described. The apparatus comprises a first conductive member, including a first end having a first conductive member surface electrically coupleable to the first circuit board first conductive surface and a second end distal from the first end having a first conductive member second surface electrically coupleable to the second circuit board first surface.
    Type: Application
    Filed: March 8, 2001
    Publication date: November 1, 2001
    Inventors: Joseph T. Dibene, David H. Hartke, Edward J. Derian, Carl E. Hoge, James M. Broder, Jose B. San Andres, Joseph S. Riel