Patents by Inventor Josef Paluch, II

Josef Paluch, II has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low stress connection methodology for thermally incompatible materials
    Patent number: 6409473
    Abstract: An assembly comprising a ceramic vane with a metal housing cast around the ends of the vane. The ceramic vane has dovetailed shaped grooves along its edges that extend from the vane's leading edge to its trailing edge. The housing is comprised of two spaced apart walls each having dovetailed protrusions for mating with the dovetail grooves in the vanes's edges. Upon the casting of the walls to the vane at least one surface of each dovetail groove comes in contact with at least one surface of the dovetail protrusion. A crushable coating is disposed between the vane's edges and the dovetail protrusions.
    Type: Grant
    Filed: June 27, 2000
    Date of Patent: June 25, 2002
    Assignee: Honeywell International, Inc.
    Inventors: E-June Chen, Bjoern Schenk, Ramesh Bapat, I. Gene Fowkes, Brian Gracias, Shen-Yeh Chen, Taison Ku, Josef Paluch, II