Abstract: An example one-time programmable (OTP) memory device is provided. The OTP memory device include a passivation layer. A top metal layer is positioned below the passivation layer. The top metal layer includes one or more holes configured to an etching medium to pass through the holes. An array of memory elements is positioned in a memory layer below the top metal layer. A first metal address line layer is positioned below the array of memory elements and includes a plurality of first address lines extending in a first direction. A first end of each memory element being connected to one of the plurality of first metal address lines. A second metal address line layer is positioned below the first metal address line layer and includes a plurality of second metal address lines extending in a second direction. The second direction is different than the first direction.

Abstract: A MEMS device formed using the materials of the BEOL of a CMOS process where a post-processing of vHF and post backing was applied to form the MEMS device and where a total size of the MEMS device is between 50 um and 150 um. The MEMS device may be implemented as an inertial sensor among other applications.

Abstract: A MEMS device formed using the materials of the BEOL of a CMOS process where a post-processing of vHF and post backing was applied to form the MEMS device and where a total size of the MEMS device is between 50 um and 150 um. The MEMS device may be implemented as an inertial sensor among other applications.

Abstract: Electrical cigarettes and methods for performing the operations thereof are provided. An exemplary method includes: receiving, from a pressure sensor, pressure sensor data; computing , using the pressure sensor data and average pressure sensor data, differential pressure data; determining whether the differential pressure sensor data meet a first criteria involving a first set of thresholds; upon determining the differential pressure data does meet the first criteria, determining whether the differential pressure sensor data meet a second criteria involving a second set of thresholds; upon determining the pressure data does meet the second criteria, issuing a trigger signal indicating enough differential pressure is present for smoking.

Abstract: A MEMS pressure sensor is provided having a membrane made with one of plurality of metal layers. A lid is positioned above the membrane and connected to a plurality of cavity walls at distal ends of the membrane. The lid includes an array of holes positioned on a region of the lid. A fixed metal electrode is positioned below the lid.

Abstract: A MEMS device formed using the materials of the BEOL of a CMOS process where a post-processing of vHF and post backing was applied to form the MEMS device and where a total size of the MEMS device is between 50 um and 150 um. The MEMS device may be implemented as an inertial sensor among other applications.

Abstract: A MEMS device formed using the materials of the BEOL of a CMOS process where a post-processing of vHF and post backing was applied to form the MEMS device and where a total size of the MEMS device is between 50 um and 150 um. The MEMS device may be implemented as an inertial sensor among other applications.

Abstract: A MEMS device formed using the materials of the BEOL of a CMOS process where a post-processing of vHF and post backing was applied to form the MEMS device and where a total size of the MEMS device is between 50 um and 150 um. The MEMS device may be implemented as an inertial sensor among other applications.

Abstract: A MEMS device formed using the materials of the BEOL of a CMOS process where a post-processing of vHF and post backing was applied to form the MEMS device and where a total size of the MEMS device is between 50 um and 150 um. The MEMS device may be implemented as an inertial sensor among other applications.

Abstract: An integrated gas sensor having a tungsten/tungsten oxide gas sensing element, is provided with: a substrate of semiconductor material; and a structure of interconnection layers, arranged above the substrate and made of a number of stacked conductive layers and dielectric layers. The gas sensing element is integrated within the structure of interconnection layers and at least one electrode is provided within the structure of interconnection layers, electrically connected to the gas sensing element, designed to provide an electric current to the gas sensing element in order to cause heating thereof.

Abstract: A MEMS integrated circuit including a plurality of layers where a portion includes one or more electronic elements on a semiconductor material substrate. The circuit includes a structure of interconnection layers having a bottom layer of conductor material and a top layer of conductor material where the layers are separated by at least one layer of dielectric material. The bottom layer may be formed above and in contact with an Inter Dielectric Layer. The circuit also includes a hollow space within the structure of interconnection layers and a MEMS device in communication with the structure of interconnection layers.

Abstract: Systems and methods for manufacturing a chip comprising a plurality of MEMS devices arranged in an integrated circuit are provided. In one aspect, the systems and methods provide for a chip including electronic elements formed on a semiconductor material substrate. The chip further includes a stack of interconnection layers including layers of conductor material separated by layers of dielectric material. MEMS devices are formed within the stack of interconnection layers by applying gaseous HF to a first layer of dielectric material positioned highest in the stack of interconnection layers. The stack of interconnection layers includes at least one unetched layer of dielectric material, and at least one layer of conductor material for routing connections to and from the electronic elements.

Abstract: Systems and methods for CMOS-based MEMS programmable memories are described. In one aspect, the systems and methods provide for a programmable memory having multiple memory cells. Each memory cell includes an electrode disposed within the memory cell, and a conductor material having two ends disposed proximate to the electrode. The programmable memory provides means for applying a voltage between the electrode and the conductor material, e.g., a voltage source. The applied voltage generates an electrostatic force sufficient to permanently alter the conductor material, thereby programming the memory cell.

Abstract: A method for manufacturing an integrated circuit including producing layers that form one or more electrical and/or electronic elements on a semiconductor material substrate. Then, producing ILD layers above the layers forming one or more electrical and/or electronic elements, including the steps of depositing a first layer of etch stopper material, depositing a second layer of dielectric material above and in contact with the first layer, forming at least one track extending through the first and second layers, and filling the at least one track with a non-metallic material.

Abstract: The systems and methods described herein address deficiencies in the prior art by enabling spatial multiplexing in cellular and/or wireless networks to overcome capacity limitations. In one embodiment, the limitations are overcome by forming a spatially multiplexed network of portable communications devices having MEMS-based vibrating antennas. Other suitable applications of vibrating antennas are also described.

Abstract: The systems and methods described herein address deficiencies in the prior art by enabling the fabrication and use of accelerometers, whether MEMS-based, NEMS-based, or CMOS-MEMS based, in the same integrated circuit die as a CMOS chip. In one embodiment, the accelerometer is fabricated on the same integrated circuit die as a CMOS chip using a typical CMOS manufacturing process.

Abstract: A miniaturized relay having a first zone facing a second zone, a first condenser plate, a second condenser plate arranged in the second zone, and smaller than or equal to the first plate, an intermediate space between both zones, a conductive element arranged in the intermediate space and which is mechanically independent from the adjacent walls and can move freely across the intermediate space depending on voltages present between both plates, contact points of an electric circuit, in which the conductive element closes the electric circuit by making contact with the contact points. Such relays can be used, for example, as: accelerometers, accelerometers in airbags, tiltmeters, Coriolis force detectors, microphones, in acoustic applications, pressure sensors, flow sensors, temperature sensors, gas sensors and magnetic field sensors.

Abstract: A MEMS integrated circuit including a plurality of layers where a portion includes one or more electronic elements on a semiconductor material substrate. The circuit includes a structure of interconnection layers having a bottom layer of conductor material and a top layer of conductor material where the layers are separated by at least one layer of dielectric material. The bottom layer may be formed above and in contact with an Inter Dielectric Layer. The circuit also includes a hollow space within the structure of interconnection layers and a MEMS device in communication with the structure of interconnection layers.

Abstract: Regulator circuit and corresponding uses. The regulator circuit includes at least two input terminals, at least two reactances, at least two output terminals, a plurality of interconnections for connecting said reactances with respect to one another and for connecting at least one of the reactances with the input and output terminals. The interconnections include miniaturized relays that allow exchanging a series connection of the reactances for a parallel connection and vice versa. The circuit can include a voltage monitor, power supply modules, input and output protectors, reference signal modules, and control modules. The regulator circuit has multiple applications including charge pump, power supply, DC/DC converter, DC/AC converter, AC/DC converter, D/A converter, A/D converter, and power amplifier.

Abstract: Electromagnetic signal emitting and/or receiving device and corresponding integrated circuit. The electromagnetic signal emitting and/or receiving device defines a minimum operational bandwidth and includes one or several arrays of antennas, each having at least one antenna, and which generate an output signal corresponding to the output signal generated by an hypothetical antenna equal to this antenna, when the hypothetical antenna is performing a periodic movement, preferably a rotation or combination of rotations. The periodic movement must have a frequency higher than a minimum operational bandwidth. In this manner the directivity of the antennas can be affected by changing their radiation pattern, being possible to obtain high directivity devices. The periodic movement can be replaced by an array of fixed antennas oriented in space and sequentially connected by miniaturized relays.