Abstract: A method of manufacturing a semiconductor device is disclosed. One embodiment includes placing multiple semiconductor chips onto a carrier, each of the semiconductor chips having a first face and a second face opposite to the first face. An encapsulation material is applied over the multiple semiconductor chips and the carrier to form an encapsulating body having a first face facing the carrier and a second face opposite to the first face. A redistribution layer is applied over the multiple semiconductor chips and the first face of the encapsulating body. An array of external contact elements are applied to the second face of the encapsulating body.

Abstract: A method of manufacturing a semiconductor device is disclosed. One embodiment includes placing multiple semiconductor chips onto a carrier, each of the semiconductor chips having a first face and a second face opposite to the first face. An encapsulation material is applied over the multiple semiconductor chips and the carrier to form an encapsulating body having a first face facing the carrier and a second face opposite to the first face. A redistribution layer is applied over the multiple semiconductor chips and the first face of the encapsulating body. An array of external contact elements are applied to the second face of the encapsulating body.

Abstract: The semiconductor device comprises a semiconductor chip defining a first face and a second face opposite to the first face, the semiconductor chip comprising at least one contact element on the first face of the semiconductor chip, an encapsulating body encapsulating the semiconductor chip, the encapsulating body having a first face and a second face opposite to the first face, a redistribution layer extending over the semiconductor chip and the first face of the encapsulating body and containing a metallization layer comprising contact areas connected with the contact elements of the semiconductor chip, and an array of external contact elements located on the second phase of the encapsulating body.

Abstract: A semiconductor package includes a semiconductor chip having an integrated circuit, a functional element electrically coupled with the integrated circuit, and an array of contact elements connected with the integrated circuit and the functional element. The functional element is configured to protect the integrated circuit from transient voltage.

Abstract: The semiconductor device comprises a semiconductor chip defining a first face and a second face opposite to the first face, the semiconductor chip comprising at least one contact element on the first face of the semiconductor chip, an encapsulating body encapsulating the semiconductor chip, the encapsulating body having a first face and a second face opposite to the first face, a redistribution layer extending over the semiconductor chip and the first face of the encapsulating body and containing a metallization layer comprising contact areas connected with the contact elements of the semiconductor chip, and an array of external contact elements located on the second phase of the encapsulating body.

Abstract: A semiconductor package includes a semiconductor chip having an integrated circuit, a functional element electrically coupled with the integrated circuit, and an array of contact elements connected with the integrated circuit and the functional element. The functional element is configured to protect the integrated circuit from transient voltage.

Abstract: In an electromagnetically actuatable device, an electromagnet is driven with a controlled current progression so that the armature of the electromagnet can be actuated at the lowest possible current level while still achieving the most rapid overall increase of the actuating current from zero to maximum amperage. A first portion or range of the current increase is carried out with a steep or jump-like current increasing characteristic. A second portion or range of the current increase is carried out with a more gradual variation of the current. The current levels at the end points of the respective ranges are selected to ensure that the electromagnet is actuated during the second range in which the current varies more gradually. Preferably, two steep or jump-like current increase ranges are respectively provided before and after the second range having the gradual current increase.

Abstract: To control the output from an induction motor with a main winding and an auxiliary winding with multiple taps, varying output stages of the motor are adjusted by the activation of the auxiliary winding or one of its part-windings. According to the invention, the coarse adjustment of the power to be output by the motor is effected by the selection of a certain output stage and a repeating digital m-bit keying pattern generated simultaneously for the purpose of fine adjustment, so that the motor is driven alternately at the set output stage and the next higher or next lower output stage as a function of the sequential logic values of the keying pattern. By means of the process complying with the invention, precise power control is possible which can be used to advantage for the adjustment of output.

Abstract: A printing apparatus having an electrothermically operated printing head (10) in the form of a bubble jet ink printing head or of a thermotransfer printing head comprises a plurality of individual heating elements (11) drivable in pulsed fashion, whereby an inking agent is locally heated in character-dependent fashion via the heating elements (11) during the writing mode and is transferred onto a recording medium (12) on the basis of the triggering of an aggregate change of state. A sensor (S) that acquires the change of state of the inking agent medium at each and every heating element (11) and that can be printer-independent generates a sensor signal allocated to the point in time of the change of state. The operating frequency of the printer is controlled dependent on the sensor signal. The identification of the change of state of the inking agent corresponds to a temperature measurement of the heating measurements.