Abstract: A novel basestock composite comprising two copper conducting sheets bonded to insulator layers comprised of fiberglass sheets impregnated with an adhesive such as epoxy, wherein the insulator layers are both affixed to a release layer which is not coextensive with the borders of the insulator layers such that when the basestock is cut at a point internal to its borders and into the release layer the two basestock composites can be separated.

Abstract: Multilayer rigid/flex printed circuits are fabricated from a novel basestock composite (10) comprising two copper conducting sheets (12, 14), bonded to insulator layers (16, 18) comprised of fiberglass sheets impregnated with an adhesive such as epoxy, wherein the insulator layers (16, 18) are both affixed to a release layer (20) is not coextensive with the borders of the insulator layers, then can the basestock composite be imaged and etched on the conductor layers to form conductor patterns (22) and the basestock can be cut at a point (24) internal to its borders and into the release layer (20) thereby separating two imaged and etched conductor layers (22), along with removal of the release material from the insulating layer.

Abstract: A multilayer rigid flex printed circuit board, wherein the board laminate comprises a double-sided basestock composite, formed by laminating two conducting sheets (12 and 14) to an insulating layer, said insulator layer contacting a flexible core (20), a second insulator layer (24 and 26) affixed to each side of the basestock, said insulator having a cutout region proximate to the flexible core of the basestock composite, a flexible layer (28 and 30) affixed to said cutout regions with an adhesive, wherein said flexible layer contacts the conducting layers and abuts and overlaps a portion of the second insulator layer such that upon stacking of the board laminate a hollow region (32) is produced as between the stacked laminate sections.