Abstract: A method is disclosed for producing contact pins having a mounting portion including three resilient legs. The mounting portion permits solderless mounting of the contact pin in plated-through holes of printed circuit boards. In a single combined stamping and cold extrusion operation, the three legs are brought to a position in which they make an angle of 120 degrees with each other. A die used for the production process includes a female and a male part. To form a first leg of the mounting portion, a punch in the male part is lowered into a corresponding slot in the female part. To form the two other legs, material from the shank of the contact pin is displaced by inclined surfaces of the female part into two recesses corresponding with these surfaces, the recesses being located at the two long sides of the punch in the male part.