Abstract: Exemplary embodiments are disclosed of thermal management assemblies suitable for use (e.g., configured for heat spreading, etc.) with transceivers (e.g., small form-factor pluggable (SFP) transceivers, SFP+ transceivers, quad small form-factor pluggable (QSFP) transceivers QSFP+ transceivers, XFP transceivers, etc.) and other devices (e.g., memory card readers, etc.). In exemplary embodiments, a thermal management assembly comprises at least one flexible heat spreading material (e.g., a single graphite sheet, multiple graphite sheets, etc.) including portions wrapped (e.g., in different non-parallel directions, in parallel directions, etc.) around corresponding portions of a part, which may be configured to be coupled to and/or along a side of a device housing. The at least one flexible heat spreading material may be operable for defining at least a portion of a thermally-conductive heat path around the corresponding portions of the part.

Abstract: Exemplary embodiments are disclosed of thermal management assemblies suitable for use (e.g., configured for heat spreading, etc.) with transceivers (e.g., small form-factor pluggable (SFP) transceivers, SFP+ transceivers, quad small form-factor pluggable (QSFP) transceivers QSFP+ transceivers, XFP transceivers, etc.) and other devices (e.g., memory card readers, etc.). In exemplary embodiments, a thermal management assembly comprises at least one flexible heat spreading material (e.g., a single graphite sheet, multiple graphite sheets, etc.) including portions wrapped (e.g., in different non-parallel directions, in parallel directions, etc.) around corresponding portions of a part, which may be configured to be coupled to and/or along a side of a device housing. The at least one flexible heat spreading material may be operable for defining at least a portion of a thermally-conductive heat path around the corresponding portions of the part.

Abstract: According to various aspects, exemplary embodiments are disclosed of EMI shields with increased under-shield space and/or greater component clearance for one or more components under the shield. In an exemplary embodiment, a shield generally includes one or more recessed portions along an inner surface of the cover. Dielectric material is along the inner surface of the cover within at least the one or more recessed portions. The one or more recessed portions may provide increased under-shield space and/or greater clearance for one or more components under the shield. The dielectric material may inhibit the one or more recessed portions of the shield from directly contacting and electrically shorting one or more components when the one or more components are under the shield. Also disclosed are exemplary embodiments of methods relating to making EMI shields and methods relating to providing shielding for one or more components on a substrate.

Abstract: According to various aspects, exemplary embodiments are disclosed of mid-plates and EMI shields for electronic devices. In an exemplary embodiment, a mid-plate generally includes one or more recessed portions along a surface of the mid-plate. A heat spreader is within the one or more recessed portions. Dielectric is along an outward-facing surface of the heat spreader. The dielectric inhibits the heat spreader from directly contacting and electrically shorting one or more components. In another exemplary embodiment, a board level shield (BLS) generally includes a cover having one or more recessed portions along an inner surface of the cover. A heat spreader is within the one or more recessed portions. Dielectric is along an outward-facing surface of the heat spreader, whereby the dielectric inhibits the heat spreader from directly contacting and electrically shorting one or more components when the one or more components are under the BLS.

Abstract: According to various aspects, exemplary embodiments are disclosed of EMI shields with increased under-shield space and/or greater component clearance for one or more components under the shield. In an exemplary embodiment, a shield generally includes one or more recessed portions along an inner surface of the cover. Dielectric material is along the inner surface of the cover within at least the one or more recessed portions. The one or more recessed portions may provide increased under-shield space and/or greater clearance for one or more components under the shield. The dielectric material may inhibit the one or more recessed portions of the shield from directly contacting and electrically shorting one or more components when the one or more components are under the shield. Also disclosed are exemplary embodiments of methods relating to making EMI shields and methods relating to providing shielding for one or more components on a substrate.

Abstract: According to various aspects, exemplary embodiments are provided of electrical contacts, which may be used for establishing an electrical pathway between first and second electrically conductive surfaces. In an exemplary embodiment, an electrical contact may include an electrically conductive base member and at least one resilient contact member. The at least one resilient contact member may have a configuration at least partially defined by a laser cut in or into the electrically conductive base member. The at least one resilient contact member may also be formed so as to protrude outwardly from the electrically conductive base member.

Abstract: According to various aspects, exemplary embodiments are provided of electrical contacts, which may be used for establishing an electrical pathway between first and second electrically conductive surfaces. In an exemplary embodiment, an electrical contact may include an electrically conductive base member and at least one resilient contact member. The at least one resilient contact member may have a configuration at least partially defined by a laser cut in or into the electrically conductive base member. The at least one resilient contact member may also be formed so as to protrude outwardly from the electrically conductive base member.

Abstract: In one exemplary embodiment, an electromagnetic interference (EMI) shielding apparatus generally includes a shield and a gasket. The gasket includes at least one tab formed monolithically with the gasket and attached to a support or portion of the gasket. The at least one tab is movable relative to the support from a first, pre-installed configuration in which the at least one tab is generally co-planar with the support to a second, installed configuration in which the at least one tab extends generally outwardly relative to the support. Movement of the at least one tab from the first configuration to the second configuration may position the at least one tab at least partially within the at least one opening of the shield. Frictional engagement of the at least one tab within the at least one opening may help retain the relative positioning of the gasket to the shield.

Abstract: In one exemplary embodiment, an electromagnetic interference (EMI) shielding apparatus generally includes a shield and a gasket. The gasket includes at least one tab formed monolithically with the gasket and attached to a support or portion of the gasket. The at least one tab is movable relative to the support from a first, pre-installed configuration in which the at least one tab is generally co-planar with the support to a second, installed configuration in which the at least one tab extends generally outwardly relative to the support. Movement of the at least one tab from the first configuration to the second configuration may position the at least one tab at least partially within the at least one opening of the shield. Frictional engagement of the at least one tab within the at least one opening may help retain the relative positioning of the gasket to the shield.