Patents by Inventor Joseph B. Brief

Joseph B. Brief has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Decoupling capacitor closely coupled with integrated circuit
    Patent number: 7705450
    Abstract: An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plurality of substrate bonding pads are positioned on the substrate adjacent the integrated circuit die. A decoupling capacitor assembly is mounted on each integrated circuit die and includes a capacitor carrier secured onto the exposed surface of the integrated circuit die and a decoupling capacitor carried by the capacitor carrier. A wire bond extends from the decoupling capacitor assembly to a die pad and from a die pad to a substrate bonding pad.
    Type: Grant
    Filed: November 8, 2006
    Date of Patent: April 27, 2010
    Assignee: Harris Corporation
    Inventors: Robert S. Vinson, Joseph B. Brief, Donald J. Beck, Gregory M. Jandzio
  • Decoupling capacitor closely coupled with integrated circuit
    Patent number: 7642131
    Abstract: An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plurality of substrate bonding pads are positioned on the substrate adjacent the integrated circuit die. A decoupling capacitor assembly is mounted on each integrated circuit die and includes a capacitor carrier secured onto the exposed surface of the integrated circuit die and a decoupling capacitor carried by the capacitor carrier. A wire bond extends from the decoupling capacitor assembly to a die pad and from a die pad to a substrate bonding pad.
    Type: Grant
    Filed: November 8, 2006
    Date of Patent: January 5, 2010
    Assignee: Harris Corporation
    Inventors: Robert S. Vinson, Joseph B. Brief, Donald J. Beck, Gregory M. Jandzio
  • Decoupling capacitor closely coupled with integrated circuit
    Patent number: 7145233
    Abstract: An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plurality of substrate bonding pads are positioned on the substrate adjacent the integrated circuit die. A decoupling capacitor assembly is mounted on each integrated circuit die and includes a capacitor carrier secured onto the exposed surface of the integrated circuit die and a decoupling capacitor carried by the capacitor carrier. A wire bond extends from the decoupling capacitor assembly to a die pad and from a die pad to a substrate bonding pad.
    Type: Grant
    Filed: October 30, 2003
    Date of Patent: December 5, 2006
    Assignee: Harris Corporation
    Inventors: Robert S. Vinson, Joseph B. Brief, Donald J. Beck, Gregory M. Jandzio
  • Decoupling capacitor closely coupled with integrated circuit
    Publication number: 20040075171
    Abstract: An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plurality of substrate bonding pads are positioned on the substrate adjacent the integrated circuit die. A decoupling capacitor assembly is mounted on each integrated circuit die and includes a capacitor carrier secured onto the exposed surface of the integrated circuit die and a decoupling capacitor carried by the capacitor carrier. A wire bond extends from the decoupling capacitor assembly to a die pad and from a die pad to a substrate bonding pad.
    Type: Application
    Filed: October 30, 2003
    Publication date: April 22, 2004
    Applicant: HARRIS CORPORATION
    Inventors: Robert S. Vinson, Joseph B. Brief, Donald J. Beck, Gregory M. Jandzio
  • Decoupling capacitor closely coupled with integrated circuit
    Patent number: 6700794
    Abstract: An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plurality of substrate bonding pads are positioned on the substrate adjacent the integrated circuit die. A decoupling capacitor assembly is mounted on each integrated circuit die and includes a capacitor carrier secured onto the exposed surface of the integrated circuit die and a decoupling capacitor carried by the capacitor carrier. A wire bond extends from the decoupling capacitor assembly to a die pad and from a die pad to a substrate bonding pad.
    Type: Grant
    Filed: July 26, 2001
    Date of Patent: March 2, 2004
    Assignee: Harris Corporation
    Inventors: Robert S. Vinson, Joseph B. Brief, Donald J. Beck, Gregory M. Jandzio
  • Decoupling capacitor closely coupled with integrated circuit
    Publication number: 20030021096
    Abstract: An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plurality of substrate bonding pads are positioned on the substrate adjacent the integrated circuit die. A decoupling capacitor assembly is mounted on each integrated circuit die and includes a capacitor carrier secured onto the exposed surface of the integrated circuit die and a decoupling capacitor carried by the capacitor carrier. A wire bond extends from the decoupling capacitor assembly to a die pad and from a die pad to a substrate bonding pad.
    Type: Application
    Filed: July 26, 2001
    Publication date: January 30, 2003
    Applicant: Harris Corporation
    Inventors: Robert S. Vinson, Joseph B. Brief, Donald J. Beck, Gregory M. Jandzio