Patents by Inventor Jose Delvalle
Jose Delvalle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8971045Abstract: A module is electrically connectable to a computer system. The module includes an edge connector with a plurality of electrical contacts electrically connectable to the computer system, at least one layer of thermally conductive material thermally coupled to the edge connector, and first and second printed circuit boards each having a plurality of integrated circuit components that are electrically coupled to the edge connector and thermally coupled to the at least one layer of thermally conductive material. The at least one layer of thermally conductive material are disposed between the first and second printed circuit boards.Type: GrantFiled: December 30, 2012Date of Patent: March 3, 2015Assignee: NETLIST, Inc.Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
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Patent number: 8345427Abstract: A module is electrically connectable to a computer system. The module includes a first surface and a first plurality of circuit packages coupled to the first surface. The module further includes a second surface and a second plurality of circuit packages coupled to the second surface. The second surface faces the first surface. The module further includes at least one thermal conduit positioned between the first surface and the second surface. The at least one thermal conduit is in thermal communication with the first plurality of circuit packages and the second plurality of circuit packages.Type: GrantFiled: November 4, 2010Date of Patent: January 1, 2013Assignee: Netlist, Inc.Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
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Publication number: 20110110047Abstract: A module is electrically connectable to a computer system. The module includes a first surface and a first plurality of circuit packages coupled to the first surface. The module further includes a second surface and a second plurality of circuit packages coupled to the second surface. The second surface faces the first surface. The module further includes at least one thermal conduit positioned between the first surface and the second surface. The at least one thermal conduit is in thermal communication with the first plurality of circuit packages and the second plurality of circuit packages.Type: ApplicationFiled: November 4, 2010Publication date: May 12, 2011Applicant: Netlist, Inc.Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
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Patent number: 7839645Abstract: A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first surface and a first plurality of circuits coupled to the first surface. The first plurality of circuits is in electrical communication with the electrical contacts. The module further includes a second surface and a second plurality of circuits coupled to the second surface. The second plurality of circuits is in electrical communication with the electrical contacts. The second surface faces the first surface. The module further includes at least one thermally conductive layer positioned between the first surface and the second surface. The at least one thermally conductive layer is in thermal communication with the first plurality of circuits, the second plurality of circuits, and a first set of the plurality of electrical contacts.Type: GrantFiled: October 26, 2009Date of Patent: November 23, 2010Assignee: Netlist, Inc.Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
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Publication number: 20100110642Abstract: A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first surface and a first plurality of circuits coupled to the first surface. The first plurality of circuits is in electrical communication with the electrical contacts. The module further includes a second surface and a second plurality of circuits coupled to the second surface. The second plurality of circuits is in electrical communication with the electrical contacts. The second surface faces the first surface. The module further includes at least one thermally conductive layer positioned between the first surface and the second surface. The at least one thermally conductive layer is in thermal communication with the first plurality of circuits, the second plurality of circuits, and a first set of the plurality of electrical contacts.Type: ApplicationFiled: October 26, 2009Publication date: May 6, 2010Applicant: Netlist, Inc.Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
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Patent number: 7630202Abstract: A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first substrate which has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second substrate which has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second substrate faces the first surface of the first substrate. The module further includes at least one thermally conductive layer positioned between the first plurality of components and the second plurality of components.Type: GrantFiled: March 20, 2008Date of Patent: December 8, 2009Assignee: Netlist, Inc.Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
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Publication number: 20080316712Abstract: A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first substrate which has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second substrate which has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second substrate faces the first surface of the first substrate. The module further includes at least one thermally conductive layer positioned between the first plurality of components and the second plurality of components.Type: ApplicationFiled: March 20, 2008Publication date: December 25, 2008Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
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Patent number: 7375970Abstract: A module is electrically connectable to a computer system. The module includes at least one multilayer structure having a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first printed circuit board coupled to the at least one multilayer structure. The first printed circuit board has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second printed circuit board coupled to the at least one multilayer structure. The second printed circuit board has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second printed circuit board faces the first surface of the first printed circuit board.Type: GrantFiled: July 9, 2007Date of Patent: May 20, 2008Assignee: Netlist, Inc.Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
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Publication number: 20080007921Abstract: A module is electrically connectable to a computer system. The module includes at least one multilayer structure having a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first printed circuit board coupled to the at least one multilayer structure. The first printed circuit board has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second printed circuit board coupled to the at least one multilayer structure. The second printed circuit board has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second printed circuit board faces the first surface of the first printed circuit board.Type: ApplicationFiled: July 9, 2007Publication date: January 10, 2008Inventors: Robert Pauley, Jayesh Bhakta, William Gervasi, Chi Chen, Jose Delvalle
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Patent number: 7254036Abstract: A module is electrically connectable to a computer system. The module includes a frame having an edge connector with a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first printed circuit board coupled to the frame. The first printed circuit board has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is electrically coupled to the electrical contacts of the edge connector. The module further includes a second printed circuit board coupled to the frame. The second printed circuit board has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is electrically coupled to the electrical contacts of the edge connector. The second surface of the second printed circuit board faces the first surface of the first printed circuit board.Type: GrantFiled: April 7, 2005Date of Patent: August 7, 2007Assignee: Netlist, Inc.Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
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Publication number: 20060044749Abstract: A module is electrically connectable to a computer system. The module includes a frame having an edge connector with a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first printed circuit board coupled to the frame. The first printed circuit board has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is electrically coupled to the electrical contacts of the edge connector. The module further includes a second printed circuit board coupled to the frame. The second printed circuit board has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is electrically coupled to the electrical contacts of the edge connector. The second surface of the second printed circuit board faces the first surface of the first printed circuit board.Type: ApplicationFiled: April 7, 2005Publication date: March 2, 2006Inventors: Robert Pauley, Jayesh Bhakta, William Gervasi, Chi Chen, Jose Delvalle