Abstract: According to various embodiments of the disclosure, an electronic device may include: a housing, a display accommodated inside the housing, a support supporting the display and including a opening and a side wall surrounding the opening, and a heat dissipation structure at least a portion of which is positioned in the opening and bonded to the side wall, wherein the heat dissipation structure may include a heat dissipation layer having a first thermal conductivity and a protective layer having a second thermal conductivity, is the second thermal conductivity being lower than the first thermal conductivity, the protective layer covering at least a portion of the heat dissipation layer.

Abstract: According to an embodiment, a wearable device includes: a frame including at least one inlet, a printed circuit board disposed in the frame, an electronic component disposed on the printed circuit board, and a shield can, disposed on the printed circuit board, at least partially surrounding the electronic component. The wearable device includes a housing, coupled with the shield can. The wearable device includes an actuator facing the housing. The actuator is configured to move air received through the at least one inlet toward the housing.

Abstract: An electronic device including a frame structure and a housing are provided. The frame structure may include a plate, a plurality of first channels, and a plurality of second channels. The plurality of first channels and the plurality of second channels may form a closed loop in the plate. The plurality of first channels may include a first liquid region and a first gas region.

Abstract: According to an embodiment of the disclosure, there may be provided an electronic device comprising: a housing forming an exterior of the electronic device, a printed circuit board on which at least one component is disposed, and a heat dissipation member contacting the at least one component or contacting the at least one component through a thermally conductive material, and including a first plate, a second plate and a wick. The wick may be disposed on a second plate inside the heat dissipation member and include a first portion and a second portion. The first portion may be thicker than the second portion.

Abstract: According to various embodiments of the disclosure, an electronic device may include: a housing, a display accommodated inside the housing, a support supporting the display and including a opening and a side wall surrounding the opening, and a heat dissipation structure at least a portion of which is positioned in the opening and bonded to the side wall, wherein the heat dissipation structure may include a heat dissipation layer having a first thermal conductivity and a protective layer having a second thermal conductivity, is the second thermal conductivity being lower than the first thermal conductivity, the protective layer covering at least a portion of the heat dissipation layer.

Abstract: An electronic device is provided.

Abstract: An electronic device may include: a housing, a support member disposed in an internal space of the housing and including a first surface and a second surface facing a direction opposite the first surface, wherein the support member includes a through hole in at least a portion thereof, and a vapor chamber disposed through at least a portion of the through-hole, wherein the vapor chamber may include: a first plate including a first plate portion including a plurality of pillars and a first flange portion extending along an edge of the first plate portion to have a first width, a second plate having a size corresponding to the first plate portion and including a second plate portion including a recess and a second flange portion extending along an edge of the second plate portion to have a second width less than the first width, and at least one wick disposed in the recess, wherein the wick may be accommodated through a closed space defined through coupling of the first plate and the second plate.

Abstract: An electronic device according to various embodiments comprises: a housing including a heat source and a thermal management chamber thermally coupled to the heat source; and a display disposed on the housing on the opposite side from the heat source. The thermal management chamber includes a working fluid, and is configured to generate bubbles in the working fluid at or above the boiling critical temperature of the working fluid. The thermal management chamber may include: a first wall located adjacent to the heat source and having a first hydrophilic surface; a second wall located on the opposite side from the first wall and spaced apart from the heat source, and having a second hydrophobic surface, and a plurality of third walls located between the first wall and the second wall.

Abstract: Disclosed are glass-glass laminates. A glass-glass laminate includes: a lower glass layer; an adhesive layer on the lower glass layer; an upper glass layer on the adhesive layer; and a decoration layer between the lower glass layer and the adhesive layer or between the upper glass layer and the adhesive layer, wherein the thickness of the upper glass layer is less than the thickness of the lower glass layer, and the thermal expansion coefficient of the upper glass layer is less than the thermal expansion coefficient of the lower glass layer.

Abstract: A method and a system thereof for establishing a model for assessing construction site risk levels through deriving BIM-based hazard factors are proposed. The method includes step S110 of collecting similar study trends, step S120 of analyzing a CSI hazard factor profile database, step S130 of collecting construction company development cases and trends, step S200 of establishing a classification system of a risk assessment DB (110) and including step S210 of systematizing a construction site category, step S220 of deriving a quantitative risk level calculation method, and step S230 of analyzing current risk assessment, step S300 of developing a framework and including step S310 of deriving a construction site hazard factor visualization method and step S320 of developing a risk assessment model framework, step S500 of transmitting BIM-based risk assessment model data, and receiving feedback including supplemented data, and step S600 of establishing the BIM-based risk assessment model.

Abstract: According to various embodiments of the disclosure, an electronic device may include: a housing, a display accommodated inside the housing, a support supporting the display and including a opening and a side wall surrounding the opening, and a heat dissipation structure at least a portion of which is positioned in the opening and bonded to the side wall, wherein the heat dissipation structure may include a heat dissipation layer having a first thermal conductivity and a protective layer having a second thermal conductivity, is the second thermal conductivity being lower than the first thermal conductivity, the protective layer covering at least a portion of the heat dissipation layer.

Abstract: A vapor chamber and an electronic device are provided. The vapor chamber includes a first sheet including a first flat portion and a first bending portion bent, at an edge of the first flat portion, to be inclined at a first angle for the first flat portion, a second sheet including a second flat portion and a second bending portion bent, at an edge of the second flat portion, to be inclined at a second angle for the second flat portion, and a side portion formed by bonding the first bending portion and the second bending portion. A bonding surface between the first bending portion and the second bending portion may be disposed to be inclined from or perpendicular to an outer surface of the side portion.

Abstract: An electronic device may include: a housing, a support member disposed in an internal space of the housing and including a first surface and a second surface facing a direction opposite the first surface, wherein the support member includes a through hole in at least a portion thereof, and a vapor chamber disposed through at least a portion of the through-hole, wherein the vapor chamber may include: a first plate including a first plate portion including a plurality of pillars and a first flange portion extending along an edge of the first plate portion to have a first width, a second plate having a size corresponding to the first plate portion and including a second plate portion including a recess and a second flange portion extending along an edge of the second plate portion to have a second width less than the first width, and at least one wick disposed in the recess, wherein the wick may be accommodated through a closed space defined through coupling of the first plate and the second plate.

Abstract: An electronic device according to various embodiments may include: a housing, a printed circuit board disposed in the housing, an electrical element disposed on the printed circuit board, and a dissimilar metal structure disposed adjacent to the electrical element. The dissimilar metal structure may include a first metal portion comprising a first material, a second metal portion comprising a second material different from the first material, wherein at least a part of the second metal portion is bonded to the first metal portion, a vapor passage disposed in a space surrounded by the first metal portion and the second metal portion, and a wick disposed in contact with at least a part of the vapor passage in the space, wherein when viewed from above the dissimilar metal structure, a welded portion (e.g.