Abstract: A device for removing a framed wafer from a wafer tray is described. The wafer tray including a wafer receptacle for receiving the framed wafer. The wafer receptacle being configured to hold the wafer perpendicular to the wafer plane and to remove it from the wafer tray in this manner. The wafer receptacle including at least one wafer receptacle edge contact element arranged and configured to abut against the front frame edge. The device including a drive and control device configured to guide the wafer receptacle along a predetermined path of movement into the access to the wafer tray. Each wafer receptacle edge contact element is spring-mounted in the direction of the path of movement and the wafer receptacle is movable from a first position to a second position.

Abstract: A device for removing a framed wafer from a wafer tray is proposed, said wafer tray including an access for depositing or removing the framed wafer, wherein the deposited framed wafer has a front frame edge facing the access and the wafer tray includes at least one wafer tray edge contact element for abutting against the rear frame edge, comprising a wafer receptacle for receiving the framed wafer, the wafer receptacle being configured to hold the wafer perpendicular to the wafer plane and to remove it from the wafer tray in this manner and including at least one wafer receptacle edge contact element arranged and configured to abut against the front frame edge, and with a drive and control device configured to guide the wafer receptacle along a predetermined path of movement into the access to the wafer tray and out of it, wherein each wafer receptacle edge contact element is spring-mounted in the direction of the path of movement and the wafer receptacle is movable from a first position, in which each wafer

Abstract: The invention relates to wafer aligning device (1) and a corresponding method for aligning a wafer (2) into a specified rotational angular position (as), having a wafer table (20) with a table receiving area (30) for receiving the wafer (2) on a table receiving area plane (T) and having an aligning means (40) with an aligning receiving area (50) which is designed to align the wafer (2) into a specified rotational angular position. The aligning receiving area (50) is arranged in an aligning position (PA) above the table receiving area plane (T) of the wafer table (20) when receiving the wafer (2), and at least one of the aligning receiving area (50) and the table receiving area (30) is designed to place a wafer (2) received in the aligning receiving area (50) on the table receiving area (30) upon traversing the aligning receiving area (50) and the table receiving area plane (T) by means of a vertical movement relative to the other of the aligning receiving area (50) and the table receiving area (30).

Abstract: The invention relates to wafer aligning device (1) and a corresponding method for aligning a wafer (2) into a specified rotational angular position (as), having a wafer table (20) with a table receiving area (30) for receiving the wafer (2) on a table receiving area plane (T) and having an aligning means (40) with an aligning receiving area (50) which is designed to align the wafer (2) into a specified rotational angular position. The aligning receiving area (50) is arranged in an aligning position (PA) above the table receiving area plane (T) of the wafer table (20) when receiving the wafer (2), and at least one of the aligning receiving area (50) and the table receiving area (30) is designed to place a wafer (2) received in the aligning receiving area (50) on the table receiving area (30) upon traversing the aligning receiving area (50) and the table receiving area plane (T) by means of a vertical movement relative to the other of the aligning receiving area (50) and the table receiving area (30).