Patents by Inventor Joseph Charles Boisvert

Joseph Charles Boisvert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11417788
    Abstract: A type-II tunnel junction is disclosed that includes a p-doped AlGaInAs tunnel layer and a n-doped InP tunnel layer. Solar cells are further disclosed that incorporate the high bandgap type-II tunnel junction between photovoltaic subcells.
    Type: Grant
    Filed: November 19, 2010
    Date of Patent: August 16, 2022
    Assignee: THE BOEING COMPANY
    Inventors: Robyn L. Woo, Daniel C. Law, Joseph Charles Boisvert
  • Patent number: 11081609
    Abstract: A semiconductor structure including a bonding layer connecting a first semiconductor wafer layer to a second semiconductor wafer layer, the bonding layer including an electrically conductive carbonaceous component and a binder component.
    Type: Grant
    Filed: February 23, 2015
    Date of Patent: August 3, 2021
    Assignee: The Boeing Company
    Inventors: Andreea Boca, Daniel C. Law, Joseph Charles Boisvert, Nasser H. Karam
  • Patent number: 9395182
    Abstract: A laser detection and ranging (LADAR) system is provided for generating a three-dimensional image of an object. The LADAR system includes a laser source configured to project a laser beam onto the object, and a photodiode detector array configured to detect a reflection of the laser beam projected onto the object. The photodiode detector array includes a back interface, a front interface positioned opposite the back interface, and a passivation region disposed between the back interface and the front interface. The back interface includes at least one window, and the front interface includes at least one active region oriented to detect a photon associated with the reflection. The at least one active region includes an absorber and a multiplier. The filter is configured to have a bandgap between an absorber bandgap and a multiplier bandgap.
    Type: Grant
    Filed: March 3, 2011
    Date of Patent: July 19, 2016
    Assignee: The Boeing Company
    Inventors: Ping Yuan, Joseph Charles Boisvert
  • Publication number: 20150171253
    Abstract: A semiconductor structure including a bonding layer connecting a first semiconductor wafer layer to a second semiconductor wafer layer, the bonding layer including an electrically conductive carbonaceous component and a binder component.
    Type: Application
    Filed: February 23, 2015
    Publication date: June 18, 2015
    Inventors: Andreea Boca, Daniel C. Law, Joseph Charles Boisvert, Nasser H. Karam
  • Patent number: 8993879
    Abstract: A semiconductor structure including a bonding layer connecting a first semiconductor wafer layer to a second semiconductor wafer layer, the bonding layer including an electrically conductive carbonaceous component and a binder component.
    Type: Grant
    Filed: June 14, 2010
    Date of Patent: March 31, 2015
    Assignee: The Boeing Company
    Inventors: Andreea Boca, Daniel C. Law, Joseph Charles Boisvert, Nasser H. Karam
  • Patent number: 8642883
    Abstract: A solar cell including a base semiconductor layer having a first bandgap, an emitter semiconductor layer having a second bandgap and a depletion semiconductor layer positioned between the base semiconductor layer and the emitter semiconductor layer, the depletion semiconductor layer having a third bandgap, wherein the third bandgap is greater than the first bandgap and the second bandgap.
    Type: Grant
    Filed: August 9, 2010
    Date of Patent: February 4, 2014
    Assignee: The Boeing Company
    Inventors: Joseph Charles Boisvert, Daniel C. Law, Richard R. King, Christopher M. Fetzer
  • Publication number: 20120125392
    Abstract: A type-II tunnel junction is disclosed that includes a p-doped AlGaInAs tunnel layer and a n-doped InP tunnel layer. Solar cells are further disclosed that incorporate the high bandgap type-II tunnel junction between photovoltaic subcells.
    Type: Application
    Filed: November 19, 2010
    Publication date: May 24, 2012
    Applicant: THE BOEING COMPANY
    Inventors: Robyn L. WOO, Daniel C. LAW, Joseph Charles BOISVERT
  • Publication number: 20120031478
    Abstract: A solar cell including a base semiconductor layer having a first bandgap, an emitter semiconductor layer having a second bandgap and a depletion semiconductor layer positioned between the base semiconductor layer and the emitter semiconductor layer, the depletion semiconductor layer having a third bandgap, wherein the third bandgap is greater than the first bandgap and the second bandgap.
    Type: Application
    Filed: August 9, 2010
    Publication date: February 9, 2012
    Applicant: THE BOEING COMPANY
    Inventors: Joseph Charles Boisvert, Daniel C. Law, Richard R. King, Christopher M. Fetzer
  • Publication number: 20110303288
    Abstract: A semiconductor structure including a bonding layer connecting a first semiconductor wafer layer to a second semiconductor wafer layer, the bonding layer including an electrically conductive carbonaceous component and a binder component.
    Type: Application
    Filed: June 14, 2010
    Publication date: December 15, 2011
    Applicant: THE BOEING COMPANY
    Inventors: Andreea Boca, Daniel C. Law, Joseph Charles Boisvert, Nasser H. Karam
  • Patent number: 7598582
    Abstract: A photodetector and a method for fabricating a photodetector. The photodetector may include a substrate, a buffer layer formed on the substrate, and an absorption layer formed on the buffer layer for receiving incident photons and generating charged carriers. An N-doped interface layer may be formed on the absorption layer, an N-doped cap layer may be formed on the N-doped interface layer, and a dielectric passivation layer may be formed above the cap layer. A P+ diffusion region may be formed within the cap layer, the N-doped interface layer and at least a portion of the absorption layer, and at least one contact may be formed on and coupled to the P+ diffusion region.
    Type: Grant
    Filed: June 13, 2007
    Date of Patent: October 6, 2009
    Assignee: The Boeing Company
    Inventors: Joseph Charles Boisvert, Takahiro D. Isshiki, Rengarajan Sudharsanan
  • Publication number: 20080308891
    Abstract: A photodetector and a method for fabricating a photodetector. The photodetector may include a substrate, a buffer layer formed on the substrate, and an absorption layer formed on the buffer layer for receiving incident photons and generating charged carriers. An N-doped interface layer may be formed on the absorption layer, an N-doped cap layer may be formed on the N-doped interface layer, and a dielectric passivation layer may be formed above the cap layer. A P+ diffusion region may be formed within the cap layer, the N-doped interface layer and at least a portion of the absorption layer, and at least one contact may be formed on and coupled to the P+ diffusion region.
    Type: Application
    Filed: June 13, 2007
    Publication date: December 18, 2008
    Inventors: Joseph Charles Boisvert, Takahiro D. Isshiki, Rengarajan Sudharsanan