Abstract: Humanized antibodies and antibody fragments thereof that bind to ?v?6 are disclosed. Also disclosed are methods of using these antibodies and antibody fragments to diagnose, treat, and/or prevent ?v?6-mediated diseases such as acute tissue injury, fibrosis, and cancer.

Abstract: A method of preparing an EPDM roofing membrane panel, the method comprising preparing a vulcanizable composition including expandable graphite by mixing an EPDM rubber and expandable graphite, forming a sheet from said vulcanizable composition, preparing a green membrane panel using said sheet, and curing said green membrane panel to form the EPDM roofing membrane panel, where said steps of preparing a vulcanizable composition, said step of forming a sheet, said step of preparing a green membrane, an said step of curing each include a peak temperature at which each of said steps respectively take place, and where the expandable graphite has an onset temperature above said peak temperature of each respective step.

Abstract: Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. The semiconductor active layer and the sacrificial layer may be selectively etched in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. The capping layer and the first portion of the semiconductor active layer may be selectively etched to thereby expose the sacrificial layer.

Abstract: The present disclosure provides antibodies specific for an epitope present on CD22. The antibodies are useful in various treatment, diagnostic, and monitoring applications, which are also provided.

Abstract: A building material comprising a substrate layer and a pressure-sensitive adhesive layer, where the pressure-sensitive adhesive layer includes expandable graphite.

Abstract: A multi-layered membrane comprising a first thermoplastic first layer and a second thermoplastic layer, where the second layer includes expandable graphite.

Abstract: A roll control system (16) for an automotive vehicle (10) is used to actively detect if one of the plurality of the driven wheels (12) is lifted. The system generates a pressure request to determine if the wheel has lifted. By comparing the change in wheel speed of a driven wheel to a change in wheel speed threshold the wheel lift status can be determined. The wheel speed change threshold may be dependent upon various vehicle operating conditions such as powertrain torque, braking torque and/or longitudinal force on the vehicle.

Abstract: Pseudomonas exotoxin A or “PE” is a 66 kD, highly potent, cytotoxic protein secreted by the bacterium Pseudomonas aeruginosa. Various forms of PE have been coupled to other proteins, such as antibodies, to generate therapeutically useful cytotoxin conjugates that selectively target cells of a desired phenotype (such as tumor cells). In the present invention, peptides spanning the sequence of an approximately 38 kD form of Pseudomonas exotoxin A protein were analyzed for the presence of immunogenic CD4+ T cell epitopes. Six immunogenic T cell epitopes were identified. Residues were identified within each epitope for introduction of targeted amino acid substitutions to reduce or prevent immunogenic T-cell responses in PE molecules which may be administered to a heterologous host.

Abstract: A building material comprising a substrate layer and a pressure-sensitive adhesive layer, where the pressure-sensitive adhesive layer includes expandable graphite.

Abstract: Humanized monoclonal antibodies (mAbs) or fragments thereof, to human Cluster of Differentiation 3 (CD3), which confer improved immune stimulation and stability, are disclosed. Pharmaceutical compositions comprising said mAbs and methods of treatment and optionally also prevention of diseases and disorders, such as autoimmune disorders, infectious diseases, and transplant rejection, that are susceptible to amelioration by binding to CD3, are also disclosed.

Abstract: A method for fabricating a substrate having transferable chiplets includes forming a photo-sensitive adhesive layer on a process side of a source substrate including active components or on a patterned side of a transparent intermediate substrate. The transparent intermediate substrate is brought into contact with the source substrate to adhere the active components on the process side to the patterned side of the transparent intermediate substrate via the photo-sensitive adhesive layer therebetween. Portions of the source substrate opposite the process side thereof are removed to singulate the active components. Portions of the photo-sensitive adhesive layer are selectively exposed to electromagnetic radiation through the transparent intermediate substrate to alter an adhesive strength thereof. Portions of the photo-sensitive adhesive layer having a weaker adhesive strength are selectively removed to define breakable tethers comprising portions of the adhesive layer having a stronger adhesive strength.

Abstract: A multi-layered membrane comprising a first thermoplastic first layer and a second thermoplastic layer, where the second layer includes expandable graphite.

Abstract: Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. A step is performed to selectively etch through the semiconductor active layer and the sacrificial layer in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. A step can be performed to selectively etch through the capping layer and the first portion of the semiconductor active layer to thereby expose the sacrificial layer.

Abstract: A hybrid alternating current (AC)/direct current (DC) distribution system for multiple-floor buildings includes per-floor rectifiers for converting supply side AC to DC. Each rectifier is configured to supply a plurality of DC loads associated with one floor of a multiple-floor building. The system further includes per-floor DC busses, each of the DC busses being configured to distribute the DC to the DC loads its respective floor. The system further includes at least one AC bus for supplying AC power to AC loads in the building.

Abstract: The invention provides an antibody or fragment thereof that specifically binds to human endothelial vascular cell adhesion molecule-1 (VCAM-1), wherein the antibody or fragment thereof binds to the extracellular domain of VCAM-1, and wherein the antibody or fragment thereof binds to VCAM-1 when expressed on endothelial cells, wherein the antibody or fragment thereof is a human or humanized antibody, or fragment thereof.

Abstract: An electroluminescent display comprising semiconductor nanocrystals, wherein the semiconductor nanocrystals are selected to emit light at a predetermined wavelength and are disposed in a predetermined pattern. In certain embodiments, semiconductor nanocrystals that emit light at different predetermined wavelengths are disposed in the display to create a predetermined multi-color pattern.

Abstract: Methods, systems, and computer readable media for providing protection of DC building electrical systems are disclosed. According to one aspect, a system for over-current protection of direct current (DC) building electrical systems includes a DC bus for providing DC power to a building and multiple DC feeder conductors for providing DC power to multiple locations within the building. Each DC feeder conductor is connected to the DC bus via a DC protection module having a fuse, a normally closed switch connected in parallel with the fuse, and a circuit breaker connected in series with the fuse and switch, where the switch is controllable to be closed to protect the fuse against transient current conditions and controllable to be open after the transient current conditions have subsided to allow the fuse to operate normally.

Abstract: An energy generation system includes a turbine, an electric generator, a step-up transformer, and a converter. The turbine is operable to extract energy from a fluid flow and convert the extracted energy into mechanical energy. The electric generator is operable to convert the mechanical energy from the turbine into AC electrical energy. The step-up transformer is operable to transfer the AC electrical energy at a lower voltage from the electric generator to a higher voltage. The converter is operable to convert the AC electrical energy at the higher voltage to DC electrical energy. The converter includes a converter leg for a phase of the AC electrical energy. The converter leg has an upper arm with a first plurality of sub-modules and a lower arm with a second plurality of sub-modules. Each sub-module is operable to function as a controlled voltage source.

Abstract: Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. A step is performed to selectively etch through the semiconductor active layer and the sacrificial layer in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. A step can be performed to selectively etch through the capping layer and the first portion of the semiconductor active layer to thereby expose the sacrificial layer.

Abstract: In certain embodiments, this application provides humanized antibodies that bind to the EphB4 protein as well as uses of the antibodies for therapeutic purposes.