Abstract: Provided are methods for clinical treatment of hematological malignancies, such as relapsed or refractory chronic lymphocytic leukemia or lymphoma using an anti-LAG-3 antibody. Particular malignancies include, e.g., chronic lymphocytic leukemia (CLL), Hodgkin lymphoma (HL), or non-Hodgkin lymphoma (NHL).

Abstract: A permission-engine computer system receives a request for electronic access by an equipment supplier to a manufacturing facility of a manufacturer to perform a remote support activity for equipment in the manufacturing facility. The permission-engine computer system routes the request to a plurality of predefined approvers and receives approval of the request from the plurality of predefined approvers. In response to receiving approval of the request from the plurality of predefined approvers, the permission-engine computer system signals a gateway computer system of the manufacturer that the request is approved. The gateway computer system automatically creates a connection between an electronic device in the manufacturing facility and a computer system of the equipment supplier in response to approval of the request. The connection is used for the remote support activity.

Abstract: In some embodiments, a method is performed at a computer system of a manufacturer. The manufacturer operates a manufacturing facility that includes equipment from an equipment supplier. In the method, a request is received for electronic access by the equipment supplier to the manufacturing facility to perform a remote support activity for the equipment. The request is routed to predefined approvers. Approval of the request is received from the predefined approvers. In response to receiving approval of the request from the predefined approvers, a connection is automatically created between an electronic device in the manufacturing facility and a computer system for the equipment supplier. The connection is used for the remote support activity. Upon completion of the remote support activity, the connection is automatically terminated.

Abstract: A high-dimensional variable selection unit determines a list of critical parameters from sensor data and parametric tool measurements from a semiconductor manufacturing tool, such as a semiconductor inspection tool or other types of semiconductor manufacturing tools. The high-dimensional variable selection model can be, for example, elastic net, forward-stagewise regression, or least angle regression. The list of critical parameters may be used to design a next generation semiconductor manufacturing tool, to bring the semiconductor manufacturing tool back to a normal status, to match a semiconductor manufacturing tool's results with that of another semiconductor manufacturing tool, or to develop a specification for the semiconductor manufacturing tool.

Abstract: In some embodiments, a method is performed at a computer system of a manufacturer. The manufacturer operates a manufacturing facility that includes equipment from an equipment supplier. In the method, a request is received for electronic access by the equipment supplier to the manufacturing facility to perform a remote support activity for the equipment. The request is routed to predefined approvers. Approval of the request is received from the predefined approvers. In response to receiving approval of the request from the predefined approvers, a connection is automatically created between an electronic device in the manufacturing facility and a computer system for the equipment supplier. The connection is used for the remote support activity. Upon completion of the remote support activity, the connection is automatically terminated.

Abstract: A distributed computing system is configured to compute operational data for a video advertisement delivery system. Cloud-based resource are used to calculate operational parameters such as geographical data, unique advertisement delivery instances and segments of consumers that received the video advertisements.

Abstract: A distributed computing system is configured to compute operational data for a video advertisement delivery system. Cloud-based resource are used to calculate operational parameters such as geographical data, unique advertisement delivery instances and segments of consumers that received the video advertisements.

Abstract: A method to collect data and train, validate and deploy statistical models to predict overlay errors using patterned wafer geometry data and other relevant information includes selecting a training wafer set, measuring at multiple lithography steps and calculating geometry differences, applying a plurality of predictive models to the training wafer geometry differences and comparing predicted overlay to the measured overlay on the training wafer set. The most accurate predictive model is identified and the results fed-forward to the lithography scanner tool which can correct for these effects and reduce overlay errors during the wafer scan-and-expose processes.

Abstract: A high-dimensional variable selection unit determines a list of critical parameters from sensor data and parametric tool measurements from a semiconductor manufacturing tool, such as a semiconductor inspection tool or other types of semiconductor manufacturing tools. The high-dimensional variable selection model can be, for example, elastic net, forward-stagewise regression, or least angle regression. The list of critical parameters may be used to design a next generation semiconductor manufacturing tool, to bring the semiconductor manufacturing tool back to a normal status, to match a semiconductor manufacturing tool's results with that of another semiconductor manufacturing tool, or to develop a specification for the semiconductor manufacturing tool.

Abstract: A modular assembly having a press-fit fastener hole. The press-fit fastener hole may include a plurality of lobe regions and a plurality of contact regions that may be spaced between lobe regions for a press-fit engagement with a fastener. The fastener may have a first diameter and the contact regions collectively may define an imaginary second diameter that is less than or equal to the first diameter.

Abstract: A high-dimensional variable selection unit determines a list of critical parameters from sensor data and parametric tool measurements from a semiconductor manufacturing tool, such as a semiconductor inspection tool or other types of semiconductor manufacturing tools. The high-dimensional variable selection model can be, for example, elastic net, forward-stagewise regression, or least angle regression. The list of critical parameters may be used to design a next generation semiconductor manufacturing tool, to bring the semiconductor manufacturing tool back to a normal status, to match a semiconductor manufacturing tool's results with that of another semiconductor manufacturing tool, or to develop a specification for the semiconductor manufacturing tool.

Abstract: A distributed computing system is configured to compute operational data for a video advertisement delivery system. Cloud-based resource are used to calculate operational parameters such as geographical data, unique advertisement delivery instances and segments of consumers that received the video advertisements.

Abstract: A distributed computing system is configured to compute operational data for a video advertisement delivery system. Cloud-based resource are used to calculate operational parameters such as geographical data, unique advertisement delivery instances and segments of consumers that received the video advertisements.

Abstract: A distributed computing system is configured to compute operational data for a video advertisement delivery system. Cloud-based resource are used to calculate operational parameters such as geographical data, unique advertisement delivery instances and segments of consumers that received the video advertisements.

Abstract: A method to collect data and train, validate and deploy statistical models to predict overlay errors using patterned wafer geometry data and other relevant information includes selecting a training wafer set, measuring at multiple lithography steps and calculating geometry differences, applying a plurality of predictive models to the training wafer geometry differences and comparing predicted overlay to the measured overlay on the training wafer set. The most accurate predictive model is identified and the results fed-forward to the lithography scanner tool which can correct for these effects and reduce overlay errors during the wafer scan-and-expose processes.

Abstract: Techniques and systems for operating a video ad exchange includes controlling an ad server to receive ad requests from viewer devices, provide ad responses to viewer devices, generate an ad delivery data file that includes information about delivery of ads to the viewer devices, and transfer the ad delivery data file to a distributed computing cloud. The technique further includes controlling an ad data infrastructure mechanism to download the cloud-based ad delivery data file into a local memory, and process the copied ad delivery data file to generate billing data. An ad data infrastructure mechanism receives a configuration file from the ad server, verifies that all items in the configuration file from the ad server were used in the generation of the first billing data, and removes non-verifiable items from the first billing data to generate a final billing data.

Abstract: A high-dimensional variable selection unit determines a list of critical parameters from sensor data and parametric tool measurements from a semiconductor manufacturing tool, such as a semiconductor inspection tool or other types of semiconductor manufacturing tools. The high-dimensional variable selection model can be, for example, elastic net, forward-stagewise regression, or least angle regression. The list of critical parameters may be used to design a next generation semiconductor manufacturing tool, to bring the semiconductor manufacturing tool back to a normal status, to match a semiconductor manufacturing tool's results with that of another semiconductor manufacturing tool, or to develop a specification for the semiconductor manufacturing tool.

Abstract: A modular assembly having a press-fit fastener hole. The press-fit fastener hole may include a plurality of lobe regions and a plurality of contact regions that may be spaced between lobe regions for a press-fit engagement with a fastener. The fastener may have a first diameter and the contact regions collectively may define an imaginary second diameter that is less than or equal to the first diameter.

Abstract: A method to collect data and train, validate and deploy statistical models to predict overlay errors using patterned wafer geometry data and other relevant information includes selecting a training wafer set, measuring at multiple lithography steps and calculating geometry differences, applying a plurality of predictive models to the training wafer geometry differences and comparing predicted overlay to the measured overlay on the training wafer set. The most accurate predictive model is identified and the results fed-forward to the lithography scanner tool which can correct for these effects and reduce overlay errors during the wafer scan-and-expose processes.

Abstract: A distributed computing system is configured to compute operational data for a video advertisement delivery system. Cloud-based resource are used to calculate operational parameters such as geographical data, unique advertisement delivery instances and segments of consumers that received the video advertisements.