Abstract: Repair of defects in a printed circuit board, the defects including a break in a strip conductor and a short between two strip conductors, is accomplished by use of a milling machine cutter which is operated in a direction normal to a surface of the board to bring the cutter to a repair site at the defective conductor. The cutter is then advanced partway into the conductor and translated along the conductor in preparation for soldering of braze repairing a break or, alternatively, the cutter is advanced beyond the depth of shorting material after which translation along the surface serves to rout out shorting material. Transverse movement of the cutter also removes any coating which may be present on the circuit board, which coating need be removed prior to soldering or braze repair, and may be replaced after soldering or braze repair. A microscope and pellicule are positioned for aligning the cutter with the repair site.