Patents by Inventor Jose F. Olivas

Jose F. Olivas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6345097
    Abstract: A portable phone has a cavity at one end in which a hinge pin is rotatably mounted, with opposite ends of the hinge pin releasably secured to a flip panel rotatable between a closed position extending over part of one face of the phone, and an open position. The hinge pin includes a cam formation, and a biasing spring secured in the cavity has a bearing portion acting against the cam portion to releasably retain the flip panel in its open and closed positions. A cam retainer is mounted in the cavity to extend over the hinge pin and resist bending of the hinge pin out of a straight, axial orientation.
    Type: Grant
    Filed: December 7, 1998
    Date of Patent: February 5, 2002
    Assignee: QUALCOMM Incorporated
    Inventors: Thomas J. Chintala, Jose F. Olivas, Paul J. Smith, Sean Moran, James Beckwith
  • Patent number: 6157717
    Abstract: A snap hinge assembly for rotatably connecting a flip cover to a portable phone housing has only two parts, a hinge pin and a spring. The hinge pin is rotatably mounted in the housing and secured to the cover so as to rotate with the cover as it is opened and closed, and has a cam portion for engaging the spring. The spring is anchored in the housing and has a bearing portion for bearing against the cam portion as the pin rotates with the cover. The shape of the cam portion is such that the bearing portion is resiliently biased as the hinge pin rotates, and released at a predetermined orientation so as to snap the cover into either the open or closed position, depending on the direction of rotation of the pin. The cover is held by the engaging spring and cam surfaces in the open or closed position until positively urged towards the opposite end position.
    Type: Grant
    Filed: March 19, 1998
    Date of Patent: December 5, 2000
    Assignee: Qualcomm Incorporated
    Inventors: Thomas J. Chintala, Jose F. Olivas, Martin J. Kimbell, Miguel A. Cano, Jr.
  • Patent number: 6148079
    Abstract: A hinge apparatus has relatively rotatable first and second parts, one of which is adapted to be secured to the phone housing and the other of which is adapted to be secured to a cover. One of the parts comprises a cam and the other comprises a follower, the cam having end stops corresponding to an open and a closed position of the cover relative to the housing, and a convex surface between the end stops to provide initial resistance to rotation of the cover out of the open and closed positions. The parts are spring loaded such that the cover is snapped into the open and closed positions, respectively, once the follower passes the arcuate surface of the cam.
    Type: Grant
    Filed: March 19, 1998
    Date of Patent: November 14, 2000
    Assignee: Qualcomm Incorporated
    Inventors: Thomas J. Chintala, Jose F. Olivas, Martin J. Kimbell, Miguel A. Cano, Jr.
  • Patent number: 5997314
    Abstract: A connector interface provides direct connection from a wireless communication device to a coaxial connector. The wireless communication device has a housing with an antenna connector. The antenna connector has a hollow pseudo-cylindrical center providing an opening through the housing. The connector interface has a custom connector comprised of an outer conductive shell, a nonconductive spacer and a ground probe. The outer conductive shell is mounted on the printed circuit board. The nonconductive spacer is disposed within the hollow pseudo-cylindrical center of the outer conductive shell. When the connector interface is connected to the wireless communication device, the outer conductive shell contacts the antenna connector and the ground probe extends through the opening into the housing to connect electrically to a ground potential within the housing.
    Type: Grant
    Filed: December 15, 1997
    Date of Patent: December 7, 1999
    Assignees: Qualcomm Incorporated, Sony Electronics Inc.
    Inventors: Raymond C. Wallace, Jose F. Olivas, Susan M. Tidwell, Roger W. Berg, Thomas A. Pitta, Darrin Marthens
  • Patent number: 5917708
    Abstract: An EMI shielding apparatus has an outer peripheral wall extending around a combined area of predetermined shape and dimensions for enclosing at least two adjacent areas on a printed wiring board to be shielded from one another. A single transverse wall extends between opposing portions of the peripheral wall to divide the combined area into the two adjacent sub-areas to be shielded from one another. The single transverse wall is of single wall thickness, reducing the EMI shield footprint. The peripheral wall and transverse wall may be formed integrally as one frame, or from two or more adjacent sub-frames.
    Type: Grant
    Filed: March 24, 1997
    Date of Patent: June 29, 1999
    Assignee: Qualcomm Incorporated
    Inventors: Sean A. Moran, Jose F. Olivas, Thomas J. Chintala
  • Patent number: 5844784
    Abstract: A combined EMI shield and brace assembly has at least two frames for placing side-by-side on a printed wiring board to surround predetermined adjacent areas on the board containing components to be shielded from one another, and a brace member securing the two frames together during reflow. Each frame has a peripheral side wall forming an enclosed area of predetermined shape and dimensions and a portion of the side wall of one frame is placed against a portion of the side wall of the other frame so that the two frames together form an enlarged enclosed area divided into two sub-areas by the adjacent side wall portions extending across the enlarged area. The brace member extends over the frames and is secured to their side walls, and may secure two or more frames together.
    Type: Grant
    Filed: March 24, 1997
    Date of Patent: December 1, 1998
    Assignee: Qualcomm Incorporated
    Inventors: Sean A. Moran, Jose F. Olivas, Thomas J. Chintala
  • Patent number: 5234348
    Abstract: An RF backplane for interconnecting a plurality of electronic components. The backplane is housed in a rack which is installed in a vehicle such as an airplane. The backplane includes a fixed frame fixedly mounted in the rack and at least one removable frame aligned with and removably attached to the fixed frame. Upon removal of the removable frame and electronic components attached thereto, complete access is afforded to the backplane and various components interconnected thereto without removal of the rack from the vehicle.
    Type: Grant
    Filed: May 21, 1992
    Date of Patent: August 10, 1993
    Assignee: TRW Inc.
    Inventors: Francis X. Konsevich, Jose F. Olivas
  • Patent number: D413117
    Type: Grant
    Filed: February 20, 1998
    Date of Patent: August 24, 1999
    Assignee: Qualcomm Incorporated
    Inventors: Thomas J. Chintala, Jose F. Olivas, Paul E. Jacobs, Gina M. Lombardi, Robert W. Howe, Stanley T. Scheufler, John J. Wendorff, Stephen G. Miggels, David C. Stowers