Abstract: A lithographic apparatus has a support structure configured to support a patterning device, the patterning device serving to pattern a radiation beam according to a desired pattern and having a planar main surface through which the radiation beam passes; an outlet opening configured to direct a flow of a gas onto the patterning device; and an inlet opening configured to extract the gas which has exited the outlet opening, wherein the outlet opening and inlet opening are in a facing surface facing the planar main surface of the patterning device.

Abstract: Position and curvature information of a patterning device may be determined directly from the patterning device and controlled based on the determined information. In an embodiment, a lithographic apparatus includes a position determining system operative to determine a relative position of the patterning device. The patterning device may be configured to create a patterned radiation beam from a radiation beam incident on a major surface of the patterning device. The patterning device may have a side surface having an edge in common with the major surface. The position determining system may include an interferometer operative to transmit light to the side surface and to receive the transmitted light after the transmitted light has been reflected at the side surface. The position determining system is operative to determine a quantity representative of the relative position of the patterning device from the received reflected transmitted light.

Abstract: A method for producing a plurality of semiconductor wafers includes processing a single crystal. The single crystal is provided in a grown state and has a central longitudinal axis with an orientation that deviates from a sought orientation of a crystal lattice of the semiconductor wafers. A block is sliced from the single crystal along cutting planes perpendicular to a crystallographic axis corresponding to the sought orientation of the crystal lattice of the semiconductor wafers. A lateral surface of the block is ground around the crystallographic axis. A plurality of semiconductor wafers are then sliced from the ground block along cutting planes perpendicular to the crystallographic axis.

Abstract: A method for simultaneously cutting a compound rod of semiconductor material into a multiplicity of wafers. The method includes selecting a first workpiece and a second workpiece, each having two end surfaces; grinding at least one of the two end surfaces of each workpiece so as to create a ground end surface on each workpiece; cementing the ground end surface of the first workpiece to the ground end surface of second workpiece using a fastener so as to produce a compound rod piece having a longitudinal axis, wherein the fastener is disposed between the workpieces so as create a distance between the workpieces; fixing the compound rod piece in a longitudinal direction on a mounting plate; clamping the mounting plate with the compound rod piece in a wire saw; and cutting the compound rod piece perpendicularly to the longitudinal axis using the wire saw.

Abstract: A method for producing a plurality of semiconductor wafers includes processing a single crystal. The single crystal is provided in a grown state and has a central longitudinal axis with an orientation that deviates from a sought orientation of a crystal lattice of the semiconductor wafers. A block is sliced from the single crystal along cutting planes perpendicular to a crystallographic axis corresponding to the sought orientation of the crystal lattice of the semiconductor wafers. A lateral surface of the block is ground around the crystallographic axis. A plurality of semiconductor wafers are then sliced from the ground block along cutting planes perpendicular to the crystallographic axis.

Abstract: A method for simultaneously cutting a compound rod of semiconductor material into a multiplicity of wafers. The method includes selecting a first workpiece and a second workpiece, each having two end surfaces; grinding at least one of the two end surfaces of each workpiece so as to create a ground end surface on each workpiece; cementing the ground end surface of the first workpiece to the ground end surface of second workpiece using a fastener so as to produce a compound rod piece having a longitudinal axis, wherein the fastener is disposed between the workpieces so as create a distance between the workpieces; fixing the compound rod piece in a longitudinal direction on a mounting plate; clamping the mounting plate with the compound rod piece in a wire saw; and cutting the compound rod piece perpendicularly to the longitudinal axis using the wire saw.

Abstract: Systems and techniques for providing an index of initial public offerings (IPOs) may include selecting a set of IPOs for inclusion in the IPO index (IPOX), selecting an index start date and base value, acquiring price data and weighting data for the selected IPOs, determining first adjustment factors associated with any new exclusion of an IPO from the selected set of IPOs, determining second adjustment factors associated with any new inclusion of an IPO in the selected set of IPOs, determining reconstitution dates for the index, and computing an index value based at least in part on the index start date and base value, the acquired price data and weighting data, and the determined first and second adjustment factors.

Abstract: An improved method of providing a carbon dispersion coating on surfaces of a substrate in a direct metallization process, wherein the substrate comprises conductive and non-conductive portions. The method comprises the steps of contacting the substrate with the carbon dispersion to coat the substrate with the carbon-containing dispersion and at least one of moving a non-absorbent roller over at least a portion of a substantially planar surface of the substrate to remove excess carbon dispersion from the substantially planar surface of the substrate and passing the substrate through a vacuum extraction chamber to extract excess carbon dispersion remaining on surfaces of the substrate. The method provides cleaner copper surfaces to minimize the microetch requirement and also prevents the carbon dispersion from undesirably redepositing on surfaces of the substrate.

Abstract: In a first embodiment, the invention provides a memory module having an electronic printed circuit board and a plurality of semiconductor chips of the same type that are mounted on at least one outer face of the printed circuit board. The printed circuit board has a connector strip, which runs at a first edge of the at least one outer face in a first direction and has a multiplicity of electrical contacts that are lined up in the first direction. The printed circuit board extends in the first direction between two opposite second edges. At least nine of the semiconductor chips of the same type are respectively mounted next to one another on the outer face of the printed circuit board between the center of the printed circuit board and the respective second edge of the printed circuit board. The semiconductor chips of the same type respectively have a smaller dimension and, in the direction perpendicular to the smaller dimension, a larger dimension that is larger than the smaller dimension.

Abstract: A semiconductor memory module includes an electronic printed circuit board with a contact strip and a plurality of semiconductor memory chips of identical type that are mounted on at least one external area of the printed circuit board. The semiconductor memory chips are rectangular in shape and are arranged, in at least two rows with the adjacent chips being oriented perpendicular to one another, such that the area used on the PC board is optimized.

Abstract: An electronic device is provided, in which semiconductor components are structurally identical among one another and have two groups of contact connections arranged on opposite main areas on a printed circuit board. Components are arranged in a manner laterally offset in a direction parallel to the printed circuit board area in such a way that, on opposite main areas, a group of first contact connections of a semiconductor component fitted on one main area is in each case arranged in the same region of the printed circuit board as a group of first contact connections of a semiconductor chip arranged on the opposite main area. Likewise, the groups of second contact connections of the semiconductor chips arranged on opposite main areas in each case attain congruence.

Abstract: A semiconductor memory module includes an electronic printed circuit board with a contact strip and a plurality of semiconductor memory chips of identical type that are mounted on at least one external area of the printed circuit board. The semiconductor memory chips are rectangular in shape and are arranged, in at least two rows with the adjacent chips being oriented perpendicular to one another, such that the area used on the PC board is optimized.

Abstract: In a first embodiment, the invention provides a memory module having an electronic printed circuit board and a plurality of semiconductor chips of the same type that are mounted on at least one outer face of the printed circuit board. The printed circuit board has a connector strip, which runs at a first edge of the at least one outer face in a first direction and has a multiplicity of electrical contacts that are lined up in the first direction. The printed circuit board extends in the first direction between two opposite second edges. At least nine of the semiconductor chips of the same type are respectively mounted next to one another on the outer face of the printed circuit board between the center of the printed circuit board and the respective second edge of the printed circuit board. The semiconductor chips of the same type respectively have a smaller dimension and, in the direction perpendicular to the smaller dimension, a larger dimension that is larger than the smaller dimension.

Abstract: A modeling composition consisting of a wax-based and oil-based binder, a filler, and a coloring agent, wherein the filler is substantially a light filler comprised of hollow microbeads. The binder is comprised of solid wax, pasty wax, and a liquid component of a wax base, an oil base, or a wax and oil base. The binder is present in the modeling composition in an amount of 45 to 90% by weight. The modeling composition can be used as play dough for children or as a therapeutic composition in the medical field for training and rehabilitation.

Abstract: A modeling composition consisting of a wax-based and oil-based binder, a filler, and a coloring agent, wherein the filler is substantially a light filler comprised of hollow microbeads. The binder is comprised of solid wax, pasty wax, and a liquid component of a wax base, an oil base, or a wax and oil base. The binder is present in the modeling composition in an amount of 45 to 90% by weight. The modeling composition can be used as play dough for children or as a therapeutic composition in the medical field for training and rehabilitation.