Abstract: An apparatus is provided for detecting whether a person has handled explosives, narcotics or other substances of interest. The apparatus includes a metallic sample collection surface on which a person may place a finger. Upon removal of the finger, the metallic sample collection surface is moved to a desorber. The desorber heats the metallic surface sufficiently to vaporize residue transferred from the person. The vaporized residue then is transmitted to a detector for analysis. The detector also may include a fingerprint reading apparatus for reading the fingerprint of the person and comparing the fingerprint to known fingerprint data.

Abstract: A device is provided for testing surfaces of a card for the presence of explosives, drugs or other substances of interest. The device includes a slot for receiving the card. Thin metallic wiper blades are dispose in alignment with the slot and wipe over surfaces of the card as the card is passed through the slot. Thus, substances on the surface of the card are transferred to the wiper blade. The wiper blade then is enclosed and rapidly heated to desorb the material retrieved from the card. The enclosure then is placed in communication with a detector to test for the presence of substances of interest.

Abstract: An apparatus is provided for detecting whether a person has handled explosives, narcotics or other substances of interest. The apparatus includes a metallic sample collection surface on which a person may place a finger. Upon removal of the finger, the metallic sample collection surface is moved to a desorber. The desorber heats the metallic surface sufficiently to vaporize residue transferred from the person. The vaporized residue then is transmitted to a detector for analysis. The detector also may include a fingerprint reading apparatus for reading the fingerprint of the person and comparing the fingerprint to known fingerprint data.

Abstract: A detector requires a stream of dry air for transporting particles to the detector. The detector then operates to determine whether the dry air has transported any particles of interest. Continuous operation of the detector is permitted by providing first and second dryers that can be operated alternately for drying air that is to be directed to the detector. The dryer that is not being operated is recharged. Air is directed alternately between the first and second dryer to ensure that neither dryer is operated after reaching saturation.

Abstract: An integrated wafer processing system having a wafer queuing station and a plurality of plasma reactors connected to peripheral walls of a central vacuum chamber. Vacuum valves separate the central chamber from the queuing station and the plasma reactors. A wafer transfer arm capable of R-&THgr; motion can transfer wafers between the queuing station and any of the plasma reactors in either a single-step or a multi-step process.

Abstract: A detector requires a stream of dry air for transporting particles to the detector. The detector then operates to determine whether the dry air has transported any particles of interest. Continuous operation of the detector is permitted by providing first and second dryers that can be operated alternately for drying air that is to be directed to the detector. The dryer that is not being operated is recharged. Air is directed alternately between the first and second dryer to ensure that neither dryer is operated after reaching saturation.

Abstract: An integrated wafer processing system having a wafer queuing station and a plurality of plasma reactors connected to peripheral walls of a central vacuum chamber. Vacuum valves separate the central chamber from the queuing station and the plasma reactors. A wafer transfer arm capable of R-&THgr; motion can transfer wafers between the queuing station and any of the plasma reactors in either a single-step or a multi-step process.

Abstract: An integrated wafer processing system having a wafer queuing station and a plurality of plasma reactors connected to peripheral walls of a central vacuum chamber. Vacuum valves separate the central chamber from the queuing station and the plasma reactors. A wafer transfer arm capable of R-&THgr; motion can transfer wafers between the queuing station and any of the plasma reactors in either a single-step or a multi-step process.

Abstract: An integrated wafer processing system having a wafer queuing station and a plurality of plasma reactors connected to peripheral walls of a central vacuum chamber. Vacuum valves separate the central chamber from the queuing station and the plasma reactors. A wafer transfer arm capable of R-&THgr; motion can transfer wafers between the queuing station and any of the plasma reactors in either a single-step or a multi-step process.

Abstract: The present invention includes plural plasma processing vessels and a wafer queuing station arrayed with a wafer transfer arm in a controlled environment. Wafers are movable within the controlled environment one at a time selectably between the several plasma vessels and the wafer queuing station without atmospheric or other exposure so that possible contamination of the moved wafers is prevented. The system is selectively operative in either single-step or multiple-step processing modes, and in either of the modes, the several plasma etching vessels are operable to provide a desirably high system throughput. In the preferred embodiment, the several plasma vessels and the queuing station are arrayed about a closed pentagonal locus with the wafer transfer arm disposed within the closed locus.

Abstract: A substrate processing system is provided that includes substrate processing vessels, a substrate queuing station, a substrate transfer device, and a processor. The processor, in communication with the processing vessels, the queuing station, and the transfer device, provides selectable single and multi-step processing of the substrates by accessing a process command for a given substrate corresponding to desired processing of the substrate.

Abstract: The present invention includes plural plasma etching vessels and a wafer queuing station arrayed with a wafer transfer arm in a controlled environment. Wafers are movable within the controlled environment one at a time selectably between the several plasma vessels and the wafer queuing station without atmospheric or other exposure so that possible contamination of the moved wafers is prevented. The system is selectively operative in either single-step or multiple-step processing modes, and in either of the modes, the several plasma etching vessels are operable to provide a desirably high system throughput. In the preferred embodiment, the several plasma vessels and the queuing station are arrayed about a closed pentagonal locus with the wafer transfer arm disposed within the closed locus.

Abstract: The present invention includes plural plasma etching vessels and a wafer queuing station arrayed with a wafer transfer arm in a controlled environment. Wafers are movable within the controlled environment one at a time selectably between the plasma vessels and the wafer queuing station without atmospheric or other possible contamination. The system is selectively operative in either single-step or multiple-step processing modes. In the preferred embodiment, the plasma vessels and the queuing station are arrayed about a closed pentagonal locus with the wafer transfer arm disposed within the closed locus. The wafer transfer arm is movable between the plasma etching vessels and the wafer queuing station. Selectably actuable vacuum locks are provided between the plasma etching vessels and the wafer transfer arm to maintain an intended atmospheric condition and to allow wafer transport therethrough. The plasma vessels each include first and second water-cooled electrodes that are movable relatively to each other.

Abstract: Plural plasma etching vessels and a wafer queuing station are arrayed about a closed pentagonal locus with a wafer transfer arm therewithin all in a controlled vacuum environment. Wafers are movable within the controlled environment between the several plasma vessels and the wafer queuing station without atmospheric or other exposure so that possible contamination of the moved wafers is prevented. The system is selectively operative in either single-step or multiple-step processing modes, and in either of the modes, the several plasma etching vessels are operable to provide a desirably high system throughput. Wafer processing in each vessel is regulated by a state controller for processing a plurality of wafers from a single cassette, contained within the vacuum environment of the plural plasma etching vessels and wafer queuing station, to provide an orderly and efficient throughput of wafers for diverse or similar processing in the plural vessels. The wafer transfer arm is movable in R and .theta..

Abstract: A system for multichamber processing of semiconductor wafers providing flexibility in the nature of processing available in a multi processing facility. To accommodate changing processing demands and chamber replacement, a mobile processing chamber selectively docks with a multiple chamber system to form one of its processing chambers. The capabilities of the multiprocessing multichamber system are enhanced by extending the system to other multichamber systems through intermediate buffer storage wafer cassette and elevator systems. The extending multichamber system is further provided with intermediate access wafer storage elevator cassettes.

Abstract: The present invention includes plural plasma etching vessels and a wafer queuing station arrayed with a wafer transfer arm in a controlled environment. Wafers are movable within the controlled environment one at a time selectably between the several plasma vessels and the wafer queuing station without atmospheric or other exposure to that possible contamination of the moved wafers is prevented. The system is selectively operative in either single-step or multiple-step processing modes, and in either of the modes, the several plasma etching vessels are operable to provide a desirably high system throughput. In the preferred embodiment, the several plasma vessels and the queuing station are arrayed about a closed pentagonal locus with the wafer transfer arm disposed within the closed locus.

Abstract: The present invention includes plural plasma etching vessels and a wafer queuing station arrayed with a wafer transfer arm in a controlled environment. Wafer processing in each vessel is regulated by a state controller for processing a plurality of wafers from a single cassette, contained within the vacuum environment of the plural plasma etching vessels and wafer queuing station, to provide an orderly and efficient throughput of wafers for diverse or similar processing in the plural vessels. In this manner a wafer can be processed as soon as a vessel becomes available.

Abstract: The present invention includes a method for applying bus bars to a solar cell by one single solder dipping operation. The bus bars are first temporarily spot attached to the pre-metallized surface of a solar cell by means of a high temperature adhesive. The solar cell and bus bars are then solder dipped allowing the solder to flow between the bus bars and solar cell surface by capillary action, adjacent the adhesive.

Abstract: A solar power module comprising an array of solar cells arranged on a flat panel, said panel being supported by a substantially rigid, easily assembled frame comprising spaced apart side channels that each interlock with adjacent and channels.

Abstract: A consolidated input connector-selector switch and calibration switch for a medical instrument wherein the input connector and switch is mounted in the medical instrument housing partially in registry with an opening through the panel thereof. The selector switch is a multi-position rotary switch of a plurality of input and output terminals rotatable through a discrete number of positions. The switch is adapted to receive a connector having a plurality of signal leads and is operably connected with through drive means with the selector switch by rotation of the input connector rotates the selector switch. Additionally, the combination connector-selector switch is movable between forward and rearward positions being preferably biased forwardly and coupled with calibration switch means such that axial movement of the connector-selector switch combination actuates the calibration function within the medical instrument.