Abstract: An alignment mark definer is configured to provide a geometrical definition for an actual alignment structure to be formed at a temporary surface of a substrate based on a desired appearance of the alignment mark and on an expected alteration of an appearance of the actual alignment structure caused by a deposition material deposited on the temporary surface and the actual alignment structure.

Abstract: Structures of a backside of a wafer can be aligned to structures of a frontside of the wafer for a lithographic treatment of the backside. The wafer is transparent for electromagnetic radiation of a specific wavelength. The wafer is placed on a wafer stage such that the frontside is facing the wafer stage and the backside is facing alignment optics. The backside is illuminated with electromagnetic radiation of the specific wavelength in a dark-field configuration, such that the electromagnetic radiation propagates through the wafer towards three-dimensional structures of a three-dimensional alignment target located at the frontside or inside the wafer and is scattered at the three-dimensional structures. The scattered electromagnetic radiation is captured with the alignment optics, and the backside is aligned to the frontside of the wafer based on the scattered electromagnetic radiation.

Abstract: An alignment mark definer is configured to provide a geometrical definition for an actual alignment structure to be formed at a temporary surface of a substrate based on a desired appearance of the alignment mark and on an expected alteration of an appearance of the actual alignment structure caused by a deposition material deposited on the temporary surface and the actual alignment structure.

Abstract: A photolithography mask according to an embodiment may include: a mask substrate, the mask substrate having a three-dimensional pattern located and dimensioned to at least partially receive an inverse three-dimensional pattern of a wafer to be exposed using the photolithography mask.

Abstract: Structures of a backside of a wafer can be aligned to structures of a frontside of the wafer for a lithographic treatment of the backside. The wafer is transparent for electromagnetic radiation of a specific wavelength. The wafer is placed on a wafer stage such that the frontside is facing the wafer stage and the backside is facing alignment optics. The backside is illuminated with electromagnetic radiation of the specific wavelength in a dark-field configuration, such that the electromagnetic radiation propagates through the wafer towards three-dimensional structures of a three-dimensional alignment target located at the frontside or inside the wafer and is scattered at the three-dimensional structures. The scattered electromagnetic radiation is captured with the alignment optics, and the backside is aligned to the frontside of the wafer based on the scattered electromagnetic radiation.

Abstract: A system and method for prealigning a substrate. One embodiment provides a rotor configured to rotate a carrier around a rotation axis in response to a rotation signal. The carrier includes a main surface substantially perpendicular to the rotation axis. The substrate is disposable on the carrier. The substrate includes a main surface and a mark such that an orientation of the substrate with respect to the rotation axis is detectable. An electromagnetic radiation source is configured to illuminate the main surface of the substrate with electromagnetic radiation. An optical/electrical converter is responsive to the electromagnetic radiation reflected back from the main surface, detecting the mark of the substrate and providing a sensing signal. A controller is configured to receive the sensing signal and providing the rotation signal.

Abstract: A system and method for prealigning a substrate. One embodiment provides a rotor configured to rotate a carrier around a rotation axis in response to a rotation signal. The carrier includes a main surface substantially perpendicular to the rotation axis. The substrate is disposable on the carrier. The substrate includes a main surface and a mark such that an orientation of the substrate with respect to the rotation axis is detectable. An electromagnetic radiation source is configured to illuminate the main surface of the substrate with electromagnetic radiation. An optical/electrical converter is responsive to the electromagnetic radiation reflected back from the main surface, detecting the mark of the substrate and providing a sensing signal. A controller is configured to receive the sensing signal and providing the rotation signal.