Patents by Inventor Josef Nagl

Josef Nagl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9144155
    Abstract: A sensor comprises a preferably multi-layer ceramic substrate (2) and at least one sensor element (1) arranged in, at, or on the ceramic substrate (2). The sensor element (1) can be contacted via a metallic contact (6), with the metallic contact (6) being produced via a soldering connection, which electrically connects the contact (6) with the sensor element (1) and here generates a fixed mechanic connection of the contact (6) in reference to the ceramic substrate (2). Furthermore, a method is claimed for producing the sensor according to the invention.
    Type: Grant
    Filed: October 10, 2011
    Date of Patent: September 22, 2015
    Assignee: MICRO-EPSILON Messtechnik GmbH & Co. KG
    Inventors: Sabine Schmideder, Torsten Thelemann, Josef Nagl, Heinrich Aschenbrenner, Reinhold Hoenicka
  • Patent number: 8833160
    Abstract: The invention relates to a sensor, comprising a sensor element (1) that operates without contact, an electronic component (5), and a housing (2) having an electrical/electronic connection. The sensor element (1) is part of the housing (2) and is used to close and seal the housing (2) with respect to the measurement side (3).
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: September 16, 2014
    Assignee: Micro-Epsilon Messtechnik GmbH & Co. KG
    Inventors: Reinhold Hoenicka, Josef Nagl, Tobias Schopf, Heinrich Baumann, Axel Seikowsky
  • Publication number: 20140198824
    Abstract: An eddy current sensor that works in contact-free manner, for temperature measurement on an electrically conductive measurement object or component, wherein the measurement is independent of the distance between the sensor and the measurement object/component, characterized by determination of the inherent temperature of the sensor, preferably at the location of the measurement coil of the sensor, wherein the influence of the inherent temperature of the sensor or of a temperature gradient at the sensor on the result of the temperature measurement on the measurement object or component is compensated. A system comprises a corresponding sensor and an electrically conductive measurement object. A method serves for temperature measurement on a measurement object or component, by means of a corresponding sensor.
    Type: Application
    Filed: March 16, 2012
    Publication date: July 17, 2014
    Applicant: MICRO-EPSILON MESSTECHNIK GMBH & CO. KG
    Inventors: Josef Nagl, Reinhold Hoenicka, Felix Mednikov, Werner Groemmer
  • Publication number: 20130223031
    Abstract: A sensor comprises a preferably multi-layer ceramic substrate (2) and at least one sensor element (1) arranged in, at, or on the ceramic substrate (2). The sensor element (1) can be contacted via a metallic contact (6), with the metallic contact (6) being produced via a soldering connection, which electrically connects the contact (6) with the sensor element (1) and here generates a fixed mechanic connection of the contact (6) in reference to the ceramic substrate (2). Furthermore, a method is claimed for producing the sensor according to the invention.
    Type: Application
    Filed: October 10, 2011
    Publication date: August 29, 2013
    Applicant: MICRO-EPSILON MESSTECHNIK GMBH & CO. KG
    Inventors: Sabine Schmideder, Torsten Thelemann, Josef Nagl, Heinrich Aschenbrenner, Reinhold Hoenicka
  • Publication number: 20130139589
    Abstract: The invention relates to a sensor, comprising a sensor element (1) that operates without contact, an electronic component (5), and a housing (2) having an electrical/electronic connection. The sensor element (1) is part of the housing (2) and is used to close and seal the housing (2) with respect to the measurement side (3).
    Type: Application
    Filed: December 15, 2010
    Publication date: June 6, 2013
    Applicant: MICRO-EPSILON MESSTECHNIK GMBH & CO. KG
    Inventors: Reinhold Hoenicka, Josef Nagl, Tobias Schopf, Heinrich Baumann, Axel Seikowsky