Patents by Inventor Joseph Alphonse Kotylo

Joseph Alphonse Kotylo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Promoting adhesion between a polymer and a metallic substrate
    Patent number: 6908684
    Abstract: A structure comprising a metallic surface, a layer of a polymeric material and a water soluble polymeric material located between the metallic surface and the layer of polymeric material, and process of fabricating such are provided. The structure exhibits enhanced adhesion between the metallic surface and the polymeric material.
    Type: Grant
    Filed: March 3, 2004
    Date of Patent: June 21, 2005
    Assignee: International Business Machines Corporation
    Inventors: Anastasios P. Angelopoulos, Joan Cangelosi, Joseph Alphonse Kotylo, Luis Jesus Matienzo, Norman L. Shaver, Stephen Joseph Fuerniss
  • Promoting adhesion between a polymer and a metallic substrate
    Publication number: 20040166438
    Abstract: A structure comprising a metallic surface, a layer of a polymeric material and a water soluble polymeric material located between the metallic surface and the layer of polymeric material, and process of fabricating such are provided. The structure exhibits enhanced adhesion between the metallic surface and the polymeric material.
    Type: Application
    Filed: March 3, 2004
    Publication date: August 26, 2004
    Applicant: International Business Machines Corporation
    Inventors: Anastasios P. Angelopoulos, Stephen Joseph Fuerniss, Joan Cangelosi, Joseph Alphonse Kotylo, Luis Jesus Matienzo, Norman L. Shaver
  • Promoting adhesion between a polymer and a metallic substrate
    Patent number: 6730409
    Abstract: A structure comprising a metallic surface, a layer of a polymeric material and a water soluble polymeric material located between the metallic surface and the layer of polymeric material, and process of fabricating such are provided. The structure exhibits enhanced adhesion between the metallic surface and the polymeric material.
    Type: Grant
    Filed: May 27, 1999
    Date of Patent: May 4, 2004
    Assignee: International Business Machines Corporation
    Inventors: Anastasios P. Angelopoulos, Stephen Joseph Fuerniss, Joseph Alphonse Kotylo, Luis Jesus Matienzo, Norman L. Shaver
  • Photoresist develop and strip solvent compositions and method for their use
    Patent number: 6127097
    Abstract: Simple, environmentally friendly developers and strippers are disclosed for free radical-initiated, addition polymerizable resists, cationically cured resists and solder masks and photoresists. Both the developers and the strippers include benzyl alcohol, optionally also including a minor amount of methanol, ethanol, isopropyl alcohol, propylene glycol monomethylacetate, ethylene glycol monomethyl ether, formamide, nitromethane, propylene oxide, or methyl ethyl ketone, acetone and water.
    Type: Grant
    Filed: March 18, 1997
    Date of Patent: October 3, 2000
    Assignee: International Business Machines Corporation
    Inventors: Nageshwer Rao Bantu, Anilkumar Chinuprasad Bhatt, Ashwinkumar Chinuprasad Bhatt, Joseph Alphonse Kotylo, Gerald Walter Jones, Robert John Owen, Kostas Papathomas, Anaya Kumar Vardya
  • Method and structure for constraining the flow of incapsulant applied to an I/C chip on a substrate
    Patent number: 5869356
    Abstract: According to the present invention, a technique for controlling the flow of plastic encapsulant which is applied over an integrated circuit (I/C) chip wire bonded to wire pads formed on a chip carrier substrate is provided. This technique includes applying a barrier material to the substrate surrounding the wire bond pads, which barrier material is in the form of two walls projecting upwardly from the surface thereof, and defining a well between the walls to confine the flow of the encapsulant material. This prevents the encapsulant material from flowing past a desired defined boundary and covering the circuit connection pads which are not intended to be covered.
    Type: Grant
    Filed: March 17, 1998
    Date of Patent: February 9, 1999
    Assignee: International Business Machines Corporation
    Inventors: James W. Fuller, Jr., Mary Beth Fletcher, Joseph Alphonse Kotylo, Jeffrey Alan Knight, David Michael Passante, Allen F. Moring
  • Structure for constraining the flow of encapsulant applied to an I/C chip on a substrate
    Patent number: 5784260
    Abstract: According to the present invention, a technique for controlling the flow of plastic encapsulant which is applied over an integrated circuit (I/C) chip wire bonded to wire pads formed on a chip carrier substrate is provided. This technique includes applying a barrier material to the substrate surrounding the wire bond pads, which barrier material is in the form of two walls projecting upwardly from the surface thereof, and defining a well between the walls to confine the flow of the encapsulant material. This prevents the encapsulant material from flowing past a desired defined boundary and covering the circuit connection pads which are not intended to be covered.
    Type: Grant
    Filed: May 29, 1996
    Date of Patent: July 21, 1998
    Assignee: International Business Machines Corporation
    Inventors: James W. Fuller, Jr., Mary Beth Fletcher, Joseph Alphonse Kotylo, Jeffrey Alan Knight, David Michael Passante, Allen F. Moring