Abstract: The present disclosure describes aspects of an antenna-in-package (AiP) transceiver module and associated methods and systems. In aspects, an AiP transceiver module includes a substrate of dielectric material and first and second layers of conductive material disposed on respective surfaces of the substrate. The first layer of conductive material disposed on a first surface of the substrate includes an antenna element and antenna feed pad to which a contact of a transceiver integrated circuit die is coupled. The second surface of the substrate includes a dielectric interface area that is opposite to an area on the first surface of the substrate in which the antenna element is disposed and excludes the second layer of conductive material. The dielectric interface area of the substrate may effectively increase an amount of dielectric material below the antenna element, such that a volume of the dielectric material includes an air gap below the module.

Abstract: This document describes a multimode high-isolation antenna system and associated methods and systems. The described antenna system is implemented on a generally-circular printed circuit board and can be used for wideband and ultra-wideband applications. The multimode high-isolation antenna system includes two orthogonal antennas separated by a decoupling structure. This arrangement provides high isolation between the antennas and enables five unique resonant modes of operation for the multimode high-isolation antenna system.

Abstract: This document describes a multimode high-isolation antenna system and associated methods and systems. The described antenna system is implemented on a generally-circular printed circuit board and can be used for wideband and ultra-wideband applications. The multimode high-isolation antenna system includes two orthogonal antennas separated by a decoupling structure. This arrangement provides high isolation between the antennas and enables five unique resonant modes of operation for the multimode high-isolation antenna system.

Abstract: This document describes a dual-antenna system for a video-recording doorbell and associated devices and systems. The described antenna system may be implemented on an elongated printed circuit board and can be used for wideband and ultra-wideband applications. For low-cost devices, the dual-antenna system may implement diversity antennas by including first and second substantially orthogonal antennas connected to a chipset configured for single-input single-output (SISO) functionality. The dual-antenna system described herein achieves high antenna isolation and efficiency without a decoupling structure between the first and second antennas. Further, the dual-antenna system achieves high isolation while in proximity to a battery (e.g., a battery within a housing of a battery-powered, video-recording doorbell) and a metal plate for mounting the device to a wall or other structure.

Abstract: This document describes a multimode high-isolation antenna system and associated methods and systems. The described antenna system is implemented on a generally-circular printed circuit board and can be used for wideband and ultra-wideband applications. The multimode high-isolation antenna system includes two orthogonal antennas separated by a decoupling structure. This arrangement provides high isolation between the antennas and enables five unique resonant modes of operation for the multimode high-isolation antenna system.

Abstract: This document describes a dual-antenna system for a video-recording doorbell and associated devices and systems. The described antenna system may be implemented on an elongated printed circuit board and can be used for wideband and ultra-wideband applications. For low-cost devices, the dual-antenna system may implement diversity antennas by including first and second substantially orthogonal antennas connected to a chipset configured for single-input single-output (SISO) functionality. The dual-antenna system described herein achieves high antenna isolation and efficiency without a decoupling structure between the first and second antennas. Further, the dual-antenna system achieves high isolation while in proximity to a battery (e.g., a battery within a housing of a battery-powered, video-recording doorbell) and a metal plate for mounting the device to a wall or other structure.

Abstract: This document describes a dual-antenna system for a video-recording doorbell and associated devices and systems. The described antenna system may be implemented on an elongated printed circuit board and can be used for wideband and ultra-wideband applications. For low-cost devices, the dual-antenna system may implement diversity antennas by including first and second substantially orthogonal antennas connected to a chipset configured for single-input single-output (SISO) functionality. The dual-antenna system described herein achieves high antenna isolation and efficiency without a decoupling structure between the first and second antennas. Further, the dual-antenna system achieves high isolation while in proximity to a battery (e.g., a battery within a housing of a battery-powered, video-recording doorbell) and a metal plate for mounting the device to a wall or other structure.

Abstract: This document describes a multimode high-isolation antenna system and associated methods and systems. The described antenna system is implemented on a generally-circular printed circuit board and can be used for wideband and ultra-wideband applications. The multimode high-isolation antenna system includes two orthogonal antennas separated by a decoupling structure. This arrangement provides high isolation between the antennas and enables five unique resonant modes of operation for the multimode high-isolation antenna system.

Abstract: The present disclosure describes aspects of an antenna-in-package (AiP) transceiver module and associated methods and systems. In aspects, an AiP transceiver module includes a substrate of dielectric material and first and second layers of conductive material disposed on respective surfaces of the substrate. The first layer of conductive material disposed on a first surface of the substrate includes an antenna element and antenna feed pad to which a contact of a transceiver integrated circuit die is coupled. The second surface of the substrate includes a dielectric interface area that is opposite to an area on the first surface of the substrate in which the antenna element is disposed and excludes the second layer of conductive material. The dielectric interface area of the substrate may effectively increase an amount of dielectric material below the antenna element, such that a volume of the dielectric material includes an air gap below the module.

Abstract: This document describes a multimode high-isolation antenna system and associated methods and systems. The described antenna system is implemented on a generally-circular printed circuit board and can be used for wideband and ultra-wideband applications. The multimode high-isolation antenna system includes two orthogonal antennas separated by a decoupling structure. This arrangement provides high isolation between the antennas and enables five unique resonant modes of operation for the multimode high-isolation antenna system.

Abstract: A drainage apparatus for basements includes a conventional block or poured concrete wall supported by a footer having an excavation at its inner side extending to the same level as the lower part of the footer, with an aperture and drain tile positioned in the excavation and extending the length thereof. A cover plate means extends from the drain pipe over to the wall for end support on an inner ledge means on the block wall, whereby a floor section can be laid over the cover plate and drain tile to blend into the remainder of the basement floor.