Abstract: A terminal pin for electrically connecting a conductor support, wherein the terminal pin is provided for the bonded connection to a conducting surface of the conductor support, is formed from a biocompatible non-noble metal, has a section at or near one end that is thickened relative to a section located further from the end, and at least one part of the surface of the thickened section has a soft-solderable coating of a noble metal.

Abstract: A method for producing a pin for a feedthrough for an electromedical implant. A pin is produced using the following method steps: creating a foil-, sheet- or strip-shaped semi-finished product by joining at least one first layer element including an electrically conducting, preferably biocompatible, material in foil, sheet or strip form and at least one second layer element including a solder and/or an easily soft-solderable material, preferably in wire, sheet or strip form, or by applying the at least one second layer element onto the at least one first layer element; and at least partially detaching a pin, or a set of multiple pins connected to a connecting web 46, from the semi-finished product. A method is also provided for producing a feedthrough and an electromedical implant and to a pin, a feedthrough or an implant produced in the corresponding manner.

Abstract: A feedthrough of a medical electronic device, which in particular is implantable, including a housing and at least one electrical or electronic component received in the housing, wherein the feedthrough has a feedthrough flange for closing an opening in the housing and for receiving a multiplicity of connection elements in an insulating body surrounding the connection elements, which connection elements serve for the connection of a component or at least one component, externally of the housing, wherein the insulating body is formed from multi-layer ceramic, in particular from HTCC, with sintered-in pre-configured conductor elements, and comprising a device-specific contact-making means of selected conductor elements, which together with the contacted pre-configured conductor elements forms the connection elements.

Abstract: An implantable electromedical device, including a device housing in which electronic and electrical function units are housed, a device head having at least one electrode or one line terminal, and a feedthrough arranged between the device housing and device head for at least one electrical conductor element connecting the electrodes or the line terminal to a function unit, wherein the feedthrough includes a one-piece plastic main body.

Abstract: A terminal pin for electrically connecting a conductor support, wherein the terminal pin is provided for the bonded connection to a conducting surface of the conductor support, is formed from a biocompatible non-noble metal, has a section at or near one end that is thickened relative to a section located further from the end, and at least one part of the surface of the thickened section has a soft-solderable coating of a noble metal.

Abstract: A method for producing a pin for a feedthrough for an electromedical implant. A pin is produced using the following method steps: creating a foil-, sheet- or strip-shaped semi-finished product by joining at least one first layer element including an electrically conducting, preferably biocompatible, material in foil, sheet or strip form and at least one second layer element including a solder and/or an easily soft-solderable material, preferably in wire, sheet or strip form, or by applying the at least one second layer element onto the at least one first layer element; and at least partially detaching a pin, or a set of multiple pins connected to a connecting web 46, from the semi-finished product. A method is also provided for producing a feedthrough and an electromedical implant and to a pin, a feedthrough or an implant produced in the corresponding manner.

Abstract: An electric feedthrough for electromedical implants, including at least one electric contact for connection to a mating contact. The at least one electric contact is formed as a conductive track which extends at least in regions in or on a dielectric substrate from a first region to a second region, wherein the substrate, when transitioning from the first into the second region, is guided through a flange, and in that the substrate is connected to the in a hermetically sealed manner. Also provided is an electric contact element and an electromedical implant including such a feedthrough.

Abstract: A connecting device for an electromedical implant having a housing, the connecting device including a feedthrough and a header. The feedthrough and the header are formed in one piece so as to reduce the cost of the production process.

Abstract: A feedthrough of an electrolyte or other capacitor, in particular for use in a medical-electronic implant, is provided having a terminal pin which has a section which can be soft soldered at least in the interior of the electrolyte capacitor, an aluminum flange enclosing the terminal pin, and a glass solder plug which hermetically seals the terminal pin in relation to the aluminum flange.

Abstract: A connecting device for an electromedical implant having a housing, the connecting device including a feedthrough and a header. The feedthrough and the header are formed in one piece so as to reduce the cost of the production process.

Abstract: An electrical feedthrough, in particular for use in an electro-medical implant, having a flange enclosing at least one feedthrough bushing and at least one terminal pin enclosed by the at least one feedthrough bushing, the terminal pin having at least one section which can be joined at a lower energy in the interior of the implant.

Abstract: A feedthrough, in particular for use in a medical-electronic implant, is provided having a terminal pin which has a section which can be soft soldered at least in the interior of the implant, a flange enclosing the terminal pin, and a glass solder plug which hermetically seals the terminal pin in relation to the flange.

Abstract: A feedthrough of an electrolyte or other capacitor, in particular for use in a medical-electronic implant, is provided having a terminal pin which has a section which can be soft soldered at least in the interior of the electrolyte capacitor, an aluminum flange enclosing the terminal pin, and a glass solder plug which hermetically seals the terminal pin in relation to the aluminum flange.

Abstract: A feedthrough, in particular for use in a medical-electronic implant, is provided having a terminal pin which has a section which can be soft soldered at least in the interior of the implant, a flange enclosing the terminal pin, and a glass solder plug which hermetically seals the terminal pin in relation to the flange.

Abstract: An electrical feedthrough, in particular for use in an electro-medical implant, having a flange enclosing at least one feedthrough bushing and at least one terminal pin enclosed by the at least one feedthrough bushing, the terminal pin having at least one section which can be joined at a lower energy in the interior of the implant.

Abstract: The present invention relates to an electrical feedthrough for insertion into an opening of an implantable electrical treatment device having an electrically insulating insulation body through which at least one electrically conductive terminal pin passes, which is connected hermetically sealed to the insulation body using a solder, the solder material being glass or glass ceramic.

Abstract: The present invention relates to an electrical bushing to be inserted into an opening of an implantable electrical treatment device having an electrically insulating insulation body, through which at least one electrically conductive terminal pin passes, which is connected hermetically sealed to the insulation body using a solder, the soldering material being glass or glass ceramic.

Abstract: The present invention relates to an electrical feedthrough for insertion into an opening of an implantable electrical treatment device having an electrically insulating insulation body through which at least one electrically conductive terminal pin passes, which is connected hermetically sealed to the insulation body using a solder, the solder material being glass or glass ceramic.