Abstract: An apparatus designed for the testing of micro-machined torsional mirrors at the wafer level is described. A control station is coupled to an electro-optic assembly that has been designed for the purpose of testing mirrors. Three standard probes are coupled to the electro-optic probe assembly to provide electrical connections to a particular mirror of a wafer under test. Optical components are coupled to the electro-optic probe to deliver laser light to a deflectable plate portion of the mirror. Displacement of the reflected laser light spot is detected as the mirror plate is vectored and this displacement is compared to specifications such that the mirror under test can be either accepted or rejected.