Abstract: A method of forming a light emitting diode (LED) for a solid state light engine includes depositing a layer of tacky resin onto a die portion of the LED, adhering a plurality of phosphor particles to the tacky resin, and encapsulating the layer of tacky resin and the plurality of phosphor particles in another layer of resin.

Abstract: A solid state light engine includes a bridge rectifier having a rectified output. At least one light emitting diode (LED) is connected to the bridge rectifier, the at least one LED including a die portion, a layer of phosphor free resin positioned upon the die portion, and a plurality of phosphor particles adhered to the layer of phosphor free resin. A pair of AC power input terminals are electrically connected to the input of the bridge rectifier for use in coupling the bridge rectifier to an AC power source. A pair of DC power input terminals are connected to the rectified output of the bridge rectifier for use in coupling the bridge rectifier to a circuit productive of a DC voltage at the pair of DC power terminals. The layer of phosphor free resin includes a polymeric resin.

Abstract: A solid state light engine includes a bridge rectifier having a rectified output. At least one light emitting diode (LED) is connected to the bridge rectifier, the at least one LED including a die portion, a layer of phosphor free resin positioned upon the die portion, and a plurality of phosphor particles adhered to the layer of phosphor free resin. A pair of AC power input terminals are electrically connected to the input of the bridge rectifier for use in coupling the bridge rectifier to an AC power source. A pair of DC power input terminals are connected to the rectified output of the bridge rectifier for use in coupling the bridge rectifier to a circuit productive of a DC voltage at the pair of DC power terminals. The layer of phosphor free resin includes a polymeric resin.

Abstract: A solid-state light engine comprised of light emitting diodes (LEDs) configured into a bridge rectifier with a current limiting module coupled to the LED bridge rectifier. The light engine may be packaged for high temperature operation. Optionally, the LEDs comprise wavelength-converting phosphors with a persistence that is a multiple of the peak to peak current period, to smooth and mask ripple frequency pulsation of emitted light.

Abstract: A light emitting diode (LED) package for high temperature operation which includes a printed wire board and a heat sink. The LED package may include a formed heat sink layer, which may be thermally coupled to an external heat sink. The printed wire board may include apertures that correspond to the heat sink such that the heat sink is integrated with the printed wire board layer. The LED package may include castellations for mounting the package on a secondary component such as a printed wire board. The LED package may further comprise an isolator disposed between a base metal layer and one or more LED die. The LED package may include a PWB assembly having a stepped cavity, in which one or more LED die are disposed.

Abstract: A light emitting diode (LED) package for high temperature operation which includes a printed wire board and a heat sink. The LED package may include a formed heat sink layer, which may be thermally coupled to an external heat sink. The printed wire board may include apertures that correspond to the heat sink such that the heat sink is integrated with the printed wire board layer. The LED package may include castellations for mounting the package on a secondary component such as a printed wire board. The LED package may further comprise an isolator disposed between a base metal layer and one or more LED die. Optionally, the LED die may be mounted directly on a base metal layer. The LED package may include a PWB assembly having a stepped cavity, in which one or more LED die are disposed. The LED package is advantageously laminated together using a pre-punched pre-preg material or a pressure sensitive adhesive.

Abstract: An optimized light source and a method of manufacturing the same. The light source is made up of an array of individual lighting elements and is optimized for electrical, optical and economic performance, as well as a method for configuring such an array. The a process for selecting individual lighting elements is based on characterizing and sorting individual lighting elements based on performance so that the performance of the overall array is improved by combing individual lighting elements whose individual performance might not otherwise meet the performance of the overall array.

Abstract: A display backlight assembly providing improved optical coupling between a solid state light source and a display optical light guide. The assembly includes an optical coupler to couple the solid state light source and display optical light guide together. In addition, the optical coupler may include a light mixing element for improved mixing of the multi-colored or mono-chromatic light produced by the solid state light source.

Abstract: An LED down light replacement apparatus is disclosed for insertion into a recessed-light housing can, which includes an LED light source, a means for mounting said LED light source within the housing can, an LED driver circuit electrically connected to the LED light source, a heat sink in thermal contact with the LED light source, and means for removing heat generated by the LED light source. The means for removing heat generated by the LED light source can include a fan and/or ventilation holes in the top of the housing can.

Abstract: A solid-state light engine comprised of light emitting diodes (LEDs) configured into a bridge rectifier with a current limiting module coupled to the LED bridge rectifier. The light engine may be packaged for high temperature operation. Optionally, the LEDs comprise wavelength-converting phosphors with a persistence that is a multiple of the peak to peak current period, to smooth and mask ripple frequency pulsation of emitted light.

Abstract: An optimized light source and a method of manufacturing the same. The light source is made up of an array of individual lighting elements and is optimized for electrical, optical and economic performance, as well as a method for configuring such an array. The a process for selecting individual lighting elements is based on characterizing and sorting individual lighting elements based on performance so that the performance of the overall array is improved by combing individual lighting elements whose individual performance might not otherwise meet the performance of the overall array.

Abstract: A light emitting diode (LED) package for high temperature operation which includes a printed wire board and a heat sink. The LED package may include a formed heat sink layer, which may be thermally coupled to an external heat sink. The printed wire board may include apertures that correspond to the heat sink such that the heat sink is integrated with the printed wire board layer. The LED package may include castellations for mounting the package on a secondary component such as a printed wire board. The LED package may further comprise an isolator disposed between a base metal layer and one or more LED die. Optionally, the LED die may be mounted directly on a base metal layer. The LED package may include a PWB assembly having a stepped cavity, in which one or more LED die are disposed. The LED package is advantageously laminated together using a pre-punched pre-preg material or a pressure sensitive adhesive.

Abstract: An LED down light replacement apparatus is disclosed for insertion into a recessed-light housing can, which includes an LED light source, a means for mounting said LED light source within the housing can, an LED driver circuit electrically connected to the LED light source, a heat sink in thermal contact with the LED light source, and means for removing heat generated by the LED light source. The means for removing heat generated by the LED light source can include a fan and/or ventilation holes in the top of the housing can.

Abstract: A power sensing RF termination comprising a calibration means allows the user to correct for part-to-part variation, miss match loss and output offset. The power sensing RF termination comprises a first and second temperature sensitive resistors connected at a first common junction, a switching means for connecting either an RF input or a DC power reference to the first common junction, a first switch for connecting either a DC voltage source or a first current detecting resistor to the first temperature sensitive resistor, and a second current detecting resistor connected to the second temperature sensitive resistor. A first output terminal is connected to the junction between the first switch and the first temperature sensitive resistor. A second output terminal is connected to the first common junction. A third output terminal is connected to the junction between the second temperature sensitive resistor and the second current detecting resistor.

Abstract: A substrate having a diamond or diamond-like carbon coating of at least one micron thickness on an underlayer of an insulating material such as AlN. Such a substrate is advantageously used as a mounting for passive electrical components such as microwave and radio-frequency (rf) resistors, capacitors, attenuators, terminators and loads.

Abstract: A power sensing RF termination comprising a calibration means allows the user to correct for part-to-part variation, miss match loss and output offset. The power sensing RF termination comprises a first and second temperature sensitive resistors connected at a first common junction, a switching means for connecting either an RF input or a DC power reference to the first common junction, a first switch for connecting either a DC voltage source or a first current detecting resistor to the first temperature sensitive resistor, and a second current detecting resistor connected to the second temperature sensitive resistor. A first output terminal is connected to the junction between the first switch and the first temperature sensitive resistor. A second output terminal is connected to the first common junction. A third output terminal is connected to the junction between the second temperature sensitive resistor and the second current detecting resistor.

Abstract: A circuit for determining power changes in an RF circuit includes first and second temperature sensitive resistors connected in parallel with an RF input terminal so as to have a common junction therewith. The first resistor has a positive temperature coefficient of resistance and the second resistor has a negative temperature coefficient of resistance. A DC input terminal is connected to one of the temperature sensitive resistors and an output terminal is connected to the common junction of the two temperature sensitive resistors. Third and fourth temperature sensitive resistors have a common junction. The third resistor has a positive temperature coefficient of resistance and the fourth resistor has a negative temperature coefficient of resistance. The DC input terminal is also connected to one of the third and fourth temperature sensitive resistors, and an output terminal is connected to the common junction of the third and fourth temperature sensitive resistors.

Abstract: A transmission line device includes at least two rectangular plates of an insulating material having opposed planar surfaces and edges. A transmission line of a conductive material is on a surface of at least one of the plates and extends between two opposed edges of the plates. The plate having a transmission line thereon has holes therethrough adjacent its opposed edges, which holes extend to the ends of the transmission line. The holes are filled with a conductive material which makes electrical contact to the ends of the holes. Ground planes of a conductive material are on a surface of the plates. The plates are stacked together with the surface having the transmission lines facing a surface of another plate, and the ground planes facing outwardly. The plates are mechanically secured together either by metal clips or by a suitable cement between the opposed surfaces of the plates. Terminals are at the edges of the plates and are connected to the ends of the transmission line and to the ground planes.