Patents by Inventor Joseph C. Sorbello
Joseph C. Sorbello has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11694992Abstract: An integrated circuit package structure is provided that includes a chip carrier substrate, at least one processor die provided on the chip carrier substrate, a plurality of lateral escape wiring lines connected to and extending away from the at least one processor die, and a plurality of chips at least partially surrounding the processor die, at least one of the chips overlapping with at least one of the lateral escape wiring lines in a plan view. An interconnect structure of the chips includes at least one vertical power feed structure that is configured and positioned not to intersect with the lateral escape wiring lines in the plan view.Type: GrantFiled: February 22, 2021Date of Patent: July 4, 2023Assignee: International Business Machines CorporationInventors: Charles Leon Arvin, Bhupender Singh, Joseph C. Sorbello, Joseph Jacobi, Thomas Edward Lombardi, Shidong Li, Mark William Kapfhammer
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Publication number: 20220271005Abstract: An integrated circuit package structure is provided that includes a chip carrier substrate, at least one processor die provided on the chip carrier substrate, a plurality of lateral escape wiring lines connected to and extending away from the at least one processor die, and a plurality of chips at least partially surrounding the processor die, at least one of the chips overlapping with at least one of the lateral escape wiring lines in a plan view. An interconnect structure of the chips includes at least one vertical power feed structure that is configured and positioned not to intersect with the lateral escape wiring lines in the plan view.Type: ApplicationFiled: February 22, 2021Publication date: August 25, 2022Inventors: Charles Leon Arvin, Bhupender Singh, Joseph C. Sorbello, Joseph Jacobi, Thomas Edward Lombardi, SHIDONG LI, Mark William Kapfhammer
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Patent number: 11053604Abstract: Electroplating techniques including a system for treating a solution for use in an electroplating application and a method for using the system are provided. The system can have: a gas dispersing portion configured to treat the solution by dispersing a gas into the solution to control a concentration of a predetermined cation of a metal to be electroplated in the electroplating application; a filter portion configured to treat the solution by filtering the solution to remove a quantity of metal residue; and a circulation mechanism configured to divert the solution to one of a plating tool and a combination of the gas dispersing portion and the filter portion based on a result of an analysis of the solution.Type: GrantFiled: July 24, 2019Date of Patent: July 6, 2021Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Patent number: 10895017Abstract: Plating bath and well structures and methods are described to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing up the reservoir wall. An electroplating apparatus includes a vessel holding a liquid solution including metal plating material and an organic species, and a method of operating an electroplating apparatus. The apparatus is designed with plating bath and structures and methods to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing or wicking up the inner surfaces of reservoir walls, and to wash them back down on a continuous or cyclical basis in order to maintain a concentration of organic compounds in the plating solution within upper and lower specification limits.Type: GrantFiled: August 22, 2018Date of Patent: January 19, 2021Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Patent number: 10718062Abstract: Plating bath and well structures and methods are described to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing up the reservoir wall. An electroplating apparatus includes a vessel holding a liquid solution including metal plating material and an organic species, and a method of operating an electroplating apparatus. The apparatus is designed with plating bath and structures and methods to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing or wicking up the inner surfaces of reservoir walls, and to wash them back down on a continuous or cyclical basis in order to maintain a concentration of organic compounds in the plating solution within upper and lower specification limits.Type: GrantFiled: July 17, 2019Date of Patent: July 21, 2020Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Publication number: 20190345627Abstract: Electroplating techniques including a system for treating a solution for use in an electroplating application and a method for using the system are provided. The system can have: a gas dispersing portion configured to treat the solution by dispersing a gas into the solution to control a concentration of a predetermined cation of a metal to be electroplated in the electroplating application; a filter portion configured to treat the solution by filtering the solution to remove a quantity of metal residue; and a circulation mechanism configured to divert the solution to one of a plating tool and a combination of the gas dispersing portion and the filter portion based on a result of an analysis of the solution.Type: ApplicationFiled: July 24, 2019Publication date: November 14, 2019Inventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Publication number: 20190338441Abstract: Plating bath and well structures and methods are described to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing up the reservoir wall. An electroplating apparatus includes a vessel holding a liquid solution including metal plating material and an organic species, and a method of operating an electroplating apparatus. The apparatus is designed with plating bath and structures and methods to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing or wicking up the inner surfaces of reservoir walls, and to wash them back down on a continuous or cyclical basis in order to maintain a concentration of organic compounds in the plating solution within upper and lower specification limits.Type: ApplicationFiled: July 17, 2019Publication date: November 7, 2019Inventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Patent number: 10450667Abstract: Electroplating techniques including a system for treating a solution for use in an electroplating application and a method for using the system are provided. The system can have: a gas dispersing portion configured to treat the solution by dispersing a gas into the solution to control a concentration of a predetermined cation of a metal to be electroplated in the electroplating application; a filter portion configured to treat the solution by filtering the solution to remove a quantity of metal residue; and a circulation mechanism configured to divert the solution to one of a plating tool and a combination of the gas dispersing portion and the filter portion based on a result of an analysis of the solution.Type: GrantFiled: October 27, 2014Date of Patent: October 22, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Patent number: 10392720Abstract: Plating bath and well structures and methods are described to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing up the reservoir wall. An electroplating apparatus includes a vessel holding a liquid solution including metal plating material and an organic species, and a method of operating an electroplating apparatus. The apparatus is designed with plating bath and structures and methods to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing or wicking up the inner surfaces of reservoir walls, and to wash them back down on a continuous or cyclical basis in order to maintain a concentration of organic compounds in the plating solution within upper and lower specification limits.Type: GrantFiled: August 22, 2018Date of Patent: August 27, 2019Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Publication number: 20180355506Abstract: Plating bath and well structures and methods are described to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing up the reservoir wall. An electroplating apparatus includes a vessel holding a liquid solution including metal plating material and an organic species, and a method of operating an electroplating apparatus. The apparatus is designed with plating bath and structures and methods to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing or wicking up the inner surfaces of reservoir walls, and to wash them back down on a continuous or cyclical basis in order to maintain a concentration of organic compounds in the plating solution within upper and lower specification limits.Type: ApplicationFiled: August 22, 2018Publication date: December 13, 2018Inventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Publication number: 20180355507Abstract: Plating bath and well structures and methods are described to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing up the reservoir wall. An electroplating apparatus includes a vessel holding a liquid solution including metal plating material and an organic species, and a method of operating an electroplating apparatus. The apparatus is designed with plating bath and structures and methods to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing or wicking up the inner surfaces of reservoir walls, and to wash them back down on a continuous or cyclical basis in order to maintain a concentration of organic compounds in the plating solution within upper and lower specification limits.Type: ApplicationFiled: August 22, 2018Publication date: December 13, 2018Inventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Patent number: 10087546Abstract: Plating bath and well structures and methods are described to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing up the reservoir wall. An electroplating apparatus includes a vessel holding a liquid solution including metal plating material and an organic species, and a method of operating an electroplating apparatus. The apparatus is designed with plating bath and structures and methods to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing or wicking up the inner surfaces of reservoir walls, and to wash them back down on a continuous or cyclical basis in order to maintain a concentration of organic compounds in the plating solution within upper and lower specification limits.Type: GrantFiled: October 24, 2014Date of Patent: October 2, 2018Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Patent number: 10053794Abstract: Electroplating techniques including an electroplating system and a method for using the electroplating system are provided. The electroplating system has: an electroplating apparatus for electroplating a workpiece, the electroplating apparatus has an electroplating tank configured to contain a solution including target organics; a first reservoir configured to receive the solution including the target organics from the electroplating tank, and to hold the solution including the target organics; a foaming mechanism configured to, in the first reservoir, separate the target organics from the solution through foaming action such that the solution with a reduced concentration of the target organics is separated from a foam including the separated target organics; and a diverting mechanism configured to selectively feed the solution with the reduced concentration of the target organics to one of the first reservoir and the electroplating tank of the electroplating apparatus.Type: GrantFiled: September 19, 2017Date of Patent: August 21, 2018Assignee: GLOBALFOUNDRIES INC.Inventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Publication number: 20180016699Abstract: Electroplating techniques including an electroplating system and a method for using the electroplating system are provided. The electroplating system has: an electroplating apparatus for electroplating a workpiece, the electroplating apparatus has an electroplating tank configured to contain a solution including target organics; a first reservoir configured to receive the solution including the target organics from the electroplating tank, and to hold the solution including the target organics; a foaming mechanism configured to, in the first reservoir, separate the target organics from the solution through foaming action such that the solution with a reduced concentration of the target organics is separated from a foam including the separated target organics; and a diverting mechanism configured to selectively feed the solution with the reduced concentration of the target organics to one of the first reservoir and the electroplating tank of the electroplating apparatus.Type: ApplicationFiled: September 19, 2017Publication date: January 18, 2018Inventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Patent number: 9777388Abstract: Electroplating techniques including an electroplating system and a method for using the electroplating system are provided. The electroplating system has: an electroplating apparatus for electroplating a workpiece, the electroplating apparatus has an electroplating tank configured to contain a solution including target organics; a first reservoir configured to receive the solution including the target organics from the electroplating tank, and to hold the solution including the target organics; a foaming mechanism configured to, in the first reservoir, separate the target organics from the solution through foaming action such that the solution with a reduced concentration of the target organics is separated from a foam including the separated target organics; and a diverting mechanism configured to selectively feed the solution with the reduced concentration of the target organics to one of the first reservoir and the electroplating tank of the electroplating apparatus.Type: GrantFiled: October 24, 2014Date of Patent: October 3, 2017Assignee: GLOBALFOUNDRIES INC.Inventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Publication number: 20160115618Abstract: Electroplating techniques including a system for treating a solution for use in an electroplating application and a method for using the system are provided. The system can have: a gas dispersing portion configured to treat the solution by dispersing a gas into the solution to control a concentration of a predetermined cation of a metal to be electroplated in the electroplating application; a filter portion configured to treat the solution by filtering the solution to remove a quantity of metal residue; and a circulation mechanism configured to divert the solution to one of a plating tool and a combination of the gas dispersing portion and the filter portion based on a result of an analysis of the solution.Type: ApplicationFiled: October 27, 2014Publication date: April 28, 2016Inventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Publication number: 20160115617Abstract: Plating bath and well structures and methods are described to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing up the reservoir wall. An electroplating apparatus includes a vessel holding a liquid solution including metal plating material and an organic species, and a method of operating an electroplating apparatus. The apparatus is designed with plating bath and structures and methods to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing or wicking up the inner surfaces of reservoir walls, and to wash them back down on a continuous or cyclical basis in order to maintain a concentration of organic compounds in the plating solution within upper and lower specification limits.Type: ApplicationFiled: October 24, 2014Publication date: April 28, 2016Inventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Publication number: 20160115616Abstract: Electroplating techniques including an electroplating system and a method for using the electroplating system are provided. The electroplating system has: an electroplating apparatus for electroplating a workpiece, the electroplating apparatus has an electroplating tank configured to contain a solution including target organics; a first reservoir configured to receive the solution including the target organics from the electroplating tank, and to hold the solution including the target organics; a foaming mechanism configured to, in the first reservoir, separate the target organics from the solution through foaming action such that the solution with a reduced concentration of the target organics is separated from a foam including the separated target organics; and a diverting mechanism configured to selectively feed the solution with the reduced concentration of the target organics to one of the first reservoir and the electroplating tank of the electroplating apparatus.Type: ApplicationFiled: October 24, 2014Publication date: April 28, 2016Inventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres