Patents by Inventor Joseph A. McKenzie, Jr.

Joseph A. McKenzie, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5205741
    Abstract: A non-invasive connector for testing an integrated circuit package has a connector housing with a substantially rectangular recess adapted to fit over the integrated circuit package. A plurality of teeth made of an insulative material extend laterally inward from the edges of the connector housing into the recess. The spacing between the teeth is predetermined to enable the teeth to be removably inserted between the integrated circuit leads as said connector housing is fitted in place. Test leads extend from the connector housing into the space between said teeth to make electrical contact with the integrated circuit leads. Electrical connections are provided through the connector housing between these test leads and external testing equipment by means of pins and a flexible circuit assembly. In addition, an elastomeric pad can be positioned between the connector housing and the test leads to exert an inward biasing force against the test leads to maintain electrical contact with the integrated circuit leads.
    Type: Grant
    Filed: August 14, 1991
    Date of Patent: April 27, 1993
    Assignee: Hewlett-Packard Company
    Inventors: Michael J. Steen, Robert H. Wardwell, Joseph A. McKenzie, Jr.
  • Patent number: 5140745
    Abstract: During the manufacture of a printed circuit board, holes are drilled not only in accordance with a particular circuit board pattern, but also along the lines which will define edges of the board at the positions where traces are to appear. All of the holes are then plated through. The holes along the edges of the board are completely filled with solder. The board is then cut along the previously defined edge lines to cut the solder filled holes in half. This creates a trace and a solder reservoir along the edge of the board.
    Type: Grant
    Filed: July 23, 1990
    Date of Patent: August 25, 1992
    Inventor: Joseph A. McKenzie, Jr.
  • Patent number: 4977668
    Abstract: A connector formed of plastic is described. Plateable plastic is used for one part of the connector and non-plateable plastic is used for another part. Upon plating, the plateable plastic becomes electrically conducting.
    Type: Grant
    Filed: January 5, 1989
    Date of Patent: December 18, 1990
    Assignee: McKenzie Technology, Inc.
    Inventor: Joseph A. McKenzie, Jr.
  • Patent number: 4420877
    Abstract: A carrier supports electrically conductive hollow pins for insertion and soldering in terminal lead-holes passing through the non-conductive substrate of a printed circuit board and formation of an electrical socket in the non-conductive substrate. Each hollow pin forms an electrical receptacle contact of the socket having an exposed opening for receiving a mating contact pin terminal of an electrical plug. The carrier includes a support structure for receiving and releasably supporting a plurality of the hollow pins in a selected pattern for inserting in a like plurality of terminal lead-holes arranged in the selected pattern. The carrier also includes a barrier structure joined to the support structure relative to the openings of the supported hollow pins and to the printed circuit board substrate to prevent solder applied to the hollow pins to secure them in the lead-holes from entering the openings.
    Type: Grant
    Filed: March 19, 1981
    Date of Patent: December 20, 1983
    Inventor: Joseph A. McKenzie, Jr.
  • Patent number: 4373655
    Abstract: Component masks are described for preserving unoccupied holes in a printed circuit board when such board is subjected to wave soldering. Each mask is a body of plastic resistant to adherence to the solder and capable of withstanding the temperature of solder when the printed circuit board is subjected to wave soldering and includes a supporting block from which a plurality of parallel pins protrude for reception into the printed circuit board lead-holes to be preserved. The pins are spaced from one another by distances equal to the distances between lead-holes on a printed circuit board, and component masks are provided respectively having a single row and a double row of such pins. Each pin is tapered slightly toward its free end, and is connected to its associated supporting block by a conically shaped transition body.
    Type: Grant
    Filed: June 26, 1980
    Date of Patent: February 15, 1983
    Inventor: Joseph A. McKenzie, Jr.