Patents by Inventor Josef Heitzer

Josef Heitzer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040256150
    Abstract: A nonconducting substrate forming a strip or a panel on which a plurality of carrier elements having respective boundary lines are formed. The substrate includes a contact side, an insertion side opposite the contact side, and a conducting insertion-side metallization provided on the insertion side. The insertion-side metallization is formed such that an electrical connection can take place by flip-chip bonding between contact points of an integrated circuit to be applied to the insertion side and the insertion-side metallization.
    Type: Application
    Filed: March 16, 2004
    Publication date: December 23, 2004
    Applicant: Infineon Technologies AG
    Inventors: Bernd Barchmann, Erik Heinemann, Josef Heitzer, Frank Puschner
  • Patent number: 6806562
    Abstract: A device having a semiconductor component and a printed circuit board are described. The semiconductor component has external contacts and the printed circuit board has contact terminals. The contact terminals display a central blind opening, into which the external contacts of the semiconductor component protrude and are in a force-locking engagement with the contact terminal areas. In the method of electromechanically connecting the two parts to form a device, after they have been aligned, the two components are merely pressed onto each other.
    Type: Grant
    Filed: January 25, 2002
    Date of Patent: October 19, 2004
    Assignee: Infineon Technologies AG
    Inventors: Bernd Barchmann, Erik Heinemann, Josef Heitzer, Frank Pueschner
  • Patent number: 6719205
    Abstract: A carrier element for a semiconductor chip and in particular for incorporation into smart cards. The carrier element has an encapsulation composition protecting the semiconductor chip. The carrier element connections are disposed on one of the main surfaces of the encapsulation composition along only two opposite edges. They are made of a conductive material and have a reduced thickness at the ends facing one another, the cross section having a step only on one side. The semiconductor chip is disposed on the connections in a region of the section of reduced thickness and is mechanically connected to the connections.
    Type: Grant
    Filed: June 15, 1999
    Date of Patent: April 13, 2004
    Assignee: Infineon Technologies AG
    Inventors: Frank Püschner, Jürgen Fischer, Josef Heitzer
  • Publication number: 20020113311
    Abstract: A device having a semiconductor component and a printed circuit board are described. The semiconductor component has external contacts and the printed circuit board has contact terminals. The contact terminals display a central blind opening, into which the external contacts of the semiconductor component protrude and are in a force-locking engagement with the contact terminal areas. In the method of electromechanically connecting the two parts to form a device, after they have been aligned, the two components are merely pressed onto each other.
    Type: Application
    Filed: January 25, 2002
    Publication date: August 22, 2002
    Inventors: Bernd Barchmann, Erik Heinemann, Josef Heitzer, Frank Pueschner
  • Patent number: 6313524
    Abstract: A chip module has a contact area disposed on its outer side formed of a plurality of essentially flat contact elements of electrically conductive material insulated from one another. At least one semiconductor chip having one or more integrated semiconductor circuits that are electrically connected to the contact elements of the contact area via bonding wires. The contact elements of the chip module are formed by a prefabricated lead frame for supporting the at least one semiconductor chip and have on two opposing sides of the chip module outwardly offset terminals arranged in rows next to one another. The outwardly offset terminals are provided for surface mounting the chip module on the mounting surface of an external printed circuit board or an external circuit board substrate.
    Type: Grant
    Filed: March 23, 1999
    Date of Patent: November 6, 2001
    Assignee: Infineon Technologies AG
    Inventors: Frank Pueschner, Michael Huber, Peter Stampka, Jürgen Fischer, Josef Heitzer
  • Patent number: 6288904
    Abstract: The chip module is particularly suitable for implanting in a smart card body. The module has a carrier and a chip fitted on the carrier. A pedestal or base-type elevation formed on the carrier laterally surrounds the chip completely or partly.
    Type: Grant
    Filed: March 30, 1999
    Date of Patent: September 11, 2001
    Assignee: Infineon Technologies AG
    Inventors: Detlef Houdeau, Peter Stampka, Michael Huber, Josef Heitzer
  • Patent number: 6191951
    Abstract: A smart card module includes a semiconductor chip that is electrically conductively connected to a metallic lead frame in which contact areas are formed. The semiconductor chip and the contact areas are electrically conductively contacted through connection areas disposed on a surface of an electrically insulating protective layer applied to the semiconductor chip. That surface faces away from the semiconductor chip. Contact can be established between the connection areas and the contact areas through the use of soldered joints or electrically conductive adhesive bonds. A smart card including the smart card module is also provided.
    Type: Grant
    Filed: September 3, 1999
    Date of Patent: February 20, 2001
    Assignee: Infineon Technologies AG
    Inventors: Detlef Houdeau, Josef Mundigl, Frank Pueschner, Peter Stampka, Michael Huber, Josef Heitzer
  • Patent number: 6185507
    Abstract: A microprocessor has a control unit with a housing surrounding the control unit. The invention also relates to a chip card having such a microprocessor that is protected against manipulations. At least one sensor indicates ambient states and is connected to the control unit and is provided in a region of the housing of the microprocessor. The control unit is configured in such a way that it can be placed in an inactive state if a measurement signal that indicates a predetermined ambient state is and/or is not fed to the control unit from the sensor.
    Type: Grant
    Filed: February 23, 1999
    Date of Patent: February 6, 2001
    Assignee: Siemens Aktiengesellschaft
    Inventors: Michael Huber, Peter Stampka, Josef Heitzer
  • Patent number: 6088901
    Abstract: A carrier element for a semiconductor chip, in particular to be built into smart cards. The carrier element has a substrate that carries the chip and a stiffening sheet which also carries the chip and has a recess for receiving the chip and its connection leads therein. An edge of the recess is provided with a frame formed integrally from the sheet.
    Type: Grant
    Filed: December 14, 1998
    Date of Patent: July 18, 2000
    Assignee: Siemens Aktiengesellschaft
    Inventors: Michael Huber, Peter Stampka, Detlef Houdeau, Jurgen Fischer, Josef Heitzer, Helmut Graf
  • Patent number: 5874354
    Abstract: A method for electrically connecting a semiconductor chip to at least one contact surface uses a thin wire having a first end welded to the at least one contact surface and a second end connected to a contact zone of the semiconductor chip. In order to produce a good connection between the wire and the contact zone of the semiconductor chip, the second end of the wire is welded to a metal piece in the form of a wedge which is disposed on the contact zone of the semiconductor chip and is connected in a conductive manner thereto. The metal piece is formed by a nailhead contact having a free end which is guided in a loop and is connected to the nailhead by a wedge contact. A smart card module and a smart card are produced by the method.
    Type: Grant
    Filed: March 26, 1998
    Date of Patent: February 23, 1999
    Assignee: Siemens Aktiengesellschaft
    Inventors: Josef Heitzer, Josef Kirschbauer, Peter Stampka