Patents by Inventor Joseph Callaghan

Joseph Callaghan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8551792
    Abstract: A method of dicing a semiconductor wafer comprises scribing at least one dielectric layer along dice lanes to remove material from a surface of the wafer using a laser with a pulse-width between 1 picosecond and 1000 picoseconds and with a repetition frequency corresponding to times between pulses shorter than a thermal relaxation time of the material to be scribed. The wafer is then diced through a metal layer and at least partially through a substrate of the semiconductor wafer.
    Type: Grant
    Filed: April 30, 2009
    Date of Patent: October 8, 2013
    Assignee: Electro Scientific Industries, Inc.
    Inventors: Adrian Boyle, Joseph Callaghan, Fintan McKiernan
  • Publication number: 20120064695
    Abstract: A method of dicing a semiconductor wafer comprises scribing at least one dielectric layer along dice lanes to remove material from a surface of the wafer using a laser with a pulse-width between 1 picosecond and 1000 picoseconds and with a repetition frequency corresponding to times between pulses shorter than a thermal relaxation time of the material to be scribed. The wafer is then diced through a metal layer and at least partially through a substrate of the semiconductor wafer.
    Type: Application
    Filed: April 30, 2009
    Publication date: March 15, 2012
    Applicant: Electro Scientific Industries, Inc.
    Inventors: Adrian Boyle, Joseph Callaghan, Fintan Mckiernan
  • Publication number: 20110177674
    Abstract: A method and apparatus for machining, or forming a feature in, a patterned silicon wafer includes removing portions of surface layers on the wafer using a first pulsed laser (4) beam with a pulse width between 1 ps and 1000 ps; and removing portions of bulk silicon (1) underlying the surface layers from the wafer using a second pulsed laser (5) beam with a wavelength between 200 nm and 1100 nm. Re-deposited silicon may be removed from the wafer by etching.
    Type: Application
    Filed: March 16, 2009
    Publication date: July 21, 2011
    Applicant: Electro Scientific Industries, Inc.
    Inventors: Aleksej Rodin, Adrian Boyle, Niall Brennan, Joseph Callaghan
  • Publication number: 20090271293
    Abstract: Methods and systems of establishing a shopping assistant utility are described. The method may include receiving product information for products, and based on the received product information, automatically generating a product profile for each of the products. Each product profile includes attributes assigned to the product. The method may further include receiving a search request including search criteria corresponding to at least one of the attributes, and comparing the search criteria with the attribute of the products to determine a level of correlation between each of the products and the search criteria. Further, the method may generate a score assigned to each of the products based on the determined level of correlation and present the products in an ordered list based on the generated scores assigned to each of the products.
    Type: Application
    Filed: April 28, 2008
    Publication date: October 29, 2009
    Applicant: Interactive Luxury Solutions LLC
    Inventors: Alexander Parkhurst, Robert C. Orr, Joseph Callaghan, Ismail S. Abbass