Abstract: A combination insole board includes a shock diffusion plate for diffusing the shock of a heel strike and for providing torsional stiffness in the heel and midfoot areas and includes a flexible material in the forepart of the insole board. The semi-rigid shock diffusion shock diffusion plate is engineered with a contour which loosely correlates to the foot morphology. At least two alternative shoe construction methodologies may be used for incorporating a combination insole board into a shoe according to the present invention. In a first embodiment, the shock diffusion plate is attached to the flexible forepart to form the combination insole board. In this embodiment, the combination insole board is tacked to a shoemaker's last either mechanically or adhesively, an upper having a sufficient lasting margin extending beyond the feather edge is pulled over the last and the lasting margin is attached to the combination insole board with a suitable adhesive.