Abstract: The present disclosure describes a probe assembly for use in the testing of integrated circuits. More specifically, the probe assembly finds particular application in high density printed circuit board configurations of flat pack integrated circuit (IC) packages. The invention is characterized by its ability to be readily positioned in either coordinate axis, so as to access all of the IC packages regardless of their mounting position. The probe itself is designed to separate and insulate the IC package leads from one another. Moreover, the point of electrical contact of the probe on the leads is predetermined and reproducible. Finally, the probe automatically locks on to the desired IC leads and exerts a force thereon which is independent of that applied by the operator. Electrical and mechanical damage which might otherwise result to the printed circuit board and the IC package is virtually eliminated by the probe assembly.

Abstract: An item carrier for an item transport system wherein the carrier member is provided with means automatically adjustably movable as a result of the pendulum effect or tilt of the item effective to prevent accidental dislodgement or disengagement of the item from the carrier while simultaneously causing the tilt or pendulum movement thereof to continuously move the item into a tighter engaging position in the carrier with each tilt or swing.