Abstract: A memory module includes a printed circuit board and a Low-Power Double Data Rate (LPDDR) memory device. The printed circuit board includes surface contact connections on a first surface of the printed circuit board and located at a first portion of the printed circuit board. The LPDDR memory device is on a second surface of the printed circuit board and located at a second portion of the printed circuit board. The LPDDR memory device is configured to be coupled to an information handling system via the surface contact connections. The second portion of the printed circuit board is adjacent to the first portion of the printed circuit board.

Abstract: Embodiments of systems and methods for a Compression Attached Memory Module (CAMM) for Low-Power Double Data Rate (LPDDR) memories are described. In an illustrative, non-limiting embodiment, an Information Handling System (IHS) may include: a compression Dual In-Line Memory Module (cDIMM) connector coupled to a motherboard; and a memory module coupled to the cDIMM connector, where the memory module comprises an LPDDR device coupled to a top surface of the memory module and accessible via surface contact connections disposed on a bottom surface of the memory module.

Abstract: An information handling system includes a first z-axis compression connector, a first dual in-line memory module (DIMM), a second z-axis compression connector, a second DIMM, and a printed circuit board. A first side of the first compression connector is affixed to the printed circuit board. A first surface of a first memory circuit board of the first DIMM is affixed to a second side of the compression connector. A first side of the second compression connector is affixed to a second side of the first memory circuit board. A first side of a second memory circuit board of the second DIMM is affixed to a second side of the second compression connector. The first compression connector has a first depth, and the second compression connector has a second depth that is different from the first depth.

Abstract: Information handling system (IHS) heatsinking systems and methods may employ a thermally conductive compression attached memory module (CAMM) bolster plate affixed to one surface of a circuit board of the CAMM, between a central processing unit (CPU) of the IHS and memory devices mounted on the CAMM, to provide compression between the CAMM and a z-axis compression connector and to capture and dissipate heat from the CPU and the memory devices. Spacing between the CPU and the DIMM may enable this capture and dissipation of heat from the CPU. The bolster plate may be configured to receive at least one conductive fastener that bears on the bolster plate and presses the CAMM to the z-axis compression connector, and to conductively thermally couple the CAMM and bolster plate to a ground plane of a system printed circuit board (PCB) mounting the CPU and the CAMM.

Abstract: An information handling system includes a printed circuit board, a z-axis compression connector, and a compression attached memory module (CAMM). The compression connector coupled receives a first memory channel and a second memory channel from the PCB. The CAMM receives the first memory channel and the second memory channel from the first compression connector. The CAMM is configured to provide memory transaction on only the first memory channel.

Abstract: A compression attached memory module (CAMM) includes a memory device, a first array of compression contact pads and a second array of compression contact pads. The first array of compression contact pads receives a first memory channel and a second memory channel. The first memory channel is coupled to the first memory device. The second array of compression contact pads is coupled to a subset of the first compression contact pads associated with the second memory channel.

Abstract: An information handling system includes a first z-axis compression connector having a first depth, a first memory module, a second z-axis compression connector having a second depth that is greater than the first depth, a second memory module, and a printed circuit board. A first side of the first compression connector is affixed to the printed circuit board at a first location and a first surface of a first memory circuit board of the first memory module is affixed to a second side of the first compression connector. A first side of the second compression connector is affixed to the printed circuit board at a second location adjacent to the first location and the first side of a second memory circuit board of the second memory module is affixed to a second side of the second compression connector.

Abstract: A z-axis compression connector includes a plurality of high-speed signal contacts arranged in a grid of M rows by N columns, and a plurality of signal return contacts arranged between the N columns. A first signal return contact is positioned mid-way in line between a first signal contact and a second signal contact, where the first signal contact is in a first row and a first column and the second signal contact is in the first row and a second column adjacent to the first column.

Abstract: An information handling system includes a first z-axis compression connector, a first dual in-line memory module (DIMM), a second z-axis compression connector, a second DIMM, and a printed circuit board. A first side of the first compression connector is affixed to the printed circuit board. A first surface of a first memory circuit board of the first DIMM is affixed to a second side of the compression connector. A first side of the second compression connector is affixed to a second side of the first memory circuit board. A first side of a second memory circuit board of the second DIMM is affixed to a second side of the second compression connector. The first compression connector has a first depth, and the second compression connector has a second depth that is different from the first depth.

Abstract: An information handling system includes a first z-axis compression connector, a first dual in-line memory module (DIMM), a second z-axis compression connector, a second DIMM, and a printed circuit board. A first side of the first compression connector is affixed to the printed circuit board. A first surface of a first memory circuit board of the first DIMM is affixed to a second side of the compression connector. A first side of the second compression connector is affixed to a second side of the first memory circuit board. A first side of a second memory circuit board of the second DIMM is affixed to a second side of the second compression connector. The first compression connector has a first depth, and the second compression connector has a second depth that is different from the first depth.

Abstract: A Dual In-Line Memory Module (DIMM) includes a plurality of memory devices mounted on a circuit board of the DIMM. The memory devices are arranged to be accessed via at least two memory channels. The DIMM further includes an array of surface contact connections. Each surface contact connection is configured to be engaged with an associated contact element of a z-axis compression connector. The array of surface contact connections are arranged to conduct signals for the memory channels. The memory devices are placed upon the memory circuit board in an array of X rows of memory devices and Y columns of memory devices, where X and Y are integers. When the DIMM has a first number of the memory devices A=X1×Y1 that is less than when the DIMM has a second number of memory devices B=X2×Y2, then either X1 is less than X2, or Y1 is less than Y2.

Abstract: A Dual In-Line Memory Module (DIMM) includes a plurality of memory devices mounted on a circuit board of the DIMM. The memory devices are arranged to be accessed via at least two memory channels. The DIMM further includes an array of surface contact connections. Each surface contact connection is configured to be engaged with an associated contact element of a z-axis compression connector. The array of surface contact connections are arranged to conduct signals for the memory channels. The memory devices are placed upon the memory circuit board in an array of X rows of memory devices and Y columns of memory devices, where X and Y are integers. When the DIMM has a first number of the memory devices A=X1×Y1 that is less than when the DIMM has a second number of memory devices B=X2×Y2, then either X1 is less than X2, or Y1 is less than Y2.

Abstract: An information handling system includes a first z-axis compression connector, a first dual in-line memory module (DIMM), a second z-axis compression connector, a second DIMM, and a printed circuit board. A first side of the first compression connector is affixed to the printed circuit board. A first surface of a first memory circuit board of the first DIMM is affixed to a second side of the compression connector. A first side of the second compression connector is affixed to a second side of the first memory circuit board. A first side of a second memory circuit board of the second DIMM is affixed to a second side of the second compression connector. The first compression connector has a first depth, and the second compression connector has a second depth that is different from the first depth.

Abstract: A dual in-line memory module (DIMM) includes memory devices arranged to be accessed via at least one memory channel. The DIMM further includes an array of surface contact connections each configured to be engaged with an associated contact element of a z-axis compression connector. The array of surface contact connections are arranged to conduct signals for the memory channels.

Abstract: An information handling system for interacting with a peripheral interaction device having a plurality of conductive pads comprising a display screen having a touch screen including a touch sensor device that detects contact by a polymer conductor interface device assembly having a plurality of conductive pads, a processor executing instructions for a peripheral interaction device degradation management system that determines whether there is degradation in the touch signal response of at least one conductive pad of the polymer conductor interface device assembly below a degradation threshold signal level; and the processor adjusting drive signal voltages if a touch signal response falls below the degradation threshold signal level.

Abstract: An information handling system for interacting with a peripheral interaction device having a plurality of conductive pads comprising a display screen having a touch screen including a touch sensor device that detects contact by a polymer conductor interface device assembly having a plurality of conductive pads, a processor executing instructions for a peripheral interaction device degradation management system that determines whether there is degradation in the touch signal response of at least one conductive pad of the polymer conductor interface device assembly below a degradation threshold signal level; and the processor adjusting drive signal voltages if a touch signal response falls below the degradation threshold signal level.