Abstract: Various embodiments disclosed herein enable steerable, time division duplex (“TDD”) communications channels at millimeter-wave frequency bands. Among other things, embodiments disclosed herein provide improved steering accuracy and power distribution, lower power consumption, and potentially longer service life than previous transceiver systems.

Abstract: A variable attenuation device includes a resistive array having two or more input nodes, two or more output nodes, and two or more resistive devices for coupling the input nodes and the output nodes. A first switch has an input terminal and two or more selectable output terminals, such that the input terminal is configured to receive an input signal and the two or more selectable output terminals are coupled to the two or more input nodes of the resistive array. A second switch has two or more selectable input terminals and an output terminal, such that the output terminal is configured to provide an attenuated output signal and the two or more selectable input terminals are coupled to the two or more output nodes of the resistive array.

Abstract: A semiconductor device package is provided to enclose a microstrip transmission line having a ground plane separated from a strip conductor by a dielectric and a semiconductor device having an electrode contact thereof bonded to the strip conductor by a conductive interconnect, such package having a bottom portion and a top portion hermetically sealed together along a conductive surface, such strip conductor being spaced between the conductive surface and the conductive interconnect. A method of packaging a semiconductor device and a microstrip transmission line having a ground plane separated from a strip conductor by a dielectric with such strip conductor bonded to an electrode contact of the semiconductor device, such method comprising the step of hermetically sealing a top portion of the package to a bottom portion of the package along a conductive surface, the strip conductor being between the semiconductor device and the conductive surface.