Abstract: A method for tin plating printed boards is disclosed wherein faulty bonding is prevented by masking the printed boards with a heat and solder resistant coating material. This coating material is selectively applied to the printed boards in those areas where misbonding due to gap bridging and bubble formation is most likely to occur. For example, a small amount of coating material may be applied across conductor paths between two adjacent areas. In addition, the coating material may be evenly distributed in a grid like fashion throughout the area of the printed boards. Where the tin plating process is a wave soldering process, the coating material may be applied in the direction of conveyance of the printed board in order to avoid interference with the discharge of the tin.