Patents by Inventor Josef Kramler

Josef Kramler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for the manufacture of semiconductor wafers with a rear side having a gettering action
    Patent number: 4539050
    Abstract: For the manufacture of semiconductor wafers with a rear side having a geting action in subsequent oxidation processes by means of the action of light, especially laser, radiation ("laser damage"), there are advantageously chosen wafers with a fine surface structure that contains faces that are inclined by at least 15.degree. in the actual profile by comparison with the geometrically ideal profile of the surface according to known standards. As a result, in comparison to smooth surfaces, considerable savings in energy and time are achieved.
    Type: Grant
    Filed: October 19, 1983
    Date of Patent: September 3, 1985
    Assignee: Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe m.b.H.
    Inventors: Josef Kramler, Franz Kuhn-Kuhnenfeld, Hans-Adolf Gerber
  • Method of making reference surface markings on semiconductor wafers by laser beam
    Patent number: 4522656
    Abstract: A method for producing contrast rich, permanent and slag-free characterizations, particularly on polished semiconductor disks is described, in which the surface for generating the surface pattern is partially melted by laser radiation. According to the invention, a surface segment corresponding to 1.5 to 6.5 times the surface area of the desired surface pattern is irradiated, and the semiconductor material is caused to melt and partially vaporize only in the center thereof.
    Type: Grant
    Filed: April 26, 1984
    Date of Patent: June 11, 1985
    Assignee: Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe mbH
    Inventors: Franz Kuhn-Kuhnenfeld, Josef Kramler, Hans-Adolf Gerber