Patents by Inventor Joseph A. Simpson

Joseph A. Simpson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140020845
    Abstract: An apparatus comprising a first substrate, a second substrate, a bonding layer positioned between the first substrate and the second substrate, the bonding layer holding the first substrate and the second substrate together, and a reactive layer embedded in the bonding layer. The reactive layer can generate sufficient thermal energy to cause the first substrate to separate from the second substrate without damaging at least one of the first substrate or the second substrate when the reactive layer is activated, and is preferably comprised of a reactive multilayer foil.
    Type: Application
    Filed: July 19, 2013
    Publication date: January 23, 2014
    Applicant: Thermal Conductive Bonding, Inc.
    Inventors: Ryan A. Scatena, Andrew P. Stack, Joseph A. Simpson
  • Patent number: D377182
    Type: Grant
    Filed: October 26, 1995
    Date of Patent: January 7, 1997
    Inventor: Joseph A. Simpson