Patents by Inventor Jose Delvalle

Jose Delvalle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8971045
    Abstract: A module is electrically connectable to a computer system. The module includes an edge connector with a plurality of electrical contacts electrically connectable to the computer system, at least one layer of thermally conductive material thermally coupled to the edge connector, and first and second printed circuit boards each having a plurality of integrated circuit components that are electrically coupled to the edge connector and thermally coupled to the at least one layer of thermally conductive material. The at least one layer of thermally conductive material are disposed between the first and second printed circuit boards.
    Type: Grant
    Filed: December 30, 2012
    Date of Patent: March 3, 2015
    Assignee: NETLIST, Inc.
    Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
  • Patent number: 8345427
    Abstract: A module is electrically connectable to a computer system. The module includes a first surface and a first plurality of circuit packages coupled to the first surface. The module further includes a second surface and a second plurality of circuit packages coupled to the second surface. The second surface faces the first surface. The module further includes at least one thermal conduit positioned between the first surface and the second surface. The at least one thermal conduit is in thermal communication with the first plurality of circuit packages and the second plurality of circuit packages.
    Type: Grant
    Filed: November 4, 2010
    Date of Patent: January 1, 2013
    Assignee: Netlist, Inc.
    Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
  • Publication number: 20110110047
    Abstract: A module is electrically connectable to a computer system. The module includes a first surface and a first plurality of circuit packages coupled to the first surface. The module further includes a second surface and a second plurality of circuit packages coupled to the second surface. The second surface faces the first surface. The module further includes at least one thermal conduit positioned between the first surface and the second surface. The at least one thermal conduit is in thermal communication with the first plurality of circuit packages and the second plurality of circuit packages.
    Type: Application
    Filed: November 4, 2010
    Publication date: May 12, 2011
    Applicant: Netlist, Inc.
    Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
  • Patent number: 7839645
    Abstract: A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first surface and a first plurality of circuits coupled to the first surface. The first plurality of circuits is in electrical communication with the electrical contacts. The module further includes a second surface and a second plurality of circuits coupled to the second surface. The second plurality of circuits is in electrical communication with the electrical contacts. The second surface faces the first surface. The module further includes at least one thermally conductive layer positioned between the first surface and the second surface. The at least one thermally conductive layer is in thermal communication with the first plurality of circuits, the second plurality of circuits, and a first set of the plurality of electrical contacts.
    Type: Grant
    Filed: October 26, 2009
    Date of Patent: November 23, 2010
    Assignee: Netlist, Inc.
    Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
  • Publication number: 20100110642
    Abstract: A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first surface and a first plurality of circuits coupled to the first surface. The first plurality of circuits is in electrical communication with the electrical contacts. The module further includes a second surface and a second plurality of circuits coupled to the second surface. The second plurality of circuits is in electrical communication with the electrical contacts. The second surface faces the first surface. The module further includes at least one thermally conductive layer positioned between the first surface and the second surface. The at least one thermally conductive layer is in thermal communication with the first plurality of circuits, the second plurality of circuits, and a first set of the plurality of electrical contacts.
    Type: Application
    Filed: October 26, 2009
    Publication date: May 6, 2010
    Applicant: Netlist, Inc.
    Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
  • Patent number: 7630202
    Abstract: A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first substrate which has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second substrate which has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second substrate faces the first surface of the first substrate. The module further includes at least one thermally conductive layer positioned between the first plurality of components and the second plurality of components.
    Type: Grant
    Filed: March 20, 2008
    Date of Patent: December 8, 2009
    Assignee: Netlist, Inc.
    Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
  • Publication number: 20080316712
    Abstract: A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first substrate which has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second substrate which has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second substrate faces the first surface of the first substrate. The module further includes at least one thermally conductive layer positioned between the first plurality of components and the second plurality of components.
    Type: Application
    Filed: March 20, 2008
    Publication date: December 25, 2008
    Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
  • Patent number: 7375970
    Abstract: A module is electrically connectable to a computer system. The module includes at least one multilayer structure having a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first printed circuit board coupled to the at least one multilayer structure. The first printed circuit board has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second printed circuit board coupled to the at least one multilayer structure. The second printed circuit board has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second printed circuit board faces the first surface of the first printed circuit board.
    Type: Grant
    Filed: July 9, 2007
    Date of Patent: May 20, 2008
    Assignee: Netlist, Inc.
    Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
  • Publication number: 20080007921
    Abstract: A module is electrically connectable to a computer system. The module includes at least one multilayer structure having a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first printed circuit board coupled to the at least one multilayer structure. The first printed circuit board has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second printed circuit board coupled to the at least one multilayer structure. The second printed circuit board has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second printed circuit board faces the first surface of the first printed circuit board.
    Type: Application
    Filed: July 9, 2007
    Publication date: January 10, 2008
    Inventors: Robert Pauley, Jayesh Bhakta, William Gervasi, Chi Chen, Jose Delvalle
  • Patent number: 7254036
    Abstract: A module is electrically connectable to a computer system. The module includes a frame having an edge connector with a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first printed circuit board coupled to the frame. The first printed circuit board has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is electrically coupled to the electrical contacts of the edge connector. The module further includes a second printed circuit board coupled to the frame. The second printed circuit board has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is electrically coupled to the electrical contacts of the edge connector. The second surface of the second printed circuit board faces the first surface of the first printed circuit board.
    Type: Grant
    Filed: April 7, 2005
    Date of Patent: August 7, 2007
    Assignee: Netlist, Inc.
    Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
  • Publication number: 20060044749
    Abstract: A module is electrically connectable to a computer system. The module includes a frame having an edge connector with a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first printed circuit board coupled to the frame. The first printed circuit board has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is electrically coupled to the electrical contacts of the edge connector. The module further includes a second printed circuit board coupled to the frame. The second printed circuit board has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is electrically coupled to the electrical contacts of the edge connector. The second surface of the second printed circuit board faces the first surface of the first printed circuit board.
    Type: Application
    Filed: April 7, 2005
    Publication date: March 2, 2006
    Inventors: Robert Pauley, Jayesh Bhakta, William Gervasi, Chi Chen, Jose Delvalle