Patents by Inventor Jose Daniel Carlos TORRES

Jose Daniel Carlos TORRES has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuits with conductive bumps having a profile with a wave pattern
    Patent number: 11855027
    Abstract: An article of manufacture comprises: an integrated circuit having a contact; a conductive bump electrically coupled to the contact, the conductive bump having a profile with a wave pattern; a lead frame electrically coupled to the conductive bump; and an integrated circuit package mold, the integrated circuit package mold covering portions of the conductive bump and the lead frame.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: December 26, 2023
    Assignee: Texas Instruments Incorporated
    Inventors: Jose Daniel Carlos Torres, Ruby Ann Merto Camenforte
  • INTEGRATED CIRCUITS WITH CONDUCTIVE BUMPS HAVING A PROFILE WITH A WAVE PATTERN
    Publication number: 20210082851
    Abstract: An article of manufacture comprises: an integrated circuit having a contact; a conductive bump electrically coupled to the contact, the conductive bump having a profile with a wave pattern; a lead frame electrically coupled to the conductive bump; and an integrated circuit package mold, the integrated circuit package mold covering portions of the conductive bump and the lead frame.
    Type: Application
    Filed: November 24, 2020
    Publication date: March 18, 2021
    Inventors: Jose Daniel Carlos TORRES, Ruby Ann Merto CAMENFORTE
  • Integrated circuits with conductive bumps having a profile with a wave pattern
    Patent number: 10847483
    Abstract: An article of manufacture comprises: an integrated circuit having a contact; a conductive bump electrically coupled to the contact, the conductive bump having a profile with a wave pattern; a lead frame electrically coupled to the conductive bump; and an integrated circuit package mold, the integrated circuit package mold covering portions of the conductive bump and the lead frame.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: November 24, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Jose Daniel Carlos Torres, Ruby Ann Merto Camenforte
  • INTEGRATED CIRCUITS WITH CONDUCTIVE BUMPS HAVING A PROFILE WITH A WAVE PATTERN
    Publication number: 20200075523
    Abstract: An article of manufacture comprises: an integrated circuit having a contact; a conductive bump electrically coupled to the contact, the conductive bump having a profile with a wave pattern; a lead frame electrically coupled to the conductive bump; and an integrated circuit package mold, the integrated circuit package mold covering portions of the conductive bump and the lead frame.
    Type: Application
    Filed: August 29, 2018
    Publication date: March 5, 2020
    Inventors: Jose Daniel Carlos TORRES, Ruby Ann Merto CAMENFORTE