Abstract: A light emitting semiconductor mount comprising a metal heat sink support having a top surface partitioned into three steps comprising an upper step, a central step and a lower step. A light emitting semiconductor device is mounted on the central step and a dielectric block mounted in the lower step. The dielectric block has a top surface with two steps, a lower step, positioned adjacent to the central step, and an upper step. A metal film is deposited on the block top surface. The metal film may extend down one side surface of the block to form a contact pad for a power source connection. Means are provided for electrically coupling one terminal of the light emitting semiconductor device to the block lower step. The other terminal of the light emitting semiconductor device comprises the heat sink support per se. The improvement in the mount comprises a flat bar having one end secured to the surface of the block upper step and the other end thereof secured to the surface of the heat sink support upper step.