Patents by Inventor Josef P. Keizer

Josef P. Keizer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5661091
    Abstract: The invention relates to a method of manufacturing semiconductor devices in which a slice of semiconductor material is provided with a pn junction aligned parallel to the main surfaces of the slice. After the pn junctions is provided, depressions are provided in one main surface. These depressions cut through the pn junction, thereby dividing the main pn junction into mutually insulated pn junction portions. Before the slice is split up into separate semiconductor bodies, a layer of insulating material is provided. This method of manufacturing semiconductor devices allows for a simple application of the insulating layer to the walls of the depressions.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: August 26, 1997
    Assignee: U.S. Philips Corporation
    Inventors: Geert J. Duinkerken, Jozeph P.K. Hoefsmit, Josef P. Keizer