Abstract: A method of making a circuit board comprising the steps of: (1) forming two or more metallized vias through at least a portion of a circuit board; and (2) forming an isolation opening between the two or more metallized vias, whereby at least a portion of the metallization is removed from at least one of the two or more vias

Abstract: A method of connecting an optical fiber to a backplane with a right angle bend mount. The bend mount includes a base and a cover that is pivotably connected to the base by a hinge. A clamp is formed by a first pair of opposed surfaces of the base and cover adjacent the hinge. This clamp fixedly grips a ferrule portion of the optical fiber when the base and the cover are closed together. A second pair of opposed surfaces of the base and cover forms another clamp. This clamp fixedly grips a non-ferrule portion of the optical fiber when the base and the cover are closed together. A bent portion of the optical fiber between the ferrule portion and the gripped non-ferrule portion is disposed in a nongripping gap between the base and the cover when the base and the cover are closed together.

Abstract: A method for forming a mask for filling at least one target hole defined in a multilayer circuit board is described. In general, a removable layer is applied to an exterior surface of the multilayer circuit board. At least one access hole is then formed in the removable layer such that the at least one access hole in the removable layer overlaps with the at least one target hole to form the mask. Once the mask is formed, at least one target hole defined in the multilayer circuit board is filled with a fill material through the access hole formed in the removable layer. The fill material can be a conductive or nonconductive material. For example, the fill material can be conductive ink, or a conductive paste. In general, the fill material is a flowable material which can be positioned into the target hole through the access hole in its flowable state. Then, the fill material cures to form a hardened material within the target hole. The target hole can either be a through hole, or a blind hole.

Abstract: A guide insert having a guide member having an arcuate portion for bending an optical fiber of a backplane, and a circuit board assembly comprising the backplane and a daughterboard wherein the daughterboard is operatively connected to the backplane via the guide insert.

Abstract: A method of connecting an optical fiber to a backplane with a right angle bend mount. The bend mount includes a base and a cover that is pivotably connected to the base by a hinge. A clamp is formed by a first pair of opposed surfaces of the base and cover adjacent the hinge. This clamp fixedly grips a ferrule portion of the optical fiber when the base and the cover are closed together. A second pair of opposed surfaces of the base and cover forms another clamp. This clamp fixedly grips a non-ferrule portion of the optical fiber when the base and the cover are closed together. A bent portion of the optical fiber between the ferrule portion and the gripped non-ferrule portion is disposed in a non-gripping gap between the base and the cover when the base and the cover are closed together.

Abstract: A circuit board uses both electrical and optical connectors to carry signals in both electrical and light form. The optical connector employs redundant alignment features to provide for reliable connectivity between plug in boards and the electro-optic back plane. A process is of forming the back plane and other multilevel circuit boards so as to embed optical connectors is disclosed.

Abstract: A multilayer circuit board is provided with at least one signal layer, at least one feedback layer, and at least one dielectric layer positioned between the signal layer and the feedback layer. The signal layer is connected to at least one plated hole. The feedback layer has a contact pad, which is positioned adjacent to the plated hole, but is electrically isolated from the plated hole. The contact pad is connected to a measurement unit. The dielectric layer is positioned between the signal layer and the contact pad of the feedback layer. A portion of the plated hole forms a stub portion, which extends a distance away from the signal layer and typically extends a distance away from the contact pad of the feedback layer. To remove the stub portion, a hole is bored or routed into the multilayer circuit board until electrical feedback is received by the measurement unit upon contact of a portion of the boring device with the contact pad.

Abstract: A right angle bend mount for bending an optical fiber into the plane of a circuit board. The mount includes a base and a cover that is pivotably connected to the base by a hinge. A clamp is formed by a first pair of opposed surfaces of the base and cover adjacent the hinge. This clamp fixedly grips a ferrule portion of the optical fiber when the base and the cover are closed together. A second pair of opposed surfaces of the base and cover forms another clamp. This clamp fixedly grips a non-ferrule portion of the optical fiber when the base and the cover are closed together. A bent portion of the optical fiber between the ferrule portion and the gripped non-ferrule portion is disposed in a non-gripping gap between the base and the cover when the base and the cover are closed together.

Abstract: Polymers of differing refraction indices are embedded within a PCB to provide optical connectivity of the PCB with other circuit boards via an optic backplane. The creation of islands of polymer material of refractive index n1 completely surrounded by polymer material with refractive index n2 where n1 has a higher index than n2 allows the islands of n1 indexed polymer to serve as optical waveguides. A process of forming a multi-layered PCB with the optical waveguide islands using successive laminations and using laser ablation to write the optical connection scheme is taught. Further, the use of uniquely marked targets in a copper layer to align the optical waveguides in production is also taught. Additionally, the use of clearing polymer materials and reinforcing polymer voids with lamination to allow a simple, high tolerance insertion of through-holes is taught.

Abstract: An optical connector for use in multilayer electro-optic circuit boards. An electro-optical back plane circuit board uses both electrical and optical connectors to carry signals in both electrical and light form. The optical connector employs redundant alignment features to provide for reliable connectivity between plug in boards and the electro-optic back plane. A process is of forming the back plane and other multilevel circuit boards so as to embed optical connectors is disclosed.

Abstract: An optical connector for use in multilayer electro-optic circuit boards. An electro-optical back plane circuit board uses both electrical and optical connectors to carry signals in both electrical and light form. The optical connector employs redundant alignment features to provide for reliable connectivity between plug in boards and the electro-optic back plane. A process is of forming the back plane and other multilevel circuit boards so as to embed optical connectors is disclosed.

Abstract: Polymers of differing refraction indices are embedded within a PCB to provide optical connectivity of the PCB with other circuit boards via an optic backplane. The creation of islands of polymer material of refractive index n1 completely surrounded by polymer material with refractive index n2 where n1 has a higher index than n2 allows the islands of n1 indexed polymer to serve as optical waveguides. A process of forming a multi-layered PCB with the optical waveguide islands using successive laminations and using laser ablation to write the optical connection scheme is taught. Further, the use of uniquely marked targets in a copper layer to align the optical waveguides in production is also taught. Additionally, the use of clearing polymer materials and reinforcing polymer voids with prepreg lamination to allow a simple, high tolerance insertion of through-holes is taught.

Abstract: An optical connector for use in multilayer electro-optic circuit boards. An electro-optical back plane circuit board uses both electrical and optical connectors to carry signals in both electrical and light form. The optical connector employs redundant alignment features to provide for reliable connectivity between plug in boards and the electro-optic back plane. A process is of forming the back plane and other multilevel circuit boards so as to embed optical connectors is disclosed.

Abstract: A right angle bend mount for bending an optical fiber into the plane of a circuit board. The mount includes a base and a cover that is pivotably connected to the base by a hinge. A clamp is formed by a first pair of opposed surfaces of the base and cover adjacent the hinge. This clamp fixedly grips a ferrule portion of the optical fiber when the base and the cover are closed together. A second pair of opposed surfaces of the base and cover forms another clamp. This clamp fixedly grips a non-ferrule portion of the optical fiber when the base and the cover are closed together. A bent portion of the optical fiber between the ferrule portion and the gripped non-ferrule portion is disposed in a non-gripping gap between the base and the cover when the base and the cover are closed together.

Abstract: A right angle bend mount for bending an optical fiber into the plane of a circuit board. The mount includes a base and a cover that is pivotably connected to the base by a hinge. A clamp is formed by a first pair of opposed surfaces of the base and cover adjacent the hinge. This clamp fixedly grips a ferrule portion of the optical fiber when the base and the cover are closed together. A second pair of opposed surfaces of the base and cover forms another clamp. This clamp fixedly grips a non-ferrule portion of the optical fiber when the base and the cover are closed together. A bent portion of the optical fiber between the ferrule portion and the gripped non-ferrule portion is disposed in a non-gripping gap between the base and the cover when the base and the cover are closed together.

Abstract: Targets are inserted throughout the layout of a PCB. Post manufacture measurement of the targets are compared to pre-manufacture positions so as to calculate a non-linear regression analysis best-fit model. This model is used to predict a feature's location upon or within a PCB given the feature's position on the layout. The non-linear regression analysis results in a set of x and y polynomial equations. These polynomial equations allow for a linear compensation to be applied to the feature position on a layout so as to minimize misregistration of features in the manufacture of PCBs. Models of the features' post production positioning is made before and after linear compensations are made to the pre-manufacture positioning of the features Graphical presentations using wire frame diagrams and color coded diagrams help identify those areas of the panel that are projected to be in and out of tolerance relative to the specifications.

Abstract: A right angle bend mount for bending an optical fiber into the plane of a circuit board. The mount includes a base and a cover that is pivotably connected to the base by a hinge. A clamp is formed by a first pair of opposed surfaces of the base and cover adjacent the hinge. This clamp fixedly grips a ferrule portion of the optical fiber when the base and the cover are closed together. A second pair of opposed surfaces of the base and cover forms another clamp. This clamp fixedly grips a non-ferrule portion of the optical fiber when the base and the cover are closed together. A bent portion of the optical fiber between the ferrule portion and the gripped non-ferrule portion is disposed in a non-gripping gap between the base and the cover when the base and the cover are closed together.

Abstract: Targets are inserted throughout the layout of a PCB. Post manufacture measurement of the targets are compared to pre-manufacture positions so as to calculate a non-linear regression analysis best fit model. This model is used to predict a feature's location upon or within a PCB given the feature's position on the layout. The non-linear regression analysis results in a set of x and y polynomial equations. These polynomial equations allows for a linear compensation to be applied to the feature position on a layout so as to minimize misregistration of features in the manufacture of PCBs. Models of the features' post production positioning is made before and after linear compensations are made to the pre-manufacture positioning of the features. Graphical presentations using wire frame diagrams and color coded diagrams help identify those areas of the panel that are projected to be in and out of tolerance relative to the specifications.

Abstract: Polymers of differing refraction indices are embedded within a PCB to provide optical connectivity of the PCB with other circuit boards via an optic backplane. The creation of islands of polymer material of refractive index n1 completely surrounded by polymer material with refractive index n2 where n1 has a higher index than n2 allows the islands of n1 indexed polymer to serve as optical waveguides. A process of forming a multi-layered PCB with the optical waveguide islands using successive laminations and using laser ablation to write the optical connection scheme is taught. Further, the use of uniquely marked targets in a copper layer to align the optical waveguides in production is also taught. Additionally, the use of clearing polymer materials and reinforcing polymer voids with prepreg lamination to allow a simple, high tolerance insertion of through-holes is taught.

Abstract: A right angle bend mount for bending an optical fiber into the plane of a circuit board. The mount includes a base and a cover that is pivotably connected to the base by a hinge. A clamp is formed by a first pair of opposed surfaces of the base and cover adjacent the hinge. This clamp fixedly grips a ferrule portion of the optical fiber when the base and the cover are closed together. A second pair of opposed surfaces of the base and cover forms another clamp. This clamp fixedly grips a non-ferrule portion of the optical fiber when the base and the cover are closed together. A bent portion of the optical fiber between the ferrule portion and the gripped non-ferrule portion is disposed in a non-gripping gap between the base and the cover when the base and the cover are closed together.