Patents by Inventor Josef Warren Korejwa

Josef Warren Korejwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroplating apparatus and method using a compressible contact
    Patent number: 6270646
    Abstract: A metal plating apparatus is described which includes a compressible member having a conductive surface covering substantially all of the surface of the substrate to be plated. The plating current is thereby transmitted over a wide area of the substrate, rather than a few localized contact points. The compressible member is porous so as to absorb the plating solution and transmit the plating solution to the substrate. The wafer and compressible member may rotate with respect to each other. The compressible member may be at cathode potential or may be a passive circuit element.
    Type: Grant
    Filed: December 28, 1999
    Date of Patent: August 7, 2001
    Assignee: International Business Machines Corporation
    Inventors: Erick Gregory Walton, Dean S. Chung, Lara Sandra Collins, William E. Corbin, Jr., Hariklia Deligianni, Daniel Charles Edelstein, James E. Fluegel, Josef Warren Korejwa, Peter S. Locke, Cyprian Emeka Uzoh