Patents by Inventor Joseph A. DuPay

Joseph A. DuPay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9420962
    Abstract: A lead coupling device adapted for coupling to a lead and methods for using the coupling devices are provided. The coupling device includes a housing assembly having a proximal opening and a distal opening. The coupling device also has a lead receiving channel that is disposed between the two openings to receive a lead therethrough. Various electronics components may also included in the coupling device that enable operations such as sensing, delivery of electrical energy and wireless communication between the coupling device and an external device.
    Type: Grant
    Filed: April 30, 2008
    Date of Patent: August 23, 2016
    Assignee: Medtronic, Inc.
    Inventors: John L. Sommer, Michael D. Eggen, Joseph A. DuPay
  • Patent number: 8214045
    Abstract: A lead implant system includes a lead coupling device, which is configured to couple a lead during an implant procedure, in communication with a medical device and an implantable medical device, which is contained within a package that includes an electrical interface for electrical coupling with an electrical contact of the implantable medical device. The electrical interface facilitates coupling of the packaged medical device to an electrical contact of another medical device, which is located outside the package. If the electrical contact of the packaged device is mounted within a bore of the device, then the connector structure allows for passage of a sterilizing gas into the connector bore, and past the connector contact, within the bore.
    Type: Grant
    Filed: April 30, 2008
    Date of Patent: July 3, 2012
    Assignee: Medtronic, Inc.
    Inventors: Christine G. Kronich, John L. Sommer, William K. Wenger, Michael D. Eggen, Gerald Jordan Montgomery, Joseph A. DuPay
  • Patent number: 7953495
    Abstract: A lead coupling device adapted for coupling to a lead and methods for using the coupling devices are provided. The coupling device includes a housing assembly having a proximal opening and a distal opening. The coupling device also has a lead receiving channel that is disposed between the two openings to receive a lead therethrough. Various electronics components may also included in the coupling device that enable operations such as sensing, delivery of electrical energy and wireless communication between the coupling device and an external device.
    Type: Grant
    Filed: April 30, 2008
    Date of Patent: May 31, 2011
    Assignee: Medtronic, Inc.
    Inventors: John L. Sommer, Michael D. Eggen, Joseph A. DuPay
  • Publication number: 20090276004
    Abstract: A lead implant system includes a lead coupling device, which is configured to couple a lead during an implant procedure, in communication with a medical device and an implantable medical device, which is contained within a package that includes an electrical interface for electrical coupling with an electrical contact of the implantable medical device. The electrical interface facilitates coupling of the packaged medical device to an electrical contact of another medical device, which is located outside the package. If the electrical contact of the packaged device is mounted within a bore of the device, then the connector structure allows for passage of a sterilizing gas into the connector bore, and past the connector contact, within the bore.
    Type: Application
    Filed: April 30, 2008
    Publication date: November 5, 2009
    Inventors: Christine G. Kronich, John L. Sommer, William K. Wenger, Michael D. Eggen, Gerald Jordan Montgomery, Joseph A. DuPay
  • Publication number: 20090276002
    Abstract: A lead coupling device adapted for coupling to a lead and methods for using the coupling devices are provided. The coupling device includes a housing assembly having a proximal opening and a distal opening. The coupling device also has a lead receiving channel that is disposed between the two openings to receive a lead therethrough. Various electronics components may also included in the coupling device that enable operations such as sensing, delivery of electrical energy and wireless communication between the coupling device and an external device.
    Type: Application
    Filed: April 30, 2008
    Publication date: November 5, 2009
    Inventors: John L. Sommer, Michael D. Eggen, Joseph A. DuPay
  • Publication number: 20090276003
    Abstract: A lead coupling device adapted for coupling to a lead and methods for using the coupling devices are provided. The coupling device includes a housing assembly having a proximal opening and a distal opening. The coupling device also has a lead receiving channel that is disposed between the two openings to receive a lead therethrough. Various electronics components may also included in the coupling device that enable operations such as sensing, delivery of electrical energy and wireless communication between the coupling device and an external device.
    Type: Application
    Filed: April 30, 2008
    Publication date: November 5, 2009
    Inventors: John L. Sommer, Michael D. Eggen, Joseph A. DuPay