Abstract: A socket assembly used in an electronic component test apparatus for testing a device under test (DUT) having a first device antenna, includes a socket in which the DUT is mounted, a pressing portion, disposed between an antenna unit and the socket, that presses the DUT toward the socket, the antenna unit having a first measuring antenna opposed to the socket, and a reinforcement frame on which the pressing portion is stacked. A material in the pressing portion has a lower dielectric constant than a material in the reinforcement frame.

Abstract: An embodiment according to the invention comprises a pusher for use in an automated test equipment to mechanically push a device under test, DUT, comprising an antenna or an antenna array into a DUT socket. The pusher comprise relatively higher permittivity dielectric regions and relatively lower permittivity dielectric regions. The relatively higher permittivity dielectric regions and the relatively lower permittivity dielectric regions are forming a structure of higher permittivity dielectric predominantly parallel columns, e.g., rods or pillars or poles, with lower permittivity dielectric regions between these columns. Alternatively, the relatively higher permittivity dielectric regions and the relatively lower permittivity dielectric regions are forming a structure of a higher permittivity dielectric block with lower permittivity dielectric predominantly parallel filled or unfilled holes.

Abstract: An embodiment according to the invention has a pusher for use in an automated test equipment (ATE) to mechanically push a device under test having an antenna or an antenna array into a DUT socket. The pusher has a structure, in which there are alternating parallel layers of relatively higher dielectric permittivity and relatively lower dielectric permittivity. The layers of higher dielectric permittivity and lower dielectric permittivity extend in a first direction, which is within ±45° of a pushing direction.

Abstract: A high frequency power divider circuit for distributing an input signal to two or more signal output ports, comprising: a rat race coupler, wherein the rat race coupler is configured to couple an input signal provided at an input port of the rat race coupler to a first output of the rat race coupler and to a second output of the rat race coupler; a first coupling structure coupled to the first output of the rat race coupler, to couple the first output of the rat race coupler with a first signal output port; and a second coupling structure coupled to the second output of the rat race coupler, to couple the second output of the rat race coupler with a second signal output port; wherein a characteristic impedance of a first transmission line portion between the input port and the first output of the rat race coupler deviates from a nominal ring impedance of the rat race coupler in a first direction, and wherein a characteristic impedance of a second transmission line portion between the input port and the second

Abstract: The invention relates to a test arrangement for over-the-air testing an angled device under test, wherein the test arrangement comprises a carrier structure and a device-under-test socket which is coupled to the carrier structure. The device-under-test socket is configured to establish an electrical contact with an inner surface of the angled device under test or with a connector which is arranged on the inner surface of the angled device under test. The carrier structure comprises an opening extending away from the device-under-test socket in a direction of an outward surface normal of a first outer surface of the angled device-under-test.

Abstract: The invention relates to a test arrangement for over-the-air testing an angled device under test, wherein the test arrangement comprises a carrier structure. The test arrangement comprises a device-under-test socket which is coupled to the carrier structure, wherein the device-under-test socket is configured to establish an electrical contact with an inner surface of the angled device under test or with a connector which is arranged on the inner surface of the angled device under test. The device-under-test socket is configured to position the angled device-under-test such that a first outer surface of the angled device-under-test is tilted by at least 15 degrees with respect to a surface of the carrier structure.

Abstract: Devices for testing a DUT having a circuit coupled to an antenna are disclose. The device can include a DUT location for receiving a DUT, and an adapter or probe is used to wirelessly “over-the-air” (OTA) electronically test a DUT with an embedded antenna or antenna array with the measurement probe 140 located in close proximity to the DUT. The probe can be located very close to the DUT (e.g., in the near-field region). Although the probe is located in close proximity to the DUT antenna or antenna array elements it does not significantly disturb or interfere with probe during testing.

Abstract: A hybrid panel method of (and apparatus for) manufacturing electronic devices, and electronic devices manufactured thereby. As non-limiting examples, various aspects of this disclosure provide an apparatus for manufacturing an electronic device, where the apparatus is operable to, at least, receive a panel to which a subpanel is coupled, cut around a subpanel through a layer of material, and remove such subpanel from the panel. The apparatus may also, for example, be operable to couple to an upper side of the subpanel, and remove the subpanel from the panel by, at least in part, operating to rotate the subpanel relative to the panel.

Abstract: Embodiments according to the disclosure have a measurement arrangement for an automated test equipment (ATE), for determining a beamforming characteristic of a device under test (DUT), wherein the measurement arrangement is adapted to carry an antenna and wherein the measurement arrangement is configured to manipulate position of the antenna relative to the DUT, to allow for a determination of the beamforming characteristic of the DUT when the DUT is coupled to a load board, and when the load board is electrically coupled to a test head of the ATE. Furthermore, the measurement arrangement is configured to be attached to the test head of the ATE or to a load board frame attached to the test head of the ATE.

Abstract: Disclosed are apparatuses and methods for fabricating the apparatuses. In one aspect, an apparatus includes a high-power die mounted on a backside of a package substrate. A heat transfer layer is disposed on the backside of the high-power die. A plurality of heat sink interconnects is coupled to the heat transfer layer. The plurality of heat sink interconnects is located adjacent the high-power die in a horizontal direction.

Abstract: Disclosed are apparatuses and methods for fabricating the apparatuses. In one aspect, an apparatus includes a high-power die mounted on a backside of a package substrate. A heat transfer layer is disposed on the backside of the high-power die. A plurality of heat sink interconnects is coupled to the heat transfer layer, where each of the plurality of heat sink interconnects is directly coupled to the heat transfer layer in a vertical orientation.

Abstract: A hybrid panel method of (and apparatus for) manufacturing electronic devices, and electronic devices manufactured thereby. As non-limiting examples, various aspects of this disclosure provide an apparatus for manufacturing an electronic device, where the apparatus is operable to, at least, receive a panel to which a subpanel is coupled, cut around a subpanel through a layer of material, and remove such subpanel from the panel. The apparatus may also, for example, be operable to couple to an upper side of the subpanel, and remove the subpanel from the panel by, at least in part, operating to rotate the subpanel relative to the panel.

Abstract: Embodiments according to the disclosure comprise an automated test equipment component, ATE component, e.g., a handler component, e.g., a handler arm, comprising a first antenna adapted to establish a wireless, e.g., near field, coupling with a device under test (DUT), e.g., comprising an antenna, e.g., comprising an antenna array, when the DUT is arranged on a loadboard, e.g., a DUT loadboard. Furthermore, the ATE component comprises a second antenna for establishing a wireless, e.g., near field, coupling with a characterizing device, e.g., a golden device, e.g., comprising an antenna, e.g., comprising an antenna array, when the characterizing device is arranged, e.g., placed, on the loadboard, wherein the DUT and the characterizing device are, for example, placed at different positions on the DUT loadboard. Moreover, the first antenna is electrically coupled, e.g., connected with a rigid electrical connection, with the second antenna, to allow for a forwarding of a signal, e.g.

Abstract: An embodiment provides a measurement arrangement for characterizing a radio frequency arrangement comprising a plurality of antennas. Measurement arrangement comprises a dielectric waveguide slab with a plurality of frequency converting structures, arranged in or on the dielectric waveguide slab. Measurement arrangement further comprises a plurality of waveguide transitions arranged at different positions of the dielectric waveguide slab and are coupled to respective radio frequency components. Radio frequency components are configured to transmit and/or receive radio signals. Frequency converting structures are associated with respective antennas of the plurality of antennas, and are configured to perform a frequency conversion on signals received, resulting in frequency-converted signals.

Abstract: The invention relates to a probe card (PC) for use with an automatic test equipment (ATE), wherein the probe card (PC) comprises a probe head (PH) on a first side thereof, and wherein the probe card (PC) is adapted to be attached to an interface (IF) and wherein the probe card (PC) comprises a plurality of contact pads on a second side in a region opposing at least a region of the interface (IF), arranged to contact a plurality of contacts of the interface (IF), and wherein the probe card (PC) comprises one or more coaxial connectors (CCPT) arranged to mate with one or more corresponding coaxial connectors (CCPT) of the interface (IF). The invention relates further to pogo tower (PT) for connecting a wafer probe interface (WPI) of an automatic test equipment with the probe card (PC).

Abstract: Embodiments of the present invention provide systems and methods for performing tests on a device under test (DUT) based on training data derived from a set of training DUTs using nearfield measurement data. Nearfield measurement data can be mapped to performance metrics that approximate performance metrics derived from the far-field measurement data. Nearfield measurements can then be performed on a DUT to generate second nearfield measurement data, and performance metrics of the DUT are generated using the second nearfield measurement data and the mapped performance metrics derived from the training DUTs.

Abstract: Devices for testing a DUT having a circuit coupled to an antenna are disclose. The device can include a DUT location, a probe, and a ground area configured to serve as an antenna ground area for the antenna of the DUT. The ground area includes a slot that the antenna feed impedance is not affected or not affected significantly. The probe is adapted to weakly couple to the antenna of the DUT via the opening to probe a signal when the antenna of the DUT is fed by the circuit of the DUT and/or in order to couple a signal to the antenna which is fed to the circuit of the DUT by the antenna.

Abstract: The invention relates to a probe card (PC) for use with an automatic test equipment (ATE), wherein the probe card (PC) comprises a probe head (PH) on a first side thereof, and wherein the probe card (PC) is adapted to be attached to an interface (IF) and wherein the probe card (PC) comprises a plurality of contact pads on a second side in a region opposing at least a region of the interface (IF), arranged to contact a plurality of contacts of the interface (IF), and wherein the probe card (PC) comprises one or more coaxial connectors (CCPT) arranged to mate with one or more corresponding coaxial connectors (CCPT) of the interface (IF). The invention relates further to pogo tower (PT) for connecting a wafer probe interface (WPI) of an automatic test equipment with the probe card (PC).

Abstract: Disclosed are apparatuses and methods for fabricating the apparatuses. In one aspect, an apparatus includes a high-power die mounted on a backside of a package substrate. A heat transfer layer is disposed on the backside of the high-power die. A plurality of heat sink interconnects is coupled to the heat transfer layer, where each of the plurality of heat sink interconnects is directly coupled to the heat transfer layer in a vertical orientation.

Abstract: Disclosed are apparatuses and methods for fabricating the apparatuses. In one aspect, an apparatus includes a high-power die mounted on a backside of a package substrate. A heat transfer layer is disposed on the backside of the high-power die. A plurality of heat sink interconnects is coupled to the heat transfer layer. The plurality of heat sink interconnects is located adjacent the high-power die in a horizontal direction.