Abstract: A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.

Abstract: Described is a mobile radar system which provides both persistent surveillance and tracking of objects with adaptive measurement rates for both maneuvering and non-maneuvering objects. The mobile radar system includes a vehicle having mounted therein an active, electronically-steerable, phased array radar system movable between a stowed position and a deployed position and wherein the phased array radar system is operational in both the deployed and stored positions and also while the vehicle is either stationary or moving. Thus, the mobile radar system described herein provides for longer time on target and longer integration times, increased radar sensitivity and improved Doppler resolution and clutter rejection. This results in a highly mobile radar system appropriate for use in a battlefield environment and which supports single-integrated-air-picture metrics including but not limited to track purity, track completeness, and track continuity and thus improved radar performance in a battlefield.

Abstract: A mixed-signal, multilayer printed wiring board fabricated in a single lamination step is described. The PWB includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the PWB. The PWB includes a number of unit cells with radiating elements and an RF cage disposed around each unit cell to isolate the unit cell. A plurality of flip-chip circuits are disposed on an external surface of the PWB and a heat sink can be disposed over the flip chip components.

Abstract: Described is a mobile radar system which provides both persistent surveillance and tracking of objects with adaptive measurement rates for both maneuvering and non-maneuvering objects. The mobile radar system includes a vehicle having mounted therein an active, electronically-steerable, phased array radar system movable between a stowed position and a deployed position and wherein the phased array radar system is operational in both the deployed and stored positions and also while the vehicle is either stationary or moving. Thus, the mobile radar system described herein provides for longer time on target and longer integration times, increased radar sensitivity and improved Doppler resolution and clutter rejection. This results in a highly mobile radar system appropriate for use in a battlefield environment and which supports single-integrated-air-picture metrics including but not limited to track purity, track completeness, and track continuity and thus improved radar performance in a battlefield.

Abstract: A thermal management system includes an air duct assembly comprising a supply air duct having an air inlet opening, a return air duct having an air exit opening and a plurality of distribution air ducts configured to be in fluid communication with the air inlet opening of the supply air duct and with the air exit opening of the return air duct. A fan is disposed within the air duct assembly to direct air from the air inlet opening of the supply air duct through the supply air duct and out the air exit opening of the return air duct. The fan and supply duct are disposed to direct air over a first surface of a heat sink. A second opposing surface of the heat sink is disposed over and configured to be in thermal contact with a plurality of active circuits disposed on a first surface of a radio frequency (RF) multi-layer printing wiring board (PWB).

Abstract: A thermal management system includes an air duct assembly comprising a supply air duct having an air inlet opening, a return air duct having an air exit opening and a plurality of distribution air ducts configured to be in fluid communication with the air inlet opening of the supply air duct and with the air exit opening of the return air duct. A fan is disposed within the air duct assembly to direct air from the air inlet opening of the supply air duct through the supply air duct and out the air exit opening of the return air duct. The fan and supply duct are disposed to direct air over a first surface of a heat sink. A second opposing surface of the heat sink is disposed over and configured to be in thermal contact with a plurality of active circuits disposed on a first surface of a radio frequency (RF) multi-layer printing wiring board (PWB).

Abstract: A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.

Abstract: A mixed-signal, multilayer printed wiring board fabricated in a single lamination step is described. The PWB includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the PWB. The PWB includes a number of unit cells with radiating elements and an RF cage disposed around each unit cell to isolate the unit cell. A plurality of flip-chip circuits are disposed on an external surface of the PWB and a heat sink can be disposed over the flip chip components.

Abstract: A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.

Abstract: A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.

Abstract: A radiator includes a waveguide having an aperture and a patch antenna disposed in the aperture. In one embodiment, an antenna includes an array of waveguide antenna elements, each element having a cavity, and an array of patch antenna elements including an upper patch element and a lower patch element disposed in the cavity.

Abstract: A radiator includes a waveguide having an aperture and a patch antenna disposed in the aperture. In one embodiment, an antenna includes an array of waveguide antenna elements, each element having a cavity, and an array of patch antenna elements including an upper patch element and a lower patch element disposed in the cavity.

Abstract: A passive MMIC monopulse comparator includes a plurality of lumped element hybrids having pi and T filter structures. In one embodiment, a first hybrid receives first and second downcoverted signals and provides a first output signal to a third hybrid and second output signal to a fourth hybrid. A second hybrid receives third and fourth downconverted signals and provides respective third and fourth output signals to the third and fourth hybrids. The third hybrid provides sum and elevation channel signals and the fourth hybrid provides azimuth and G channel signals.

Abstract: A compact RF monopulse receiver circuit having a relatively low noise figure which is particularly useful for operation in the millimeter wave frequency range is described. The compact monopulse receiver finds use in small projectile and small missile applications. Also, a combination of transmit signal protection circuitry and receiver circuit architecture allows the RF monopulse receiver circuit to operate in a missile or other projectile which utilizes high RF power transmit signals. The RF monopulse receiver circuit can directly provide a radiation pattern for target detection and tracking or alternatively, the RF monopulse receiver circuit can function as a monopulse feed circuit which can be used, for example, in a quasi-optically fed reflector antenna.