Abstract: A method for manufacturing open cavity integrated circuit packages, the method comprising: placing a wire-bound integrated circuit in a mold; forcing a pin to contact a die of the wire-bound integrated circuit by applying a force between the pin and the mold; injecting plastic into the mold; allowing the plastic to set around the integrated circuit to form a package having an open cavity defined by the pin; and removing the open cavity integrated circuit package from the mold. A mold for forming a package for an integrated circuit sensor device, comprising: a bottom part for supporting an integrated circuit die; a top part that is operable to be placed on top of said bottom part to form a cavity into which a plastic material can be injected to form the package, wherein the top part of the mold comprises a spring-loaded pin arrangement comprising a cover that covers a sensor area on the integrated circuit die and provides for an opening when the plastic material is injected.

Abstract: A method for manufacturing open cavity integrated circuit packages, the method comprising: placing a wire-bound integrated circuit in a mold; forcing a pin to contact a die of the wire-bound integrated circuit by applying a force between the pin and the mold; injecting plastic into the mold; allowing the plastic to set around the integrated circuit to form a package having an open cavity defined by the pin; and removing the open cavity integrated circuit package from the mold. A mold for forming a package for an integrated circuit sensor device, comprising: a bottom part for supporting an integrated circuit die; a top part that is operable to be placed on top of said bottom part to form a cavity into which a plastic material can be injected to form the package, wherein the top part of the mold comprises a spring-loaded pin arrangement comprising a cover that covers a sensor area on the integrated circuit die and provides for an opening when the plastic material is injected.

Abstract: A method for manufacturing open cavity integrated circuit packages, the method comprising: placing a wire-bound integrated circuit in a mold; forcing a pin to contact a die of the wire-bound integrated circuit by applying a force between the pin and the mold; injecting plastic into the mold; allowing the plastic to set around the integrated circuit to form a package having an open cavity defined by the pin; and removing the open cavity integrated circuit package from the mold. A mold for forming a package for an integrated circuit sensor device, comprising: a bottom part for supporting an integrated circuit die; a top part that is operable to be placed on top of said bottom part to form a cavity into which a plastic material can be injected to form the package, wherein the top part of the mold comprises a spring-loaded pin arrangement comprising a cover that covers a sensor area on the integrated circuit die and provides for an opening when the plastic material is injected.

Abstract: A method for manufacturing an integrated circuit device is disclosed. A leadframe is provided having a die support area configured to receive an integrated circuit die and a plurality of leadframe fingers adjacent the die support area, each leadframe finger including a finger tip area at one end of the leadframe finger. The leadframe is masked such that one or more areas of the leadframe are covered and one or more areas of the leadframe are exposed, wherein for each leadframe finger, a first region of the respective finger tip area is covered by the masking and a second region of the respective finger tip area is exposed. The one or more exposed areas of the leadframe are silver plated such for each leadframe finger, the second region of the respective finger tip area is sliver plated and the first region of the respective finger tip area is not sliver plated.

Abstract: A method for manufacturing open cavity integrated circuit packages, the method comprising: placing a wire-bound integrated circuit in a mold; forcing a pin to contact a die of the wire-bound integrated circuit by applying a force between the pin and the mold; injecting plastic into the mold; allowing the plastic to set around the integrated circuit to form a package having an open cavity defined by the pin; and removing the open cavity integrated circuit package from the mold. A mold for forming a package for an integrated circuit sensor device, comprising: a bottom part for supporting an integrated circuit die; a top part that is operable to be placed on top of said bottom part to form a cavity into which a plastic material can be injected to form the package, wherein the top part of the mold comprises a spring-loaded pin arrangement comprising a cover that covers a sensor area on the integrated circuit die and provides for an opening when the plastic material is injected.

Abstract: A system including a shuttle movable along a shuttle path, the shuttle being operable to support a sheet; a pick-up assembly including a yoke and a detection plate located above the shuttle path, the detection plate being freely supported by the yoke and movable in a vertical direction relative to the yoke with an upper limit and a lower limit defined by the yoke, wherein the yoke is operable to pick and place the sheet, and wherein the detection plate is used to detect the presence of a piece of debris on a surface of the sheet or a surface of the shuttle; and a cleaning device located adjacent to the pick-up assembly and above the shuttle path, wherein the cleaning device is operable to remove the piece of debris located on the surface of the sheet or the surface of the shuttle.

Abstract: An integrated circuit device comprising an integrated circuit die having a plurality of bond pads that are selectively connected to a plurality of inner leads of a leadframe. At least two bond pads are connected to at least one of the inner leads, and/or at least two inner leads are connected to at least one of bond pads with a single bond wire. A single bond wire is ball or wedge bonded to a first bond pad or inner lead and subsequently wedge bonded to one or more second bond pads or inner leads, then it is connected to a third or last bond pad or inner lead. The single bond wire requires only one connection area at each of the bond pad(s) and/or inner lead(s). The bond pad(s) of the die and/or inner lead(s) of the leadframe are thereby electrically connected together by the single bond wire.

Abstract: An integrated circuit device comprising an integrated circuit die mounted on a leadframe having a plurality of inner leads. The integrated circuit die has a plurality of bond pads that are electrically connected to the inner leads of the leadframe, wherein at least two bond pads are connected to a one of the plurality of inner leads and/or at least two inner leads are connected to one or more bond pads with a single bond wire. A single bond wire is connected to a first bond pad or inner lead and subsequently wedge or stitch bonded to a second bond pad or inner lead, then it is connected to a third bond pad or inner lead. The single bond wire requires only one connection area at each of the bond pad(s) and inner lead(s). The bond pad(s) of the die and inner lead(s) of the leadframe are thereby electrically connected together by the single bond wire.

Abstract: An integrated circuit device comprising an integrated circuit die mounted on a leadframe having a plurality of inner leads. The integrated circuit die has a plurality of bond pads that are electrically connected to the inner leads of the leadframe, wherein at least two bond pads are connected to a one of the plurality of inner leads and/or at least two inner leads are connected to one or more bond pads with a single bond wire. A single bond wire is connected to a first bond pad or inner lead and subsequently wedge or stitch bonded to a second bond pad or inner lead, then it is connected to a third bond pad or inner lead. The single bond wire requires only one connection area at each of the bond pad(s) and inner lead(s). The bond pad(s) of the die and inner lead(s) of the leadframe are thereby electrically connected together by the single bond wire.

Abstract: An integrated device comprises a lead frame having a plurality of inner leads. Furthermore, a first integrated chip is provided that has a plurality of first bond pads for electronically connecting the chip which is attached to the lead frame. A second integrated chip is provided, being smaller than the first chip, and having a plurality of second bond pads. The second chip is attached on top of the first chip. For interconnection, at least one bond wire connects one of the second bond pads of the second chip with one of the first bond pads of the first chip.

Abstract: An integrated circuit package that has the ability for interdevice communication. The integrated circuit package has a first device mounted within the integrated circuit package. A second device is also mounted within the integrated circuit package. The second device is directly coupled to the first device through interdevice bonding for allowing the first device and the second device to communicate and control one another.

Abstract: An integrated circuit package that has the ability for interdevice communication. The integrated circuit package has a first device mounted within the integrated circuit package. A second device is also mounted within the integrated circuit package. The second device is directly coupled to the first device through interdevice bonding for allowing the first device and the second device to communicate and control one another.

Abstract: An integrated circuit package that has the ability for interdevice communication. The integrated circuit package has a first device mounted within the integrated circuit package. A second device is also mounted within the integrated circuit package. The second device is directly coupled to the first device through interdevice bonding for allowing the first device and the second device to communicate and control one another.

Abstract: An apparatus and method is disclosed for removing a selected semiconductor chip from a semiconductor wafer. The selected semiconductor chip is elevated by the use of an X--Y--Z assembly by having a rounded tip portion of a round probe member assembly that is part of the X--Y--Z assembly contact a back portion of a flexible, transparent backing layer beneath the selected semiconductor chip so that removal of the semiconductor chip can be completed by using a vacuum type pencil.