Abstract: Interconnected substrate arrays, microelectronic packages, and methods for fabricating microelectronic packages for fabricating microelectronic packages utilizing interconnected substrate arrays containing integrated electrostatic discharge (ESD) protection grids are provided. In an embodiment, the method includes obtaining an interconnected substrate array having an integrated ESD protection grid. The ESD protection grid includes, in turn, ESD grid lines at least partially formed in singulation streets of an interconnected substrate array and electrically coupling die attachment regions of the substrate array to one or more peripheral machine ground contacts. Array-level fabrication steps are performed to produce an interconnected package array utilizing the interconnected substrate array, while electrically coupling the die attachment regions to electrical ground through the ESD protection grid during at least one of the array-level fabrication steps.

Abstract: Interconnected substrate arrays, microelectronic packages, and methods for fabricating microelectronic packages for fabricating microelectronic packages utilizing interconnected substrate arrays containing integrated electrostatic discharge (ESD) protection grids are provided. In an embodiment, the method includes obtaining an interconnected substrate array having an integrated ESD protection grid. The ESD protection grid includes, in turn, ESD grid lines at least partially formed in singulation streets of an interconnected substrate array and electrically coupling die attachment regions of the substrate array to one or more peripheral machine ground contacts. Array-level fabrication steps are performed to produce an interconnected package array utilizing the interconnected substrate array, while electrically coupling the die attachment regions to electrical ground through the ESD protection grid during at least one of the array-level fabrication steps.

Abstract: A die crack detector and method are provided. A first metal trace is formed over a substrate with the first metal trace configured to extend around a perimeter of a semiconductor die. A second metal trace is formed over the first metal trace with the second metal trace configured to overlap the first metal trace. A dielectric material is disposed between the first and second metal traces. A first detector terminal is coupled to the first metal trace and a second detector terminal coupled to the second metal trace. The detector terminals are configured to receive a predetermined voltage.

Abstract: A die crack detector and method are provided. A first metal trace is formed over a substrate with the first metal trace configured to extend around a perimeter of a semiconductor die. A second metal trace is formed over the first metal trace with the second metal trace configured to overlap the first metal trace. A dielectric material is disposed between the first and second metal traces. A first detector terminal is coupled to the first metal trace and a second detector terminal coupled to the second metal trace. The detector terminals are configured to receive a predetermined voltage.

Abstract: Methods and systems for achieving semiconductor-based circuits or systems having multiple components with one or more matched or similar characteristics or features are disclosed herein. In one example embodiment, a system includes a processing device that includes first, second, and third circuitry. The first circuitry is configured to generate control signals that at least indirectly cause a pick and place head mechanism to attempt to pick up and place at least some of first and second dice. The second circuitry is configured to assess whether attempts to implement one or more of first and second dice should be skipped based upon wafer map information. Further, the third circuitry is configured to determine whether a second position of a first one of the second dice is sufficiently proximate to a first position so that it would be appropriate to implement the first one of the second dice.

Abstract: A control system and method for automatically and seamlessly providing optimal power and/or voltage levels to an integrated, connected or other designated light assembly. In particular, the control system comprises corresponding boost, buck and feedback circuitry cooperatively utilized to intelligently increase, decrease or maintain the signal or power delivered to the light assembly at an optimal level, thereby increasing efficiency and productivity of the light assembly and allowing the light assembly to operate even in the event of a severely degraded signal due to resistance or impedance resulting from a lengthy power wire or other factors.

Abstract: A control system and method for automatically and seamlessly providing optimal power and/or voltage levels to an integrated, connected or other designated light fixture. In particular, the control system comprises corresponding boost, buck and feedback circuitry cooperatively utilized to intelligently increase, decrease or maintain the signal or power delivered to the light fixture at an optimal level, thereby increasing efficiency and productivity of the light fixture and allowing the light fixture to operate even in the event of a severely degraded signal due to resistance or impedance resulting from a lengthy power wire or other factors.

Abstract: The invention relates to a packaging for syringe barrels, wherein the packaging has a thermoformed tray (1) which is provided with a plurality of compartments (2) for receiving the syringe barrels (3). The packaging according to the invention has in comparison with a conventional packaging the advantages that disposal of a single type of material and recycling are possible, that packaging material is saved and that the weight and volume of the packaging are reduced.